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1.发明申请公开(公告)号：US20160145447A1
公开(公告)日：2016-05-26
申请号：US14903888
申请日：2014-07-09
摘要： A plated polymer component is disclosed. The plated polymer component may comprise a polymer support, a metal plating deposited on a surface of the polymer support, and at least one flame-retardant additive included in the polymer support. In another aspect, the plated polymer component may comprise a polymer substrate, a metal plating deposited on a surface of the polymer substrate, and a temperature-indicating coating applied to at least one of of the polymer substrate.
摘要翻译： 公开了镀覆的聚合物组分。 镀覆的聚合物组分可以包含聚合物载体，沉积在聚合物载体的表面上的金属电镀以及包含在聚合物载体中的至少一种阻燃添加剂。 在另一方面，电镀聚合物组分可以包括聚合物基底，沉积在聚合物基底的表面上的金属电镀，以及施加到聚合物基底中的至少一个的温度指示涂层。
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公开(公告)号：US20160369419A1
公开(公告)日：2016-12-22
申请号：US14903866
申请日：2014-07-09
CPC分类号： C25D5/56 , B05D5/00 , B05D7/02 , B22C7/023 , B22C9/043 , B22C9/10 , B22F1/004 , B28B1/24 , B28B7/342 , B28B11/04 , B28B11/243 , B32B3/263 , B32B7/12 , B32B15/04 , B32B15/08 , B32B15/20 , B32B37/12 , B32B37/1284 , B32B37/14 , B32B2255/10 , B32B2307/202 , B32B2307/554 , B32B2603/00 , B33Y10/00 , B33Y80/00 , B62D35/00 , C04B35/76 , C04B35/806 , C09D5/26 , C23C14/20 , C23C16/06 , C23C18/1633 , C23C18/165 , C23C18/2013 , C23C18/22 , C23C18/31 , C23C26/00 , C23C28/02 , C25D3/02 , C25D3/38 , C25D3/46 , C25D5/48 , C25D9/04 , C25D11/20 , F01D5/00 , F01D5/147 , F01D5/187 , F01D5/284 , F01D5/288 , F01D9/02 , F01D9/041 , F01D11/08 , F01D25/005 , F04D29/023 , F04D29/324 , F04D29/542 , F05D2220/32 , F05D2230/10 , F05D2230/22 , F05D2230/30 , F05D2230/312 , F05D2230/314 , F05D2240/122 , F05D2240/304 , F05D2300/10 , F05D2300/11 , F05D2300/121 , F05D2300/132 , F05D2300/133 , F05D2300/1616 , F05D2300/171 , F05D2300/177 , F05D2300/20 , F05D2300/30 , F05D2300/44 , F05D2300/501 , F05D2300/603 , F05D2300/611 , F05D2300/614 , F42B10/02
摘要： A plated polymer component is disclosed. The plated polymer component may comprise a polymer substrate having an outer surface, and a metal plating deposited on the outer surface of the polymer substrate. The plated polymer component may further comprise an adhesion promoter at an interface between the polymer substrate and the metal plating.
摘要翻译： 公开了镀覆的聚合物组分。 镀覆的聚合物组分可以包括具有外表面的聚合物基材和沉积在聚合物基材的外表面上的金属电镀。 镀覆的聚合物组分还可以在聚合物基底和金属电镀之间的界面处包含粘合促进剂。
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公开(公告)号：US20160160353A1
公开(公告)日：2016-06-09
申请号：US14903861
申请日：2014-07-09
CPC分类号： C25D5/56 , B05D5/00 , B05D7/02 , B22C7/023 , B22C9/043 , B22C9/10 , B28B1/24 , B28B7/342 , B28B11/04 , B28B11/243 , B32B3/263 , B32B7/12 , B32B15/04 , B32B15/08 , B32B15/20 , B32B37/12 , B32B37/1284 , B32B37/14 , B32B2255/10 , B32B2307/202 , B32B2307/554 , B32B2603/00 , B33Y10/00 , B33Y80/00 , B62D35/00 , B64C39/024 , B64C39/028 , B64C2201/10 , C04B35/76 , C04B35/806 , C09D5/26 , C23C14/20 , C23C16/06 , C23C18/1633 , C23C18/165 , C23C18/2013 , C23C18/22 , C23C18/31 , C23C26/00 , C23C28/02 , C25D3/02 , C25D3/38 , C25D3/46 , C25D5/48 , C25D9/04 , C25D11/20 , F01D5/00 , F01D5/147 , F01D5/187 , F01D5/284 , F01D5/288 , F01D9/02 , F01D9/041 , F01D11/08 , F01D25/005 , F04D29/023 , F04D29/324 , F04D29/542 , F05D2220/32 , F05D2230/10 , F05D2230/22 , F05D2230/30 , F05D2230/312 , F05D2230/314 , F05D2240/122 , F05D2240/304 , F05D2300/10 , F05D2300/11 , F05D2300/121 , F05D2300/132 , F05D2300/133 , F05D2300/1616 , F05D2300/171 , F05D2300/177 , F05D2300/20 , F05D2300/30 , F05D2300/44 , F05D2300/501 , F05D2300/603 , F05D2300/611 , F05D2300/614 , F42B10/02
摘要： A plated polymer component is disclosed. The plated polymer component may comprise a polymer substrate having an outer surface, a metal plating attached to the outer surface of the polymer substrate, and at least one interlocking feature connecting the polymer substrate and the metal plating. The interlocking feature may improve the interfacial bond strength between the polymer substrate and the metal plating.
