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公开(公告)号：US12051704B2
公开(公告)日：2024-07-30
申请号：US17446401
申请日：2021-08-30
发明人： Feng-Chien Hsieh , Yun-Wei Cheng , Kuo-Cheng Lee , Cheng-Ming Wu
IPC分类号： H01L27/14 , H01L27/146
CPC分类号： H01L27/14605 , H01L27/14607 , H01L27/1462 , H01L27/14621 , H01L27/14627 , H01L27/14645 , H01L27/14649 , H01L27/14685
摘要： In some implementations, a pixel array may include a near infrared (NIR) cut filter layer for visible light pixel sensors of the pixel array. The NIR cut filter layer is included in the pixel array to absorb or reflect NIR light for the visible light pixel sensors to reduce the amount of MR light absorbed by the visible light pixel sensors. This increases the accuracy of the color information provided by the visible light pixel sensors, which can be used to produce more accurate images. In some implementations, the visible light pixel sensors and/or MR pixel sensors may include high absorption regions to adjust the orientation of the angle of refraction for the visible light pixel sensors and/or the MR pixel sensors, which may increase the quantum efficiency of the visible light pixel sensors and/or the MR pixel sensors.
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公开(公告)号：US20230402482A1
公开(公告)日：2023-12-14
申请号：US17892846
申请日：2022-08-22
IPC分类号： H01L27/146 , H01L31/0216 , H01L31/054 , H01L31/02 , H01L25/04
CPC分类号： H01L27/14636 , H01L31/02168 , H01L27/14685 , H01L31/054 , H01L31/18 , H01L27/1469 , H01L27/14634 , H01L25/043 , H01L31/02008
摘要： The present disclosure provides an integrated circuit (IC) structure with a solar cell and an image sensor array. An integrated structure according to the present disclosure includes a first substrate including a plurality of photodiodes, an interconnect structure disposed on the first substrate, a first bonding layer disposed on the interconnect structure, a second bonding layer disposed on the first bonding layer, a second substrate disposed on the second bonding layer, and a transparent conductive oxide layer disposed on the second substrate.
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公开(公告)号：US12051659B2
公开(公告)日：2024-07-30
申请号：US18314923
申请日：2023-05-10
发明人： Po-Hsun Huang , Po-Han Wang , Ing-Ju Lee , Chao-Lung Chen , Cheng-Ming Wu
IPC分类号： H01L23/00 , H01L21/768 , H01L23/528 , H01L23/532
CPC分类号： H01L24/03 , H01L21/76855 , H01L21/76865 , H01L23/5283 , H01L23/53223 , H01L23/53238 , H01L24/08
摘要： Semiconductor devices are provided. The semiconductor device includes a substrate, an interconnect structure, and a conductive pad structure. The interconnect structure is over the substrate and includes a top metal layer. The conductive pad structure is over the interconnect structure and includes a lower barrier film, an upper barrier film, and an aluminum-containing layer. The lower barrier film is on the top metal layer. The upper barrier film is on the lower barrier film and has an amorphous structure. The aluminum-containing layer is on the upper barrier film. The lower barrier film and the upper barrier film are made of a same material, and a nitrogen atomic percentage of the upper barrier film is higher than a nitrogen atomic percentage of the lower barrier film.
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公开(公告)号：US12021105B2
公开(公告)日：2024-06-25
申请号：US16949924
申请日：2020-11-20
发明人： Feng-Chien Hsieh , Yun-Wei Cheng , Kuo-Cheng Lee , Cheng-Ming Wu
IPC分类号： H01L27/146 , G01N21/359
CPC分类号： H01L27/14643 , G01N21/359 , H01L27/14621 , H01L27/14603 , H01L27/14627
摘要： A pixel array includes octagon-shaped pixel sensors and square-shaped pixel sensors. The octagon-shaped pixel sensors may be interspersed in the pixel array with square-shaped pixel sensors to increase the utilization of space in the pixel array, and to allow for pixel sensors in the pixel array to be sized differently. Moreover, the pixel array may include a combination of red, green, and blue pixel sensors to obtain color information from incident light; yellow pixel sensors for blue and green color enhancement and correction for the pixel array; near infrared (NIR) pixel sensors to increase contour sharpness and low light performance for the pixel array; and/or white pixel sensors to increase light sensitivity and brightness for the pixel array. The capability to configure different sizes and types of pixel sensors permits the pixel array to be formed and/or configured to satisfy various performance parameters.
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公开(公告)号：US11688703B2
公开(公告)日：2023-06-27
申请号：US17719895
申请日：2022-04-13
发明人： Po-Hsun Huang , Po-Han Wang , Ing-Ju Lee , Chao-Lung Chen , Cheng-Ming Wu
IPC分类号： H01L23/00 , H01L23/532 , H01L21/768 , H01L23/528
CPC分类号： H01L24/03 , H01L21/76855 , H01L21/76865 , H01L23/5283 , H01L23/53223 , H01L23/53238 , H01L24/08
摘要： Methods of fabricating semiconductor devices are provided. The method includes forming an interconnect structure over a substrate. The method also includes forming a passivation layer over the interconnect structure. The method further includes forming an opening in the passivation layer to expose a portion of the interconnect structure. In addition, the method includes sequentially forming a lower barrier film, an upper barrier film, and an aluminum-containing layer in the opening. The lower barrier film and the upper barrier film are made of metal nitride, and the upper barrier film has a nitrogen atomic percentage that is higher than a nitrogen atomic percentage of the lower barrier film and has an amorphous structure.
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公开(公告)号：US11670651B2
公开(公告)日：2023-06-06
申请号：US16949766
申请日：2020-11-13
发明人： Feng-Chien Hsieh , Yun-Wei Cheng , Kuo-Cheng Lee , Cheng-Ming Wu
IPC分类号： H01L27/146 , H04N5/33 , H04N23/10 , H04N25/76
CPC分类号： H01L27/14607 , H01L27/14645 , H01L27/14649 , H01L27/14685 , H04N5/33 , H04N23/10 , H04N25/76 , H01L27/1463 , H01L27/14621 , H01L27/14627
摘要： A pixel array includes octagon-shaped pixel sensors and a combination of visible light pixel sensors (e.g., red, green, and blue pixel sensors) and near infrared (NIR) pixel sensors. The color information obtained by the visible light pixel sensors and the luminance obtained by the NIR pixel sensors may be combined to increase the low-light performance of the pixel array, and to allow for low-light color images in low-light applications. The octagon-shaped pixel sensors may be interspersed in the pixel array with square-shaped pixel sensors to increase the utilization of space in the pixel array, and to allow for pixel sensors in the pixel array to be sized differently. The capability to accommodate different sizes of visible light pixel sensors and NIR pixel sensors permits the pixel array to be formed and/or configured to satisfy various performance parameters.
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公开(公告)号：US20240021009A1
公开(公告)日：2024-01-18
申请号：US18187891
申请日：2023-03-22
发明人： Feng-Chien Hsieh , Yun-Wei Cheng , Kuo-Cheng Lee , Cheng-Ming Wu , Wei-Li Hu
IPC分类号： G06V40/13 , G06V40/12 , H01L27/146
CPC分类号： G06V40/1318 , G06V40/1365 , G06V40/1353 , H01L27/14678 , H01L27/14621 , H01L27/14623 , H01L27/14627
摘要： An image sensing apparatus is disclosed. The image sensing apparatus includes a pixel array and micro lenses disposed above the pixel array. The pixel array includes sensing pixels configured to capture minutia points of a fingerprint and positioning pixels configured to provide positioning codes.
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