SYSTEMS AND METHODS FOR SAFE AND FLEXIBLE BATTERIES

    公开(公告)号:US20230378573A1

    公开(公告)日:2023-11-23

    申请号:US18322237

    申请日:2023-05-23

    CPC classification number: H01M50/105 H01M50/178 H01M50/131 H01M50/121

    Abstract: Disclosed herein is an electronic device encapsulation including a non-permeable coating and at least one pair of leads coupled to an electronic device protruding from the non-permeable coating. Also disclosed herein is a method of encapsulating an electronic device including attaching at least a pair of electric leads to the device, coating the device and a portion of each lead with a non-permeable coating, and curing the non-permeable coating. Further disclosed is an encapsulated system including a device, at least one pair of leads coupled to the device configured to extend from the device and attach to an exterior system, and a non-permeable coating configured to provide a vapor barrier surrounding the device and to provide an exposed portion of the pair of leads.

    Parallel Clock Salinity Sensor
    4.
    发明申请

    公开(公告)号:US20220404305A1

    公开(公告)日:2022-12-22

    申请号:US17671809

    申请日:2022-02-15

    Abstract: A sensor for measuring ocean water salinity is described. The sensor may include a measurement clock circuit, a control clock circuit, and a comparator circuit. The measurement clock circuit, having an output that varies with salinity of a fluid, may have a first circuit architecture that includes a capacitive gap assembly that permits a fluid to flow into a gap between two electrodes of the capacitive gap assembly. The control clock circuit, having an output that does not vary with salinity of the fluid, may have a second circuit architecture comprising a capacitor. The comparator circuit may be configured to compare the controlled clock output to the measured clock output over a duration of time to determine a salinity measurement of the fluid. The first circuit architecture may differ from the second circuit architecture in that an electrically connected position of the capacitive gap assembly within the first circuit architecture is the electrically connected position of the capacitor within the second circuit architecture.

Patent Agency Ranking