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公开(公告)号：US11462460B2
公开(公告)日：2022-10-04
申请号：US16433099
申请日：2019-06-06
Applicant: The Boeing Company
Inventor： Young Kyu Song , Kyu-Pyung Hwang
IPC: H01L23/488 , H01L23/66 , H01L23/538 , H01L23/00
Abstract: An electrical module assembly is provided. The electrical module assembly includes a circuit board with a first circuit-board surface and a second circuit-board surface defining a cavity, and an antenna disposed on the first circuit-board surface. The electrical module assembly also includes a wafer-level packaged (WLP) die embedded in the cavity. The WLP die has a first WLP die surface and a second WLP die surface. The second WLP die surface has electrical contacts thereon. The circuit board includes vias that extend from the antenna through the circuit board to the first WLP die surface to interconnect the antenna and the WLP die. The electrical module assembly further includes a second circuit board coupled to the second circuit-board surface, and coupled to the WLP die at the electrical contacts on the second WLP die surface of the WLP die.
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公开(公告)号：US11038277B2
公开(公告)日：2021-06-15
申请号：US16521477
申请日：2019-07-24
Applicant: The Boeing Company
Inventor： Charles Muwonge , Kyu-Pyung Hwang , Terry Vogler , Young Kyu Song
Abstract: In one or more embodiments, a high impedance surface (HIS) apparatus comprises a core; a first set of conducting pads, where a first side of the first set of conducting pads is connected to a first side of the core; and a second set of conducting pads, where a first side of the second set of conducting pads is connected to a second side of the core. The apparatus further comprises a plurality of chip inductors, where at least a portion of the chip inductors are connected to a second side of the first set of conducting pads; and a plurality of chip capacitors, where at least a portion of the chip capacitors are connected to a second side of the second set of conducting pads.
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3.发明授权公开(公告)号：US10980122B2
公开(公告)日：2021-04-13
申请号：US16838645
申请日：2020-04-02
Applicant: The Boeing Company
Inventor： Kyu-Pyung Hwang , Young Kyu Song
Abstract: A resistor assembly is disclosed and comprises a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a thin film resistor electrically coupled to the first conductive trace. The first conductive trace, the second conductive trace, the plurality of trimming bridges, and the thin film resistor are all part of a surface mounted layer of the resistor assembly. The plurality of trimming bridges are each removable to increase a resistance of the thin film resistor.
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4.发明申请公开(公告)号：US20210068256A1
公开(公告)日：2021-03-04
申请号：US16838645
申请日：2020-04-02
Applicant: The Boeing Company
Inventor： Kyu-Pyung Hwang , Young Kyu Song
Abstract: A resistor assembly is disclosed and comprises a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a thin film resistor electrically coupled to the first conductive trace. The first conductive trace, the second conductive trace, the plurality of trimming bridges, and the thin film resistor are all part of a surface mounted layer of the resistor assembly. The plurality of trimming bridges are each removable to increase a resistance of the thin film resistor.
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公开(公告)号：US11378605B2
公开(公告)日：2022-07-05
申请号：US16742565
申请日：2020-01-14
Applicant: The Boeing Company
Inventor： Kyu-Pyung Hwang , Young Kyu Song
Abstract: A method for modeling electromagnetic characteristics of a vehicle having electrical components comprising generating a parallel plate waveguide model and inserting a vehicle model for the vehicle within the parallel plate waveguide model. The vehicle model has a plurality of lumped ports corresponding to on-board electrical components. The method executes an electromagnetic field solver on a first and second waveguide ports and the lumped ports and determines a scaling factor between a first power level configured to excite the first and/or second waveguide ports and a second power level configured to excite the lumped ports. The electromagnetic field solver runs on the first and second waveguide and lumped ports, producing a first output data and the method produces a scattering parameter (S-parameter) model for the vehicle from the first output data that includes a plurality of S-parameter ports.
