-
公开(公告)号:US20170350939A1
公开(公告)日:2017-12-07
申请号:US15171531
申请日:2016-06-02
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Sandeep Kumar GOEL , Yun-Han LEE , Saman M.I. ADHAM , Marat GERSHOIG
IPC: G01R31/3177 , G01R31/317 , G01R31/28
CPC classification number: G01R31/3177 , G01R31/2896 , G01R31/31703 , G01R31/318513 , G01R31/318538
Abstract: A device comprises a first die; and a second die stacked below the first die with interconnections between the first die and the second die. A least one of the first die or the second die has a circuit for performing a function and provides a functional path. Each of the first and second dies comprise a plurality of latches, including a respective latch corresponding to each one of the interconnections; and a plurality of multiplexers. Each multiplexer is connected to a respective one of the plurality of latches and arranged for receiving and selecting one of a scan test pattern or a signal from the functional path for outputting during a scan chain test of the first die and second die.
-
公开(公告)号:US20240133951A1
公开(公告)日:2024-04-25
申请号:US18403623
申请日:2024-01-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sandeep Kumar GOEL , Yun-Han LEE , Saman M.I. ADHAM , Marat GERSHOIG
IPC: G01R31/3177 , G01R31/28 , G01R31/317 , G01R31/3185
CPC classification number: G01R31/3177 , G01R31/2896 , G01R31/31703 , G01R31/318513 , G01R31/318536 , G01R31/318538 , G01R31/318552 , G01R31/318566
Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.
-
公开(公告)号:US20230342272A1
公开(公告)日:2023-10-26
申请号:US18342819
申请日:2023-06-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ming-Hung CHANG , Atul KATOCH , Chia-En HUANG , Ching-Wei WU , Donald G. MIKAN, JR. , Hao-I YANG , Kao-Cheng LIN , Ming-Chien TSAI , Saman M.I. ADHAM , Tsung-Yung CHANG , Uppu Sharath CHANDRA
IPC: G06F11/263 , G06F1/10 , G06F11/22 , G06F11/267 , G11C29/12 , G11C29/32 , G11C29/48
CPC classification number: G06F11/263 , G06F1/10 , G06F11/2273 , G06F11/267 , G11C29/1201 , G11C29/32 , G11C29/48
Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device. The memory device thereafter passes through the serial input sequence of data or the parallel input sequence of data to provide an output sequence of data in the shift mode of operation or the capture mode of operation or passes through the serial input sequence of data to provide a serial output sequence of scan data in the scan mode of operation.
-
公开(公告)号:US20180151245A1
公开(公告)日:2018-05-31
申请号:US15419470
申请日:2017-01-30
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Shih-Lien Linus Lu , Kun-hsi Li , Saman M.I. ADHAM
CPC classification number: G11C29/08 , G11C29/028 , G11C29/52 , G11C29/56008 , G11C29/56016
Abstract: A device is disclosed that includes a memory array, a comparing circuit, and a calculating circuit. The memory array is configured to store a first response of an under-test device. The comparing circuit is configured to compare the first response with a plurality of responses of the under-test device operated in conditions that are different from each other to generate comparing results. The calculating circuit is configured to output a maximum hamming distance between two of the first response and the plurality of responses according to the comparing results.
-
公开(公告)号:US20180301204A1
公开(公告)日:2018-10-18
申请号:US16011215
申请日:2018-06-18
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Shih-Lien Linus LU , Kun-Hsi LI , Saman M.I. ADHAM
Abstract: A device is disclosed for testing a memory, and the memory includes a first memory circuit and a second memory circuit. The second memory circuit is configured to store a first response of the first memory circuit. The device includes a comparing circuit and a calculating circuit. The comparing circuit is configured to compare the first response stored in the second memory circuit with a plurality of responses of the first memory circuit operated in conditions that are different from each other, to generate a plurality of first comparing results. The calculating circuit is configured to output, according to the plurality of first comparing results, a maximum hamming distance between two of the first responses and the plurality of responses of the first memory circuit.
