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1.发明授权Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon 有权树脂密封型功率半导体器件包括具有安装在其上的用于控制电路的所有电子部件的基板公开(公告)号：US06313520B1
公开(公告)日：2001-11-06
申请号：US09664341
申请日：2000-09-18
IPC分类号： H01L23495
CPC分类号： H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4911 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/014 , H01L2924/09701 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19104 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A resin-sealed power semiconductor device is provided. The thicknesses of a die pad (19) and a lead part (2) are made equal and as great as possible. A thick film substrate (8) is bonded with a bonding layer (20) onto a plurality of supporting inner leads (2AS) among first inner leads (2A1) positioned above the die pad (19). Patterns of a control circuit of power semiconductor elements (1) are formed as thick film patterns (10) on an upper surface of the substrate (8), and a control circuit element (IC) (9) and all electronic components (12) are mounted on the patterns (10) by soldering. The constituents (9, 12, 10, 8, 1, 2A1, 19, 2B1) are sealed in a sealing resin (5). The resin-sealed power semiconductor device improves noise immunity while conventionally effectively dissipating heat generated by the power semiconductor elements, and is designed to be adaptable to increase in functionality thereof.
摘要翻译： 提供树脂密封型功率半导体器件。 芯片焊盘（19）和引线部分（2）的厚度被制成相等且尽可能大。 在位于管芯焊盘（19）上方的第一内引线（2A1）中，将厚膜基板（8）与接合层（20）接合到多个支撑内引线（2AS）上。 功率半导体元件（1）的控制电路的图案在基板（8）的上表面上形成为厚膜图案（10），以及控制电路元件（IC）（9）和所有电子元件（12） 通过焊接安装在图案（10）上。 组分（9,12,10,8,1,2A1,19,2B1）密封在密封树脂（5）中。 树脂密封型功率半导体器件在传统上有效地消散由功率半导体元件产生的热量的同时，提高了抗噪声性，并且被设计成能够适应其功能性的增加。
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公开(公告)号：USD421969S
公开(公告)日：2000-03-28
申请号：US100732
申请日：1999-02-17
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公开(公告)号：USD428859S
公开(公告)日：2000-08-01
申请号：US106586
申请日：1999-06-15
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公开(公告)号：USD418485S
公开(公告)日：2000-01-04
申请号：US100730
申请日：1999-02-17
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公开(公告)号：US07656016B2
公开(公告)日：2010-02-02
申请号：US11295442
申请日：2005-12-07
IPC分类号： H01L23/02
CPC分类号： H01Q3/26 , H01L23/473 , H01L25/112 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： One of the aspects of the present invention is to provide a power semiconductor device, which includes at least one pair of power modules, each of which has a molding surface covered with molding resin and a radiating surface opposite to the molding surface. Also, the power semiconductor device includes a pair of radiating fins sandwiching the power modules such that the molding surfaces of the power modules contact each other and the radiating surfaces thereof each contact the radiating fins.
摘要翻译： 本发明的一个方面是提供一种功率半导体器件，其包括至少一对功率模块，每个功率模块具有被模制树脂覆盖的模制表面和与模制表面相对的辐射表面。 此外，功率半导体器件包括夹着功率模块的一对散热片，使得功率模块的模制表面彼此接触，并且其辐射表面各自接触散热片。
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公开(公告)号：US06787900B2
公开(公告)日：2004-09-07
申请号：US09534043
申请日：2000-03-24
IPC分类号： H01L2334
CPC分类号： H01L23/13 , H01L23/3121 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/05599 , H01L2224/45124 , H01L2224/48137 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/16195 , H01L2924/181 , H01L2924/19107 , H01L2924/3511 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module (18) includes a ring-shaped metal frame (13) having a bottom surface for contact with a top surface of an external heat sink (11) and serving as a mounting surface. The ring-shaped metal frame (13) has a flange (20) along an inner periphery thereof for engagement with an outer peripheral part of an insulating substrate (17) at a first main surface of a ceramic plate (1). The metal frame (13) is fastened to the external heat sink (11) by screws (12) or bonded to the external heat sink (11) with an adhesive. The flange (20) of the metal frame (13) fastened or bonded to the external heat sink (11) presses the outer peripheral part of the insulating substrate (17) toward the external heat sink (11). This pressing force holds the insulating substrate (17) in pressure contact with the external heat sink (11). The semiconductor module (18) avoids the problem of a decreasing pressing force resulting from deformation to ensure a satisfactory heat dissipating property over a long period of time.
摘要翻译： 半导体模块（18）包括具有用于与外部散热器（11）的顶表面接触并用作安装表面的底表面的环形金属框架（13）。 环形金属框架（13）沿其内周具有凸缘（20），用于与陶瓷板（1）的第一主表面处的绝缘基板（17）的外周部分接合。 金属框架（13）通过螺钉（12）固定在外部散热器（11）上，或者用粘合剂粘合到外部散热器（11）上。 紧固或接合到外部散热器（11）的金属框架（13）的凸缘（20）将绝缘基板（17）的外周部分朝向外部散热器（11）挤压。 该按压力使绝缘基板（17）与外部散热器（11）压力接触。 半导体模块（18）避免了由变形产生的压力减小的问题，以确保长时间的令人满意的散热性能。
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公开(公告)号：US06765285B2
公开(公告)日：2004-07-20
申请号：US10378840
申请日：2003-03-05
IPC分类号： H01L2504
CPC分类号： H01L25/115 , H01L23/473 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/13055 , H01L2924/181 , H01L2924/1815 , H01L2924/30107 , H01L2924/3025 , H05K7/20927 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A discrete semiconductor device is vertically sandwiched between an upper wall of a case body and a case bottom plate to be fixed inside a case. The discrete semiconductor device is fitted in the case to be positioned on a predetermined portion inside the case with high accuracy. A space defined by a side surface of the discrete semiconductor device and an inner wall of the case forms a duct for a coolant used for cooling the discrete semiconductor device. The discrete semiconductor device, except main electrodes and signal terminals, is immersed in the coolant. With this structure provided is a power semiconductor device which allows an increase in radiating efficiency of a power semiconductor element and reduction in manufacturing cost.
