公开(公告)号：US20230020310A1

公开(公告)日：2023-01-19

申请号：US17952838

申请日：2022-09-26

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Christopher Wyland

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01P1/04 ,  H05K1/02 ,  H01L23/66 ,  H01L23/522

摘要： A method of improving electrical interconnections between two electrical is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

公开(公告)号：US12027465B2

公开(公告)日：2024-07-02

申请号：US17952838

申请日：2022-09-26

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Christopher Wyland

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/522 ,  H01L23/66 ,  H01P1/04 ,  H05K1/02

CPC分类号： H01L23/5383 ,  H01L23/5226 ,  H01L23/5387 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/86 ,  H01L24/91 ,  H01P1/047 ,  H05K1/0243 ,  H01L24/45 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48091 ,  H01L2224/48135 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49052 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K2203/049 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20755 ,  H01L2224/45015 ,  H01L2924/20754 ,  H01L2224/45015 ,  H01L2924/20753 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2224/49111 ,  H01L2224/48472 ,  H01L2924/00 ,  H01L2224/48472 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/00 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/85207 ,  H01L2924/00 ,  H01L2224/49175 ,  H01L2224/48472 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2924/206

摘要： A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

公开(公告)号：US20200083171A1

公开(公告)日：2020-03-12

申请号：US16685623

申请日：2019-11-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Christopher Wyland

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01P1/04 ,  H05K1/02 ,  H01L23/66 ,  H01L23/522

摘要： A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

公开(公告)号：US11456255B2

公开(公告)日：2022-09-27

申请号：US16685623

申请日：2019-11-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Christopher Wyland

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01P1/04 ,  H05K1/02 ,  H01L23/66 ,  H01L23/522

摘要： A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

公开(公告)号：US10483209B2

公开(公告)日：2019-11-19

申请号：US14685432

申请日：2015-04-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Christopher Wyland

IPC分类号： H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01P1/04 ,  H05K1/02 ,  H01L23/522

摘要： A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds while also facilitating single integrated designs compatible with tape implementation.

公开(公告)号：US20150221595A1

公开(公告)日：2015-08-06

申请号：US14685432

申请日：2015-04-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Christopher Wyland

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/522

摘要： A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

摘要翻译： 通过提供与电互连结合的超材料覆盖层，可以改善改善两个电气元件之间的电互连的方法。 超材料覆盖层被设计成使得电信号经由电互连传播，以便其形成电互连的介电介质的介电常数和导磁率不同于周围介电介质的实部成分介电常数和磁导率 电气互连。 在某些情况下，由超常材料产生的介电常数和磁导率会导致信号传播，就好像介电常数和磁导率具有负值一样。 因此，该方法提供具有增强的阻抗的稳定性，降低的噪声和减少的损耗的电互连。 超材料覆盖层的替代实施例提供了常规分立线接合的增强，同时还促进与磁带实现兼容的单一集成设计。