摘要翻译： 公开了镀覆的聚合物组分。 镀覆的聚合物组分可以包括具有外表面的聚合物基材，附着到聚合物基材的外表面的金属电镀以及连接聚合物基材和金属电镀的至少一个互锁特征。 互锁特征可以改善聚合物基材和金属电镀之间的界面粘结强度。
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4.发明申请公开(公告)号：US20160158964A1
公开(公告)日：2016-06-09
申请号：US14903903
申请日：2014-07-09
IPC分类号： B28B7/34 , B28B11/04 , B28B11/24 , F01D11/08 , C04B35/76 , F01D5/28 , F01D5/18 , B28B1/24 , C04B35/80
CPC分类号： C25D5/56 , B05D5/00 , B05D7/02 , B22C7/023 , B22C9/043 , B22C9/10 , B28B1/24 , B28B7/342 , B28B11/04 , B28B11/243 , B32B3/263 , B32B7/12 , B32B15/04 , B32B15/08 , B32B15/20 , B32B37/12 , B32B37/1284 , B32B37/14 , B32B2255/10 , B32B2307/202 , B32B2307/554 , B32B2603/00 , B33Y10/00 , B33Y80/00 , B62D35/00 , B64C39/024 , B64C39/028 , B64C2201/10 , C04B35/76 , C04B35/806 , C09D5/26 , C23C14/20 , C23C16/06 , C23C18/1633 , C23C18/165 , C23C18/2013 , C23C18/22 , C23C18/31 , C23C26/00 , C23C28/02 , C25D3/02 , C25D3/38 , C25D3/46 , C25D5/48 , C25D9/04 , C25D11/20 , F01D5/00 , F01D5/147 , F01D5/187 , F01D5/284 , F01D5/288 , F01D9/02 , F01D9/041 , F01D11/08 , F01D25/005 , F04D29/324 , F04D29/542 , F05D2220/32 , F05D2230/10 , F05D2230/22 , F05D2230/30 , F05D2230/312 , F05D2230/314 , F05D2240/122 , F05D2240/304 , F05D2300/10 , F05D2300/11 , F05D2300/121 , F05D2300/132 , F05D2300/133 , F05D2300/1616 , F05D2300/171 , F05D2300/177 , F05D2300/20 , F05D2300/30 , F05D2300/44 , F05D2300/501 , F05D2300/603 , F05D2300/611 , F05D2300/614 , F42B10/02
摘要： A method for fabricating a ceramic component is disclosed. The method may comprise: 1) forming a polymer template having a shape that is an inverse of a shape of the ceramic component, 2) placing the polymer template in a mold; 3) injecting the polymer template with a ceramic slurry, 4) firing the ceramic slurry at a temperature to produce a green body, and 5) sintering the green body at an elevated temperature to provide the ceramic component.
摘要翻译： 公开了一种制造陶瓷部件的方法。 该方法可以包括：1）形成具有与陶瓷组分形状相反的形状的聚合物模板，2）将聚合物模板放置在模具中; 3）用陶瓷浆料注入聚合物模板，4）在一温度下烧制陶瓷浆料以产生生坯，和5）在升高的温度下烧结生坯以提供陶瓷组分。
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