Method for making thermoacoustic device

    公开(公告)号:US10251006B2

    公开(公告)日:2019-04-02

    申请号:US15636585

    申请日:2017-06-28

    IPC分类号: H04R31/00 H04R23/00 B82Y15/00

    摘要: A method for making thermoacoustic device includes following steps. A substrate having a first surface and second surface is provided. The first surface defines a plurality of grids. Grooves are formed on each of the plurality of grids. A first electrode and a second electrode are formed on each grid. The first electrode is spaced from the second electrode. One of the grooves is located between the first electrode and the second electrode. A number of carbon nanotube wires are applied on the first surface and electrically connected to the first electrode and the second electrode. A thermoacoustic device array is formed on the substrate by separating the carbon nanotube wires. A number of thermoacoustic device is formed by cutting the substrate according to the grids.

    Method for making strip shaped graphene layer
    8.
    发明授权
    Method for making strip shaped graphene layer 有权
    制造带状石墨烯层的方法

    公开(公告)号:US09216908B2

    公开(公告)日:2015-12-22

    申请号:US13730860

    申请日:2012-12-29

    IPC分类号: C01B31/04 B82Y30/00 B82Y40/00

    摘要: A method for making a strip shaped graphene layer includes the following steps. First, a graphene film is located on a surface of a substrate is provided. Second, a carbon nanotube structure is disposed on the graphene film. The carbon nanotube structure includes a plurality of carbon nanotube segments and a number of strip-shaped gaps between the adjacent carbon nanotube segments. Third, the graphene film exposed by the strip-shaped gaps is removed by applying a voltage to the carbon nanotube segments and heating the substrate.

    摘要翻译: 制造带状石墨烯层的方法包括以下步骤。 首先,提供石墨烯膜位于基板的表面上。 第二,碳纳米管结构设置在石墨烯膜上。 碳纳米管结构包括多个碳纳米管段和相邻碳纳米管段之间的多个带状间隙。 第三,通过向碳纳米管片段施加电压并加热衬底来去除由带状间隙暴露的石墨烯膜。

    Thermoacoustic device array
    9.
    发明授权
    Thermoacoustic device array 有权
    热声器件阵列

    公开(公告)号:US09088851B2

    公开(公告)日:2015-07-21

    申请号:US13931491

    申请日:2013-06-28

    IPC分类号: H04R23/00 H04R1/40

    摘要: A thermoacoustic device array includes a substrate and a plurality of thermoacoustic device units located on a surface of the substrate. The substrate defines a number of recesses on the surface, and the recesses are spaced from and parallel with each other. Each thermoacoustic device unit includes a sound wave generator, a first electrode and a second electrode. The first electrode and the second electrode are spaced from each other and electrically connected to the sound wave generator. The sound wave generator is located on the surface and suspended over the recesses. At least one of the recesses is located between the first electrode and the second electrode, and one portion of the sound wave generator that is between the first electrode and the second electrode is suspended over the at least one of the recesses.

    摘要翻译: 热声装置阵列包括基板和位于基板表面上的多个热声装置单元。 衬底在表面上限定了许多凹部,并且凹部彼此间隔开并且彼此平行。 每个热声装置单元包括声波发生器,第一电极和第二电极。 第一电极和第二电极彼此间隔开并电连接到声波发生器。 声波发生器位于表面并悬挂在凹槽上。 凹部中的至少一个位于第一电极和第二电极之间,并且位于第一电极和第二电极之间的声波发生器的一部分悬挂在至少一个凹部中。

    Earphone
    10.
    发明授权
    Earphone 有权
    耳机

    公开(公告)号:US08913765B2

    公开(公告)日:2014-12-16

    申请号:US13924821

    申请日:2013-06-24

    IPC分类号: H04R25/00

    摘要: An earphone includes a loudspeaker, a signal process, an audio signal input port, and a driving port. The loudspeaker includes a thermoacoustic device disposed in a housing. The signal processor is electrically connected to the loudspeaker to provide signal to the loudspeaker. The audio input port is electrically connected to the signal processor to provide audio signal. The driving port is electrically connected to the signal processor to provide driving signal. The thermoacoustic device includes a substrate, and the substrate defines a number of grooves, a sound wave generator is suspended on the grooves.

    摘要翻译: 耳机包括扬声器,信号处理,音频信号输入端口和驱动端口。 扬声器包括设置在壳体中的热声装置。 信号处理器电连接到扬声器以向扬声器提供信号。 音频输入端口电连接到信号处理器以提供音频信号。 驱动端口电连接到信号处理器以提供驱动信号。 热声装置包括基板,并且基板限定多个凹槽,声波发生器悬挂在凹槽上。