公开(公告)号：US20210077799A1

公开(公告)日：2021-03-18

申请号：US15733749

申请日：2018-03-21

申请人： Thomas Bold ,  RenovaCare Sciences Corp.

发明人： Thomas Bold ,  Frank Schubert ,  Jatinder S. Bhogal

IPC分类号： A61M35/00 ,  A61M39/10 ,  A61M5/32 ,  A61M5/31

摘要： The present invention provides a spray deposition system which comprises a syringe attachment device having a specific adaptor. The adaptor has at least three openings being in fluid connection with each other, wherein at least one first opening of the adaptor is connectable to a needle in a liquid-tight manner, at least one second opening of the adaptor is in fluid connection with surrounding air and at least one third opening of the adaptor is connected to a tube configured to deliver an air flow in a reversible and air-tight manner. Thereby, a connection to a needle is possible in a reversible and liquid-tight manner without having to pierce the tube of the system like in prior art solutions. This provokes that no tube material may clog the needle and no air may leak from the tube. Furthermore, an attachment of the needle to the spray deposition system may be performed faster and safer and alignment of the needle is facilitated. Finally, dulled needles may be employed which ensure a more homogeneous deposition of liquid from the needle.

公开(公告)号：US07863184B1

公开(公告)日：2011-01-04

申请号：US12456116

申请日：2009-06-11

申请人： Thomas Bold

发明人： Thomas Bold

IPC分类号： H01L21/00

CPC分类号： H01L23/53238 ,  H01L23/53223 ,  H01L23/53266 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05093 ,  H01L2224/05556 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19043

摘要： A bond pad structure has a first conductive layer and an anti-reflective coating layer disposed on the first conductive layer. The first conductive layer includes first and second portions (which could be formed by etching). Part of the first portion is exposed within a bond pad opening, and the second portion is electrically connected to an integrated circuit. The anti-reflective coating layer also includes first and second portions (which could be formed by etching). The first portion may be located near the bond pad opening, and the second portion may be located farther away from the bond pad opening. A second conductive layer electrically connects the first and second portions of the first conductive layer. In this way, the first portion of the anti-reflective coating layer may undergo oxidation without leading to oxidation of the second portion of the anti-reflective coating layer.

摘要翻译： 接合焊盘结构具有设置在第一导电层上的第一导电层和抗反射涂层。 第一导电层包括第一和第二部分（其可以通过蚀刻形成）。 第一部分的一部分暴露在接合焊盘开口内，并且第二部分电连接到集成电路。 抗反射涂层还包括第一和第二部分（其可以通过蚀刻形成）。 第一部分可以位于接合焊盘开口附近，并且第二部分可以位于离焊盘开口更远的位置。 第二导电层电连接第一导电层的第一和第二部分。 以这种方式，抗反射涂层的第一部分可以经历氧化，而不会导致抗反射涂层的第二部分的氧化。

公开(公告)号：US07585775B1

公开(公告)日：2009-09-08

申请号：US11285702

申请日：2005-11-21

申请人： Thomas Bold ,  Victor Torres ,  Rodney Hill

发明人： Thomas Bold ,  Victor Torres ,  Rodney Hill

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/32136

摘要： A method is disclosed for applying a plasma etch process to facet a masking layer in a semiconductor device by creating sloped surfaces in the masking layer. The masking layer is plasma etched with a plasma that has a high sputter etch component. The plasma etch process removes material from vertical edges of the masking layer to form a sloped surface at each vertical edge of the masking layer. A layer of conductive material is then applied to the masking layer. When the layer of conductive material is subsequently removed by an overetch process the sloped profile of the masking layer facilitates the removal of stringers of conductive material without using an excessively lengthy overetch.

摘要翻译： 公开了一种用于施加等离子体蚀刻工艺以通过在掩模层中产生倾斜表面来在半导体器件中刻蚀掩模层的方法。 用等离子体对具有高溅射蚀刻成分的等离子体进行等离子体蚀刻。 等离子体蚀刻工艺从掩模层的垂直边缘去除材料，以在掩模层的每个垂直边缘处形成倾斜表面。 然后将一层导电材料施加到掩蔽层。 当导电材料层随后通过过蚀刻工艺去除时，掩模层的倾斜轮廓有助于去除导电材料的桁条，而不使用过长的过蚀刻。

公开(公告)号：US07557455B1

公开(公告)日：2009-07-07

申请号：US11711384

申请日：2007-02-27

申请人： Thomas Bold

发明人： Thomas Bold

IPC分类号： H01L23/525 ,  H01L23/58 ,  H01L23/52 ,  H01L27/105

CPC分类号： H01L23/53238 ,  H01L23/53223 ,  H01L23/53266 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05093 ,  H01L2224/05556 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19043

摘要： A bond pad structure has a first conductive layer and an anti-reflective coating layer disposed on the first conductive layer. The first conductive layer includes first and second portions (which could be formed by etching). Part of the first portion is exposed within a bond pad opening, and the second portion is electrically connected to an integrated circuit. The anti-reflective coating layer also includes first and second portions (which could be formed by etching). The first portion may be located near the bond pad opening, and the second portion may be located farther away from the bond pad opening. A second conductive layer electrically connects the first and second portions of the first conductive layer. In this way, the first portion of the anti-reflective coating layer may undergo oxidation without leading to oxidation of the second portion of the anti-reflective coating layer.

摘要翻译： 接合焊盘结构具有设置在第一导电层上的第一导电层和抗反射涂层。 第一导电层包括第一和第二部分（其可以通过蚀刻形成）。 第一部分的一部分暴露在接合焊盘开口内，并且第二部分电连接到集成电路。 抗反射涂层还包括第一和第二部分（其可以通过蚀刻形成）。 第一部分可以位于接合焊盘开口附近，并且第二部分可以位于距离焊盘开口更远的位置。 第二导电层电连接第一导电层的第一和第二部分。 以这种方式，抗反射涂层的第一部分可以经历氧化，而不会导致抗反射涂层的第二部分的氧化。