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    Temperature stabilitized MEMS
    1.
    发明授权
    Temperature stabilitized MEMS 有权
    温度稳定的MEMS

    公开(公告)号：US08569808B1

    公开(公告)日：2013-10-29

    申请号：US13441134

    申请日：2012-04-06

    Applicant: Tung-Tsun Chen ,  Chia-Hua Chu ,  Chung-Hsien Lin ,  Jui-Cheng Huang

    Inventor： Tung-Tsun Chen ,  Chia-Hua Chu ,  Chung-Hsien Lin ,  Jui-Cheng Huang

    IPC: H01L29/66

    CPC classification number: H01L23/34 ,  B81B7/0096 ,  B81B2201/0278 ,  B81C1/0023 ,  H01L23/345 ,  H01L27/0629 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor device with temperature control system. Embodiments of the device may include a MEMS chip including a first heater with a dedicated first temperature control loop and a CMOS chip including a second heater with a dedicated second temperature control loop. Each control loop may have a dedicated temperature sensor for controlling the thermal output of each heater. The first heater and sensor are disposed proximate to a MEMS device in the MEMS chip for direct heating thereof. The temperature of the MEMS chip and CMOS chip are independently controllable of each other via the temperature control loops.

    Abstract translation: 具有温度控制系统的半导体器件。 该装置的实施例可以包括包括具有专用第一温度控制回路的第一加热器和包括具有专用第二温度控制回路的第二加热器的CMOS芯片的MEMS芯片。 每个控制回路可以具有用于控制每个加热器的热输出的专用温度传感器。 第一加热器和传感器靠近MEMS芯片中的MEMS器件设置，用于直接加热MEMS芯片。 MEMS芯片和CMOS芯片的温度可以通过温度控制回路彼此独立控制。

    MEMS vacuum level monitor in sealed package
    2.
    发明授权
    MEMS vacuum level monitor in sealed package 有权
    MEMS真空度监测仪在密封包装中

    公开(公告)号：US08887573B2

    公开(公告)日：2014-11-18

    申请号：US13401134

    申请日：2012-02-21

    Applicant: Tung-Tsun Chen ,  Jui-Cheng Huang ,  Chung-Hsien Lin

    Inventor： Tung-Tsun Chen ,  Jui-Cheng Huang ,  Chung-Hsien Lin

    IPC: G01L11/00 ,  G01L13/02

    CPC classification number: G01L21/22 ,  B81C99/0045 ,  H01L27/0688

    Abstract: A vacuum sensor for sensing vacuum in a sealed enclosure is provided. The sealed enclosure includes active MEMS devices desired to be maintained in vacuum conditions. The vacuum sensor includes a motion beam anchored to an internal surface in the sealed enclosure. A driving electrode is disposed beneath the motion beam and a bias is supplied to cause the motion beam to deflect through electromotive force. A sensing electrode is also provided and detects capacitance between the sensing electrode disposed on the internal surface, and the motion beam. Capacitance changes as the gap between the motion beam and the sensing electrode changes. The amount of deflection is determined by the vacuum level in the sealed enclosure. The vacuum level in the sealed enclosure is thereby sensed by the sensing electrode.

    Abstract translation: 提供了用于感测密封外壳中的真空的真空传感器。 密封的外壳包括希望保持在真空条件下的有源MEMS器件。 真空传感器包括锚定在密封外壳中的内表面的运动梁。 驱动电极设置在运动光束下方，并且提供偏压以使运动光束通过电动势偏转。 还提供感测电极并且检测设置在内表面上的感测电极与运动光束之间的电容。 电容随着运动光束与感应电极之间的间隙而变化。 偏转量由密封外壳中的真空度决定。 因此，密封外壳中的真空度由感测电极感测。

    MEMS modeling system and method
    3.
    发明授权
    MEMS modeling system and method 有权
    MEMS建模系统及方法

    公开(公告)号：US08762925B2

    公开(公告)日：2014-06-24

    申请号：US13029942

    申请日：2011-02-17

    Applicant: Tung-Tsun Chen ,  Yung-Chow Peng ,  Jui-Cheng Huang

    Inventor： Tung-Tsun Chen ,  Yung-Chow Peng ,  Jui-Cheng Huang

    IPC: G06F17/50

    CPC classification number: G06F17/5081 ,  G06F17/5022 ,  G06F17/5068 ,  G06F2217/02 ,  G06F2217/06

    Abstract: A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.

    Abstract translation: 公开了一种用于对微机电装置进行建模的系统和方法。 一个实施例包括将微机电设计分离成单独的区域并分别对分开的区域进行建模。 参数化参数或参数方程可用于分开的模型。 单独的模型可以集成到MEMS器件模型中。 可以对MEMS器件模型进行测试和校准，然后可以用于为微机电器件的新设计建模。

    MEMS Modeling System and Method
    4.
    发明申请
    MEMS Modeling System and Method 有权
    MEMS建模系统与方法

    公开(公告)号：US20120215497A1

    公开(公告)日：2012-08-23

    申请号：US13029942

    申请日：2011-02-17

    Applicant: Tung-Tsun Chen ,  Yung-Chow Peng ,  Jui-Cheng Huang

    Inventor： Tung-Tsun Chen ,  Yung-Chow Peng ,  Jui-Cheng Huang

    IPC: G06F17/50 ,  G06F17/10 ,  G06G7/62

    CPC classification number: G06F17/5081 ,  G06F17/5022 ,  G06F17/5068 ,  G06F2217/02 ,  G06F2217/06

    Abstract: A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.

