PIN GRID ARRAY ZERO INSERTION FORCE CONNECTORS CONFIGURABLE FOR SUPPORTING LARGE PIN COUNTS
    2.
    发明申请
    PIN GRID ARRAY ZERO INSERTION FORCE CONNECTORS CONFIGURABLE FOR SUPPORTING LARGE PIN COUNTS 有权
    PIN网格阵列插入力连接器可配置为支持大量PIN码

    公开(公告)号:US20080026627A1

    公开(公告)日:2008-01-31

    申请号:US11496153

    申请日:2006-07-31

    CPC classification number: H01R13/193 H05K7/1007

    Abstract: A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.

    Abstract translation: 包括多个子插座部件的PGA插座,当组合使用时形成较大的有效插座,包括配置成接收IC的相应引脚的多个孔。 PGA插座还包括多个接触构件,每个接触构件对应于相应的一个孔。 接触构件被构造成在孔的相应移动时可移动地接合IC的相应销,以便提供与其的电和机械接触。 每个子插座部件被构造成机械地接合其他子插座部件中的至少一个,使得每个子插座部件中的接触部件能够基本上同时电连接到IC的相应引脚。

    Connector drawer
    3.
    发明授权
    Connector drawer 有权
    连接器抽屉

    公开(公告)号:US07217144B1

    公开(公告)日:2007-05-15

    申请号:US11329632

    申请日:2006-01-11

    CPC classification number: H01R27/02 H01R13/73

    Abstract: An arrangement and a method of increasing the quantity of input and output connectors, which are available for the attachment to connection cables of electronic equipment. More particularly, the present invention relates to an arrangement, such as a connector drawer, which is adapted to be installed in a selectively retractable and extendable mode in a laptop computer and which provides for a versatile structure facilitating a elective increase in the quantity of input and output connectors as may be necessitated by specific utilization of the electronic equipment or laptop computers, particularly in conjunction with the connection therewith of auxiliary operating devices or components.

    Abstract translation: 一种增加输入和输出连接器的数量的装置和方法,其可用于连接到电子设备的连接电缆。 更具体地,本发明涉及一种诸如连接器抽屉的装置,其适于以笔记本电脑中的可选择性地伸缩和可延伸的方式安装,并且其提供通用结构,便于输入量的选择性增加 以及通过电子设备或膝上型计算机的特定利用可能需要的输出连接器,特别是与辅助操作装置或部件的连接。

    Non-contact measurement of surface profile
    5.
    发明授权
    Non-contact measurement of surface profile 失效
    非接触式测量表面轮廓

    公开(公告)号:US4349277A

    公开(公告)日:1982-09-14

    申请号:US158372

    申请日:1980-06-11

    CPC classification number: G01B11/2509

    Abstract: A parallax method of wavelength labeling is based on optical triangulation. A complementary color pattern projected onto the surface is characterized by a continuous variation of the power ratio of two wavelength bands, and the profile can be measured at all points in the field of view. Shifts of the wavelength bands on separate detector arrays correspond to profile deviations. A signal processor calculates a normalized signal that is independent of surface reflectivity and roughness variations; the phase shift of this signal yields depth data from which the surface profile can be mapped.

    Abstract translation: 波长标注的视差法基于光学三角测量。 投影到表面上的互补色图案的特征在于两个波段的功率比的连续变化,并且可以在视场中的所有点处测量轮廓。 分离的检测器阵列上的波段的移位对应于轮廓偏差。 信号处理器计算独立于表面反射率和粗糙度变化的归一化信号; 该信号的相移产生可以映射表面轮廓的深度数据。

    Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages
    6.
    发明授权
    Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages 失效
    直接水冷几种并行电路卡的装置和方法,每个包含几个芯片封装

    公开(公告)号:US08081473B2

    公开(公告)日:2011-12-20

    申请号:US12185520

    申请日:2008-08-04

    Abstract: A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.

    Abstract translation: 电子设备的冷却装置,系统等方法包括固定在布线基板上的多个发热电子器件。 多个传热组件各自包括散热器,并与制热电子设备热连通,用于将热量从发热电子设备传递到传热组件。 多个发热电子器件和各个传热组件位于具有重叠区域的布线基板上。 热导管与传热组件热连通。 热导管将导热流体循环通过其中的闭环,用于通过散热器将热量传递给来自传热组件的流体。 导热支撑结构支撑热导管,并且通过散热器与传热组件热连通,散热器将热量从支撑结构传递到热导管的流体。

    APPARATUS AND METHOD OF DIRECT WATER COOLING SEVERAL PARALLEL CIRCUIT CARDS EACH CONTAINING SEVERAL CHIP PACKAGES
    8.
    发明申请
    APPARATUS AND METHOD OF DIRECT WATER COOLING SEVERAL PARALLEL CIRCUIT CARDS EACH CONTAINING SEVERAL CHIP PACKAGES 失效
    直接水冷却装置和方法几个并行电路卡每个包含几个芯片包

    公开(公告)号:US20100025010A1

    公开(公告)日:2010-02-04

    申请号:US12185520

    申请日:2008-08-04

    Abstract: A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.

    Abstract translation: 电子设备的冷却装置,系统等方法包括固定在布线基板上的多个发热电子器件。 多个传热组件各自包括散热器并与用于将热量从发热电子器件传递到传热组件的发热电子器件热连通。多个发热电子器件和相应的传热组件位于布线 具有区域重叠的基板。 热导管与传热组件热连通。 热导管将导热流体循环通过其中的闭环,用于通过散热器将热量传递给来自传热组件的流体。 导热支撑结构支撑热导管,并且通过散热器与传热组件热连通,散热器将热量从支撑结构传递到热导管的流体。

    COINED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES SUCH AS DUAL IN-LINE MEMORY MODULES (DIMMs)
    9.
    发明申请
    COINED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES SUCH AS DUAL IN-LINE MEMORY MODULES (DIMMs) 有权
    用于封闭式加热制造装置(例如双列直插式存储器模块)(DIMM)的封装金属热源

    公开(公告)号:US20090303681A1

    公开(公告)日:2009-12-10

    申请号:US12133547

    申请日:2008-06-05

    CPC classification number: H01L23/4093 H01L23/367 H01L2924/0002 H01L2924/00

    Abstract: A heatsink structure and method for the cooling of closely spaced packaged heat-producing devices, such as dual-in-line memory modules (DIMMs). A folded sheet metal heatsink structure is provided which is constituted of a coined metallic material and which has a large plurality of waffle-shaped ridges extending therefrom constituting additional surface areas which are adapted to enable heat generated by hub chips to pass upwardly and then outwardly through waffle-like ridges and, thus, dissipated to the exterior, thereby imparting an improved degree of cooling to heat-producing components or devices.

    Abstract translation: 用于冷却紧密间隔的包装发热装置(例如双列直插存储器模块(DIMM))的散热器结构和方法。 提供折叠的金属板式散热器结构,其由精制的金属材料构成,并且具有从其构成的多个楔形形状的隆起脊,构成另外的表面区域,其适于使毂芯片产生的热量向上通过,然后向外通过 并且由此散发到外部,由此赋予发热部件或装置更好的冷却程度。

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