公开(公告)号：US10953514B1

公开(公告)日：2021-03-23

申请号：US16572895

申请日：2019-09-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shang-Yu Wang ,  Chun-Hao Kung ,  Ching-Hsiang Tsai ,  Kei-Wei Chen ,  Hui-Chi Huang

IPC: B24B37/005 ,  H01L21/304 ,  B24B37/10 ,  H01L21/306 ,  B24B37/04

Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.

公开(公告)号：US20210053184A1

公开(公告)日：2021-02-25

申请号：US16550061

申请日：2019-08-23

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Tung-Kai Chen ,  Shang-Yu Wang ,  Wan-Chun Pan ,  Zink Wei ,  Hui-Chi Huang ,  Kei-Wei Chen

IPC: B24B49/12 ,  G01N21/64 ,  B24B37/12 ,  B24B37/20 ,  B24B53/017

Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.

公开(公告)号：US11590627B2

公开(公告)日：2023-02-28

申请号：US16516006

申请日：2019-07-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Hao Kung ,  Shang-Yu Wang ,  Ching-Hsiang Tsai ,  Hui-Chi Huang ,  Kei-Wei Chen

IPC: H01L21/321 ,  H01L21/3105 ,  B24B37/10 ,  B24B37/04 ,  B24B37/32 ,  H01L21/768

Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.

公开(公告)号：US20210078130A1

公开(公告)日：2021-03-18

申请号：US16572895

申请日：2019-09-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shang-Yu Wang ,  Chun-Hao Kung ,  Ching-Hsiang Tsai ,  Kei-Wei Chen ,  Hui-Chi Huang

IPC: B24B37/10 ,  B24B37/04 ,  H01L21/306

Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.

公开(公告)号：US11712778B2

公开(公告)日：2023-08-01

申请号：US16550061

申请日：2019-08-23

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Tung-Kai Chen ,  Shang-Yu Wang ,  Wan-Chun Pan ,  Zink Wei ,  Hui-Chi Huang ,  Kei-Wei Chen

IPC: B24B49/12 ,  G01N21/64 ,  B24B53/017 ,  B24B37/20 ,  B24B37/12

CPC classification number: B24B49/12 ,  B24B37/12 ,  B24B37/20 ,  B24B53/017 ,  G01N21/6456

Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.

公开(公告)号：US20210016415A1

公开(公告)日：2021-01-21

申请号：US16516006

申请日：2019-07-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Hao Kung ,  Shang-Yu Wang ,  Ching-Hsiang Tsai ,  Hui-Chi Huang ,  Kei-Wei Chen

IPC: B24B37/10 ,  B24B37/04 ,  B24B37/32 ,  H01L21/321 ,  H01L21/3105

Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.