    Abstract translation: 公开了一种用于对微机电装置进行建模的系统和方法。 一个实施例包括将微机电设计分离成单独的区域并分别对分开的区域进行建模。 参数化参数或参数方程可用于分开的模型。 单独的模型可以集成到MEMS器件模型中。 可以对MEMS器件模型进行测试和校准，然后可以用于为微机电器件的新设计建模。

    Over-sampling digital-to-analog converter with variable sampling frequencies
    7.
    发明授权
    Over-sampling digital-to-analog converter with variable sampling frequencies 有权
    具有可变采样频率的过采样数模转换器

    公开(公告)号：US06911927B2

    公开(公告)日：2005-06-28

    申请号：US10310323

    申请日：2002-12-05

    Applicant: Wen-Chi Wang ,  Shih-Yu Ku ,  Jui-Cheng Huang ,  Yi-Shu Chang

    Inventor： Wen-Chi Wang ,  Shih-Yu Ku ,  Jui-Cheng Huang ,  Yi-Shu Chang

    IPC: H03M3/00

    CPC classification number: H03M3/50

    Abstract: The present invention offers an over-sampling digital-to-analog converter with variable sampling frequencies to process input signals of variable sampling frequencies. The over-sampling digital-to-analog converter comprises an expander, which expands said input signals with a fixed rate of M to produce over-sampling signals; a digital low-pass filter, which filters out high-frequency ingredients of over-sampling signals and then outputs data with a first rate; a data buffer, which receives the outputted data by said digital low-pass filter with the first rate and outputs the data with a second rate; a modulator, which reads data in said data buffer with the second rate and modulates the data; a digital-to-analog converter, which converts the modulated data to analog signals; and an analog low-pass filter, which filters out high-frequency ingredients of said analog signals for producing output signals. No matter how the sampling frequency of the input signals is, due to reading rates of the modulator are the same, the over-sampling digital-to-analog converter ensures that noise is mostly distributed in the high-frequency band.

    Abstract translation: 本发明提供具有可变采样频率的过采样数模转换器来处理可变采样频率的输入信号。 过采样数模转换器包括扩展器，其以固定速率M扩展所述输入信号以产生过采样信号; 数字低通滤波器，滤除过采样信号的高频成分，然后以第一速率输出数据; 数据缓冲器，其以所述第一速率由所述数字低通滤波器接收输出的数据，并以第二速率输出数据; 调制器，以第二速率读取所述数据缓冲器中的数据并调制数据; 数模转换器，其将调制数据转换为模拟信号; 以及模拟低通滤波器，其滤除所述模拟信号的高频成分以产生输出信号。 无论输入信号的采样频率如何，由于调制器的读取速率相同，过采样数模转换器可确保噪声主要分布在高频段。

    Thermal Sensor with Second-Order Temperature Curvature Correction
    9.
    发明申请
    Thermal Sensor with Second-Order Temperature Curvature Correction 有权
    具有二阶温度曲率校正的热传感器

    公开(公告)号：US20140092939A1

    公开(公告)日：2014-04-03

    申请号：US13632498

    申请日：2012-10-01

    Applicant: Ching-Ho Chang ,  Jui-Cheng Huang ,  Yung-Chow Peng

    Inventor： Ching-Ho Chang ,  Jui-Cheng Huang ,  Yung-Chow Peng

    IPC: G01K7/01 ,  H01L23/544

    CPC classification number: G01K7/01 ,  G01K15/005

    Abstract: Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.

    Abstract translation: 本公开的一些实施例涉及具有检测一个或多个集成芯片的温度的热传感器的堆叠集成芯片结构。 在一些实施例中，堆叠集成芯片结构具有位于插入器晶片上的主集成芯片和次集成芯片。 主集成芯片具有产生偏置电流的参考电压源。 次级集成芯片具有接收偏置电流的第二热二极管，并且基于此产生第二热感测电压和与次级集成芯片的温度成比例的第二参考电压。 基于与第二热感测电压和参考电压的比较，主集成芯片内的数字热传感器确定二次集成芯片的温度。

    Small area high performance cell-based thermal diode
    10.
    发明授权
    Small area high performance cell-based thermal diode 有权
    小面积高性能基于电池的热二极管

    公开(公告)号：US09383264B2

    公开(公告)日：2016-07-05

    申请号：US13428549

    申请日：2012-03-23

    Applicant: Yung-Chow Peng ,  Ching-Ho Chang ,  Jui-Cheng Huang

    Inventor： Yung-Chow Peng ,  Ching-Ho Chang ,  Jui-Cheng Huang

    IPC: G01K7/00 ,  G01K7/01

    CPC classification number: G01K7/01 ,  Y10T307/76

    Abstract: A thermal sensing system includes a circuit having a layout including standard cells arranged in rows and columns. First and second current sources provide first and second currents, respectively. The thermal sensing system includes thermal sensing units, first and second switching modules, and an analog to digital converter (ADC). Each thermal sensing unit is configured to provide a voltage drop dependent on a temperature at that thermal sensing unit. The first switching module is configured to select one of the thermal sensing units. The second switching module includes at least one switch controllable by a control signal. The at least one switch is configured to selectively couple the thermal sensing units, based on the control signal, to one of the first and second current sources, via the first switching module. The ADC is configured to convert an analog voltage, provided by the selected thermal sensing unit, to a digital value.

    Abstract translation: 热感测系统包括具有布置成行和列的标准单元的布局的电路。 第一和第二电流源分别提供第一和第二电流。 热感测系统包括热敏单元，第一和第二开关模块以及模数转换器（ADC）。 每个热敏单元被配置成提供取决于该热感测单元处的温度的电压降。 第一开关模块被配置为选择一个热感测单元。 第二开关模块包括可由控制信号控制的至少一个开关。 所述至少一个开关被配置为经由所述第一开关模块将所述热感测单元基于所述控制信号选择性地耦合到所述第一和第二电流源之一。 ADC配置为将所选热敏单元提供的模拟电压转换为数字值。

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