Abstract:
An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.
Abstract:
The present invention provides a semiconductor device capable of realizing power saving and improvement in reliability or reduction in area. A semiconductor device includes: a power switch connecting an internal power supply in which power is not shut down and an internal power supply in which power is shut down; and an internal voltage determining circuit for determining voltage of the internal power supply in which power is shut down. Voltage of the internal power supply in which power is shut down is generated from voltage of an external power supply by using a regulator circuit. When the power of the internal power supply is interrupted, the power switch is turned off, the regulator circuit is turned off, and an output of the regulator circuit is shorted to a ground potential. When the power of the internal power supply is resumed, the regulator circuit is turned on, shorting is cancelled, the increased voltage of the internal power supply is determined by the internal voltage determining circuit, operation of a circuit block is started, and the switch is turned on.
Abstract:
The present invention provides a technique for reducing current consumption in a reference voltage forming circuit without a significant increase in area while suppressing considerable degradative difference in reference voltage accuracy between a normal operation mode and a standby mode. In the standby mode, by using a clock signal fed from an oscillator circuit, the frequency-division control circuit produces an enable signal VREFON for determining ON/OFF states of the reference voltage generator circuit, the reference voltage forming circuit, and the capacitance charging regulator, and also produces a sampling/holding signal CHOLDSW for performing control so that a holding capacitor CH in a holding capacitance circuit is charged during an ON period of the reference voltage generator circuit, the reference voltage forming circuit, and the capacitance charging regulator, and so that any paths other than a leak current path are made unavailable to the holding capacitor CH during an OFF period thereof. Current consumption can be reduced significantly by intermittently turning ON/OFF the reference voltage generator circuit, the reference voltage forming circuit, and the capacitance charging regulator, each of which would otherwise consume a relatively large amount of current for operation thereof.
Abstract:
A semiconductor integrated circuit device which substantially reduces drop in a supply voltage generated by a regulator and ensures stable supply of a supply voltage with high efficiency and high accuracy. In the device, a memory power supply includes a plurality of transistors and an error amplifier. In the transistors, source pads and drain pads are alternately arranged in a row along one edge of a semiconductor chip in a peripheral area of the chip. Transistor gates are formed in parallel with the alternately arranged source pads and drain pads (so that the longitudinal direction of the gates is parallel to the direction of the arrangement of the source pads and drain pads). Consequently, the length of wirings coupled to drains and sources is shortened and the sheet resistance is decreased.
Abstract:
Improvement in the accuracy of a temperature sensor is aimed at, suppressing the number of the test temperature in a test process. The semiconductor device comprises a coefficient calculation unit which calculates up to the N-th order coefficient (N is an integer equal to or greater than one) of a correction function as an N-th order approximation of a characteristic function indicating correspondence relation of temperature data measured by a temperature sensor unit and temperature, based on N+1 pieces of the temperature data including a theoretical value at a predetermined temperature in the characteristic function and N measured values of the temperature data measured by the temperature sensor unit at N points of temperature; and a correction operation unit which generates data including information on temperature, by performing calculation using the correction function to which the coefficients calculated are applied, based on temperature data measured by the temperature sensor unit.
Abstract:
The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.
Abstract:
A semiconductor integrated circuit device which substantially reduces drop in a supply voltage generated by a regulator and ensures stable supply of a supply voltage with high efficiency and high accuracy. In the device, a memory power supply includes a plurality of transistors and an error amplifier. In the transistors, source pads and drain pads are alternately arranged in a row along one edge of a semiconductor chip in a peripheral area of the chip. Transistor gates are formed in parallel with the alternately arranged source pads and drain pads (so that the longitudinal direction of the gates is parallel to the direction of the arrangement of the source pads and drain pads). Consequently, the length of wirings coupled to drains and sources is shortened and the sheet resistance is decreased.