-
公开(公告)号:US20160259006A1
公开(公告)日:2016-09-08
申请号:US15156140
申请日:2016-05-16
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sandeep Kumar GOEL , Saman M.I. ADHAM
IPC: G01R31/317 , G01R31/3177 , G01R31/28
CPC classification number: G01R31/31717 , G01R31/2856 , G01R31/3177 , G11C29/50
Abstract: A test circuitry for testing an interconnection between interconnected dies includes a cell embedded within one of the dies. The cell includes a selection logic module that includes a first multiplexer configured to receive a first control signal and provide a first output test signal, and a second multiplexer configured to receive a second control signal and provide a second output test signal. The cell includes a scannable data storage module coupled to the first multiplexer; and a transition generation module configured to receive a third control signal; wherein the first and second output test signals are generated based on respective states of the first, second, and third control signals, and wherein the test circuitry is configured to use the first and second output test signals to perform at least two of: a DC test on the interconnection, an AC test on the interconnection, and a burn-in-test on the interconnection.
Abstract translation: 用于测试相互连接的管芯之间的互连的测试电路包括嵌入在一个管芯内的电池。 小区包括选择逻辑模块,其包括被配置为接收第一控制信号并提供第一输出测试信号的第一多路复用器,以及被配置为接收第二控制信号并提供第二输出测试信号的第二多路复用器。 该小区包括耦合到第一多路复用器的可扫描数据存储模块; 以及转换生成模块,被配置为接收第三控制信号; 其中所述第一和第二输出测试信号是基于所述第一,第二和第三控制信号的相应状态生成的,并且其中所述测试电路被配置为使用所述第一和第二输出测试信号来执行以下至少两个:DC 互连测试,互连交流测试和互连上的老化测试。
-
公开(公告)号:US20230113905A1
公开(公告)日:2023-04-13
申请号:US18080680
申请日:2022-12-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sandeep Kumar GOEL , Yun-Han LEE , Saman M.I. ADHAM , Marat GERSHOIG
IPC: G01R31/3177 , G01R31/3185 , G01R31/28 , G01R31/317
Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.
-
公开(公告)号:US20220171688A1
公开(公告)日:2022-06-02
申请号:US17651595
申请日:2022-02-18
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ming-Hung CHANG , Atul KATOCH , Chia-En HUANG , Ching-Wei WU , Donald G. MIKAN, JR. , Hao-I YANG , Kao-Cheng LIN , Ming-Chien TSAI , Saman M.I. ADHAM , Tsung-Yung CHANG , Uppu Sharath CHANDRA
IPC: G06F11/263 , G06F1/10 , G06F11/22 , G06F11/267 , G11C29/12 , G11C29/32 , G11C29/48
Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device. The memory device thereafter passes through the serial input sequence of data or the parallel input sequence of data to provide an output sequence of data in the shift mode of operation or the capture mode of operation or passes through the serial input sequence of data to provide a serial output sequence of scan data in the scan mode of operation.
-
公开(公告)号:US20200293417A1
公开(公告)日:2020-09-17
申请号:US16888013
申请日:2020-05-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ming-Hung CHANG , Atul KATOCH , Chia-En HUANG , Ching-Wei WU , Donald G. MIKAN, JR. , Hao-I YANG , Kao-Cheng LIN , Ming-Chien TSAI , Saman M.I. ADHAM , Tsung-Yung CHANG , Uppu Sharath CHANDRA
IPC: G06F11/263 , G06F1/10 , G06F11/22 , G06F11/267 , G11C29/48 , G11C29/32 , G11C29/12
Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device. The memory device thereafter passes through the serial input sequence of data or the parallel input sequence of data to provide an output sequence of data in the shift mode of operation or the capture mode of operation or passes through the serial input sequence of data to provide a serial output sequence of scan data in the scan mode of operation.
-
-
-
-
-
-
-
-