摘要翻译： 分立半导体器件垂直夹在壳体的上壁和壳体底板之间，以固定在壳体内。 分立半导体器件安装在壳体内以高精度定位在壳体内的预定部分上。 由分立半导体器件的侧表面和壳体的内壁限定的空间形成用于冷却分立半导体器件的冷却剂的管道。 除了主电极和信号端子之外的分立半导体器件被浸入冷却剂中。 通过提供这样的结构，能够提高功率半导体元件的散热效率，降低制造成本的功率半导体装置。
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公开(公告)号：US20060119512A1
公开(公告)日：2006-06-08
申请号：US11295442
申请日：2005-12-07
IPC分类号： H01Q3/26
CPC分类号： H01Q3/26 , H01L23/473 , H01L25/112 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： One of the aspects of the present invention is to provide a power semiconductor device, which includes at least one pair of power modules, each of which has a molding surface covered with molding resin and a radiating surface opposite to the molding surface. Also, the power semiconductor device includes a pair of radiating fins sandwiching the power modules such that the molding surfaces of the power modules contact each other and the radiating surfaces thereof each contact the radiating fins.
摘要翻译： 本发明的一个方面是提供一种功率半导体器件，其包括至少一对功率模块，每个功率模块具有被模制树脂覆盖的模制表面和与模制表面相对的辐射表面。 此外，功率半导体器件包括夹着功率模块的一对散热片，使得功率模块的模制表面彼此接触，并且其辐射表面各自接触散热片。
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公开(公告)号：US06421244B1
公开(公告)日：2002-07-16
申请号：US09564547
申请日：2000-05-04
IPC分类号： H05K114
CPC分类号： H01L23/24 , H01L24/45 , H01L24/48 , H01L25/162 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00015 , H01L2924/00012
摘要： In a power module, an interconnection terminal (10) is inserted into a through hole (30) and a connector (16) of a control circuit substrate (12) from the side of a lower main surface of the control. circuit substrate (12). Then, the interconnection terminal (10) presses a terminal (17) to displace the terminal (17). Thus, electrical and physical connections are provided between the control circuit substrate (12) and the interconnection terminal (10) in such a manner that the interconnection terminal (10) is held between the terminal (17) and an inner peripheral side surface of the connector (16). The interconnection terminal and the control circuit substrate are fixed. to each other without using solder, whereby the power module which is easy to mount and remove is provided.
摘要翻译： 在功率模块中，互连端子（10）从控制电路的下主表面的一侧插入到控制电路基板（12）的通孔（30）和连接器（16）中。 电路基板（12）。 然后，互连端子（10）按压端子（17）以使端子（17）移位。 因此，在控制电路基板（12）和互连端子（10）之间提供电气和物理连接，使得互连端子（10）保持在端子（17）和端子（17）的内周侧表面之间 连接器（16）。 互连端子和控制电路基板是固定的。 而不使用焊料，由此提供易于安装和移除的电源模块。
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公开(公告)号：US20150076517A1
公开(公告)日：2015-03-19
申请号：US14364189
申请日：2012-01-25
申请人： Mamoru Terai , Tatsuo Ota , Hiroya Ikuta , Kenichi Hayashi , Takashi Nishimura , Toshiaki Shinohara
发明人： Mamoru Terai , Tatsuo Ota , Hiroya Ikuta , Kenichi Hayashi , Takashi Nishimura , Toshiaki Shinohara
IPC分类号： H01L23/31 , H01L29/20 , H01L29/16 , H01L23/498
CPC分类号： H01L23/3135 , H01L23/24 , H01L23/49811 , H01L23/49827 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L25/18 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/3716 , H01L2224/3754 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49109 , H01L2224/4911 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2924/00014 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/351 , H01L2224/48227 , H01L2924/00012 , H01L2924/00 , H01L2924/2076 , H01L2224/45099
摘要： A power semiconductor device is provided with a semiconductor-element substrate in which a front-surface electrode pattern is formed on a surface of an insulating substrate; semiconductor elements for electric power which are affixed to the surface of the front-surface electrode pattern; a partition wall which is provided on the front-surface electrode pattern so as to enclose the semiconductor elements for electric power; a first sealing resin member which is filled inside the partition wall; a second sealing resin member which covers the first sealing resin member and a part of the semiconductor-element substrate which is exposed from the partition wall, wherein an electrode for a relay terminal is provided on a surface of the partition wall, and a wiring from inside of the partition wall to outside of the partition wall is led out via the electrode for a relay terminal.
摘要翻译： 功率半导体器件设置有半导体元件基板，其中在绝缘基板的表面上形成有前表面电极图案; 固定在前表面电极图案的表面上的用于电力的半导体元件; 分隔壁，设置在前表面电极图案上，以便包围用于电力的半导体元件; 填充在分隔壁内的第一密封树脂构件; 覆盖所述第一密封树脂部件的第二密封树脂部件和从所述隔壁暴露的所述半导体元件基板的一部分，其中，在所述隔壁的表面上设置有用于中继端子的电极， 分隔壁内部的分隔壁外侧经由用于继电器端子的电极引出。
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