-
公开(公告)号：US20210013173A1
公开(公告)日：2021-01-14
申请号：US17034917
申请日：2020-09-28
发明人： Wei-Yu Chen , Chia-Shen Cheng , Hao-Jan Pei , Philip Yu-Shuan Chung , Kuei-Wei Huang , Yu-Peng Tsai , Hsiu-Jen Lin , Ching-Hua Hsieh , Chen-Hua Yu , Chung-Shi Liu
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498 , H01L21/56
摘要： A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
-
公开(公告)号：US20240234365A1
公开(公告)日：2024-07-11
申请号：US18613954
申请日：2024-03-22
发明人： Wei-Yu Chen , Chia-Shen Cheng , Hao-Jan Pei , Philip Yu-Shuan Chung , Kuei-Wei Huang , Yu-Peng Tsai , Hsiu-Jen Lin , Ching-Hua Hsieh , Chen-Hua Yu , Chung-Shi Liu
IPC分类号： H01L23/00 , H01L21/56 , H01L23/31 , H01L23/498
CPC分类号： H01L24/81 , H01L21/56 , H01L23/3114 , H01L23/49822 , H01L24/17 , H01L2224/175 , H01L2224/81224 , H01L2924/3511
摘要： A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
-
公开(公告)号：US20200152616A1
公开(公告)日：2020-05-14
申请号：US16740463
申请日：2020-01-12
发明人： Hsuan-Ting Kuo , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hao-Jan Pei , Yu-Peng Tsai , Chia-Lun Chang , Chih-Chiang Tsao , Philip Yu-Shuan Chung
IPC分类号： H01L25/00 , H01L23/522 , H01L27/06 , H01L23/00 , H01L23/31 , H01L21/768 , H01L21/683 , H01L21/56
摘要： A manufacturing method of a package-on-package structure includes at least the following steps. A plurality of conductive bumps of a first package is attached to a tape carrier. A second package is coupled to the first package opposite to the plurality of conductive bumps. When coupling the second package, the plurality of conductive bumps are deformed to form a plurality of deformed conductive bumps, and a contact area between the tape carrier and the respective deformed conductive bump increases.
-
公开(公告)号：US11830746B2
公开(公告)日：2023-11-28
申请号：US17141835
申请日：2021-01-05
发明人： Wei-Yu Chen , Hao-Jan Pei , Hsuan-Ting Kuo , Chih-Chiang Tsao , Jen-Jui Yu , Philip Yu-Shuan Chung , Chia-Lun Chang , Hsiu-Jen Lin , Ching-Hua Hsieh
CPC分类号： H01L21/50 , B23K1/0016 , H01L21/4853 , H01L24/10 , H01L2021/60135 , H01L2021/60225
摘要： A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.
-
公开(公告)号：US20220367408A1
公开(公告)日：2022-11-17
申请号：US17815713
申请日：2022-07-28
发明人： Wei-Yu Chen , Chia-Shen Cheng , Hao-Jan Pei , Philip Yu-Shuan Chung , Kuei-Wei Huang , Yu-Peng Tsai , Hsiu-Jen Lin , Ching-Hua Hsieh , Chen-Hua Yu , Chung-Shi Liu
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498 , H01L21/56
摘要： A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
-
公开(公告)号：US11342321B2
公开(公告)日：2022-05-24
申请号：US16740463
申请日：2020-01-12
发明人： Hsuan-Ting Kuo , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hao-Jan Pei , Yu-Peng Tsai , Chia-Lun Chang , Chih-Chiang Tsao , Philip Yu-Shuan Chung
IPC分类号： H01L23/00 , H01L25/00 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/31 , H01L27/06 , H01L23/522
摘要： A manufacturing method of a package-on-package structure includes at least the following steps. A plurality of conductive bumps of a first package is attached to a tape carrier. A second package is coupled to the first package opposite to the plurality of conductive bumps. When coupling the second package, the plurality of conductive bumps are deformed to form a plurality of deformed conductive bumps, and a contact area between the tape carrier and the respective deformed conductive bump increases.
-
公开(公告)号：US20220028823A1
公开(公告)日：2022-01-27
申请号：US16935465
申请日：2020-07-22
发明人： Chia-Shen Cheng , Wei-Yu Chen , Philip Yu-Shuan Chung , Hsiu-Jen Lin , Ching-Hua Hsieh , Chen-Hua Yu
IPC分类号： H01L23/00
摘要： A method for bonding semiconductor substrates includes placing a die on a substrate and performing a heating process on the die and the substrate to bond the respective first connectors with the respective second connectors. Respective first connectors of a plurality of first connectors on the die contact respective second connectors of a plurality of second connectors on the substrate. The heating process includes placing a mask between a laser generator and the substrate and performing a laser shot. The mask includes a masking layer and a transparent layer. Portions of the masking layer are opaque. The laser passes through a first gap in the masking layer and through the transparent layer to heat a first portion of a top side of the die opposite the substrate.
-
公开(公告)号：US12040309B2
公开(公告)日：2024-07-16
申请号：US17815713
申请日：2022-07-28
发明人： Wei-Yu Chen , Chia-Shen Cheng , Hao-Jan Pei , Philip Yu-Shuan Chung , Kuei-Wei Huang , Yu-Peng Tsai , Hsiu-Jen Lin , Ching-Hua Hsieh , Chen-Hua Yu , Chung-Shi Liu
IPC分类号： H01L23/00 , H01L21/56 , H01L23/31 , H01L23/498
CPC分类号： H01L24/81 , H01L21/56 , H01L23/3114 , H01L23/49822 , H01L24/17 , H01L2224/175 , H01L2224/81224 , H01L2924/3511
摘要： A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
-
公开(公告)号：US20230386862A1
公开(公告)日：2023-11-30
申请号：US18447409
申请日：2023-08-10
发明人： Wei-Yu Chen , Hao-Jan Pei , Hsuan-Ting Kuo , Chih-Chiang Tsao , Jen-Jui Yu , Philip Yu-Shuan Chung , Chia-Lun Chang , Hsiu-Jen Lin , Ching-Hua Hsieh
CPC分类号： H01L21/50 , H01L21/4853 , H01L24/10 , B23K1/0016 , H01L2021/60225 , H01L2021/60135
摘要： A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.
-
公开(公告)号：US11646293B2
公开(公告)日：2023-05-09
申请号：US16935465
申请日：2020-07-22
发明人： Chia-Shen Cheng , Wei-Yu Chen , Philip Yu-Shuan Chung , Hsiu-Jen Lin , Ching-Hua Hsieh , Chen-Hua Yu
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , H01L24/13 , H01L24/75 , H01L2224/81224 , H01L2224/81939
摘要： A method for bonding semiconductor substrates includes placing a die on a substrate and performing a heating process on the die and the substrate to bond the respective first connectors with the respective second connectors. Respective first connectors of a plurality of first connectors on the die contact respective second connectors of a plurality of second connectors on the substrate. The heating process includes placing a mask between a laser generator and the substrate and performing a laser shot. The mask includes a masking layer and a transparent layer. Portions of the masking layer are opaque. The laser passes through a first gap in the masking layer and through the transparent layer to heat a first portion of a top side of the die opposite the substrate.
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.027 秒)
