公开(公告)号：US20240181654A1

公开(公告)日：2024-06-06

申请号：US18530360

申请日：2023-12-06

Applicant: Tokyo Electron Limited

Inventor： Hideyuki OSADA ,  Koya HASHIMOTO

IPC: B25J15/00 ,  B25J11/00

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  B25J15/0019

Abstract: A pad for an end effector of a substrate transfer device is provided. The pad includes a base portion and a main portion. The main portion is in continuity with the base portion in a first direction. The main portion includes a lower surface, a first end, a second end, and an upper surface. The first end is one end of the main portion in a second direction perpendicular to the first direction. The second end is the other end of the main portion in the second direction. A distance between a reference surface including the lower surface and the upper surface increases from the first end to the second end. The upper surface has a maximum height at the second end with respect to the reference surface. The main portion has elasticity. The main portion forms a space below the second end.

公开(公告)号：US20230395421A1

公开(公告)日：2023-12-07

申请号：US18206106

申请日：2023-06-06

Applicant: Tokyo Electron Limited

Inventor： Masato OBARA ,  Gakuto TAKADA ,  Hideyuki OSADA ,  Genichi NANASAKI ,  Kento TOKAIRIN ,  Shuhei MATSUMOTO

IPC: H01L21/687

CPC classification number: H01L21/68735 ,  H01L21/68707

Abstract: There is a mounting pad for placing an object, comprising: a base; and an annular outer edge portion that is provided on one surface of the base, projects in a direction intersecting a surface direction of said one surface to surround an outer edge of said one surface, and is to be in contact with the object, wherein a thickness of the outer edge portion in at least one portion of the outer edge portion is different from a thickness of the outer edge portion in the other portions of outer edge portion.

公开(公告)号：US20230245871A1

公开(公告)日：2023-08-03

申请号：US18103609

申请日：2023-01-31

Applicant: Tokyo Electron Limited

Inventor： Hiroshi NAGAIKE ,  Naoki SATO ,  Masato OBARA ,  Hideyuki OSADA

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  B08B6/00 ,  B08B13/00 ,  B25J15/06

CPC classification number: H01J37/32871 ,  H01L21/67167 ,  H01L21/68707 ,  H01J37/32816 ,  B08B6/00 ,  B08B13/00 ,  B25J15/0616 ,  H01J2237/022 ,  H01J2237/184

Abstract: A substrate processing system includes a vacuum transfer module, a substrate processing module, an atmospheric transfer module, a load-lock module, at least one substrate transfer robot disposed in the vacuum transfer module and the atmospheric transfer module, and having at least one end effector, and a controller configured to control a particle removal operation. The particle removal operation includes transferring said at least one end effector in any one of the vacuum transfer module, the substrate processing module, the load-lock module, and the atmospheric transfer module in a state where at least one charging member that is charged is placed on said at least one end effector.

公开(公告)号：US20240178044A1

公开(公告)日：2024-05-30

申请号：US18524082

申请日：2023-11-30

Applicant: Tokyo Electron Limited

Inventor： Kento TOKAIRIN ,  Genichi NANASAKI ,  Hideyuki OSADA

IPC: H01L21/687 ,  B25J11/00 ,  B25J13/08 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J13/088 ,  H01L21/67259 ,  H01L21/67769

Abstract: Provided is a transfer system comprising a transfer robot configured to transfer an object to be transferred; a storage part configured to store the object to be transferred by the transfer robot; a state detection sensor configured to detect positional misalignment of the object to be transferred stored in the storage part; and a controller configured to control an operation of the transfer robot, wherein the transfer robot has a position detection sensor configured to detect a position of the object to be transferred placed in the storage part, and the controller controls determining, whether or not the misaligned object to be transferred is collectable based on the detection result of the state detection sensor; operating the transfer robot and detecting the position of the object to be transferred by the position detection sensor; and collecting the misaligned object to be transferred by the transfer robot.

公开(公告)号：US20220199435A1

公开(公告)日：2022-06-23

申请号：US17560215

申请日：2021-12-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Genichi NANASAKI ,  Daisuke HARA ,  Hideyuki OSADA ,  Hikaru NIHEI ,  Tatsuya MORIOKA ,  Akihiro MATSUI

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/677

Abstract: A substrate processing system is disclosed, comprising: a vacuum transfer module; a substrate processing module connected to the vacuum transfer module and configured to process a substrate in a depressurized environment; a load-lock module connected to the vacuum transfer module; at least one substrate cooling stage disposed in the load-lock module; at least one substrate transfer robot disposed the vacuum transfer module and having at least one end effector; and a controller configured to control a particle removal operation. The operation includes: cooling at least one dummy substrate placed on said at least one substrate cooling stage to a first temperature; and holding said at least one end effector in any one of a plurality of positions in the vacuum transfer module or the substrate processing module for a first time period in a state where at least one cooled dummy substrate is placed on said at least one end effector.

公开(公告)号：US20220080476A1

公开(公告)日：2022-03-17

申请号：US17478197

申请日：2021-09-17

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Hideyuki OSADA ,  Genichi NANASAKI ,  Seiichi KAISE ,  Masatomo KITA ,  Takashi TAKIZAWA ,  Eiji TAKAHASHI

IPC: B08B9/093 ,  H01J37/32 ,  B08B13/00

Abstract: A substrate processing apparatus is disclosed. The apparatus comprises a vacuum transfer chamber including a top surface, a bottom surface, and side surfaces between the top and the bottom surfaces, including a first side surface and a second side surface opposite to the first side surface; a transfer robot, disposed in the vacuum transfer chamber, for transfering a substrate; a load lock module connected to the first side surface; a pipe, connected to a purge gas supply source, for supplying a purge gas into the vacuum transfer chamber; one or more gas ports provided in the top surface in the vicinity of the second side surface and connected to the pipe; and one or more exhaust ports, provided in the bottom surface in the vicinity of the first side surface, to which an exhaust pump for exhausting the purge gas supplied into the vacuum transfer chamber is connected.