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Patent Agency Ranking
公开(公告)号：US11071213B2
公开(公告)日：2021-07-20
申请号：US16521505
申请日：2019-07-24
Applicant: The Boeing Company
Inventor： Charles Muwonge , Kyu-Pyung Hwang , Terry Vogler , Young Kyu Song
Abstract: In one or more embodiments, a method of manufacturing a high impedance surface (HIS) apparatus comprises patterning a first conducting layer on a core to form a first set of conducting pads, and patterning a second conducting layer on the core to form a second set of conducting pads. The method further comprises applying solder paste to each of the conducting pads of the second set of conducting pads. Also, the method comprises placing chip capacitors on the solder paste on the second set of conducting pads. In addition, the method comprises applying underfill between the chip capacitors. Also, the method comprises applying solder paste to each of the conducting pads of the first set of conducting pads. In addition, the method comprises placing chip inductors on the solder paste on the first set of conducting pads. Further, the method comprises applying underfill between the chip inductors.
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公开(公告)号：US20210029836A1
公开(公告)日：2021-01-28
申请号：US16521505
申请日：2019-07-24
Applicant: The Boeing Company
Inventor： Charles Muwonge , Kyu-Pyung Hwang , Terry Vogler , Young Kyu Song
Abstract: In one or more embodiments, a method of manufacturing a high impedance surface (HIS) apparatus comprises patterning a first conducting layer on a core to form a first set of conducting pads, and patterning a second conducting layer on the core to form a second set of conducting pads. The method further comprises applying solder paste to each of the conducting pads of the second set of conducting pads. Also, the method comprises placing chip capacitors on the solder paste on the second set of conducting pads. In addition, the method comprises applying underfill between the chip capacitors. Also, the method comprises applying solder paste to each of the conducting pads of the first set of conducting pads. In addition, the method comprises placing chip inductors on the solder paste on the first set of conducting pads. Further, the method comprises applying underfill between the chip inductors.
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公开(公告)号：US20210028550A1
公开(公告)日：2021-01-28
申请号：US16521477
申请日：2019-07-24
Applicant: The Boeing Company
Inventor： Charles Muwonge , Kyu-Pyung Hwang , Terry Vogler , Young Kyu Song
Abstract: In one or more embodiments, a high impedance surface (HIS) apparatus comprises a core; a first set of conducting pads, where a first side of the first set of conducting pads is connected to a first side of the core; and a second set of conducting pads, where a first side of the second set of conducting pads is connected to a second side of the core. The apparatus further comprises a plurality of chip inductors, where at least a portion of the chip inductors are connected to a second side of the first set of conducting pads; and a plurality of chip capacitors, where at least a portion of the chip capacitors are connected to a second side of the second set of conducting pads.
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公开(公告)号：US20200147424A1
公开(公告)日：2020-05-14
申请号：US16190247
申请日：2018-11-14
Applicant: THE BOEING COMPANY
Inventor： Kyu-Pyung Hwang , Young Kyu Song
Abstract: A fire suppressing device including a torus container with a main body defining an interior chamber and a discharge port, the interior chamber configured to receive and retain metal organic framework materials. The fire suppressing device also includes an inductor coil extending through the interior chamber of the torus container and surrounding the metal organic framework materials. The inductor coil is configured to heat the metal organic framework materials to form a fire suppressing substance that is conveyed through the discharge port.
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公开(公告)号：US11191983B2
公开(公告)日：2021-12-07
申请号：US16190247
申请日：2018-11-14
Applicant: THE BOEING COMPANY
Inventor： Kyu-Pyung Hwang , Young Kyu Song
Abstract: A fire suppressing device including a torus container with a main body defining an interior chamber and a discharge port, the interior chamber configured to receive and retain metal organic framework materials. The fire suppressing device also includes an inductor coil extending through the interior chamber of the torus container and surrounding the metal organic framework materials. The inductor coil is configured to heat the metal organic framework materials to form a fire suppressing substance that is conveyed through the discharge port.
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