公开(公告)号：US20210159217A1

公开(公告)日：2021-05-27

申请号：US16900589

申请日：2020-06-12

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Chi-Hui Lai ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/367 ,  H01L23/40 ,  H01L21/56

摘要： An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.

公开(公告)号：US10985101B2

公开(公告)日：2021-04-20

申请号：US16354105

申请日：2019-03-14

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yu-Chia Lai ,  Chi-Hui Lai ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Kuo-Chung Yee ,  Chen-Hua Yu

IPC分类号： H01L23/48 ,  H01L23/528 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

摘要： A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes semiconductor dies, an encapsulant and a redistribution structure. The semiconductor dies are disposed side by side. Each semiconductor die has an active surface, a backside surface, and an inner side surface connecting the active surface and the backside surface. The encapsulant wraps the semiconductor dies and exposes the active surfaces of the semiconductor dies. The redistribution structure is disposed on the encapsulant and the active surfaces of the semiconductor dies. The inner side surfaces of most adjacent semiconductor dies face each other. The redistribution structure establishes single-ended connections between most adjacent semiconductor dies by crossing over the facing inner side surfaces of the most adjacent semiconductor dies.

公开(公告)号：US20230053190A1

公开(公告)日：2023-02-16

申请号：US17977301

申请日：2022-10-31

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chi-Hui Lai ,  Shu-Rong Chun ,  Kuo Lung Pan ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48

摘要： In an embodiment, a device includes: a package component including: a first integrated circuit die; an encapsulant at least partially surrounding the first integrated circuit die; a redistribution structure on the encapsulant, the redistribution structure physically and electrically coupling the first integrated circuit die; a first module socket attached to the redistribution structure; an interposer attached to the redistribution structure adjacent the first module socket, the outermost extent of the interposer extending beyond the outermost extent of the redistribution structure; and an external connector attached to the interposer.

公开(公告)号：US20220336410A1

公开(公告)日：2022-10-20

申请号：US17809934

申请日：2022-06-30

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Kuo Lung Pan ,  Shu-Rong Chun ,  Chi-Hui Lai ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L23/64 ,  H01L21/56 ,  H01L25/065 ,  H01L23/367

摘要： A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.

公开(公告)号：US11164819B2

公开(公告)日：2021-11-02

申请号：US16425957

申请日：2019-05-30

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ying-Cheng Tseng ,  Hao-Yi Tsai ,  Tin-Hao Kuo ,  Chia-Hung Liu ,  Chi-Hui Lai

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498

摘要： A semiconductor package includes a first wafer, a second wafer, and an interconnect. The first wafer includes a first die, a first encapsulating material encapsulating the first die, and a first redistribution structure disposed over the first die and the first encapsulating material. The second wafer includes a second die, a second encapsulating material encapsulating the second die, and a second redistribution structure disposed over the second die and the second encapsulating material, wherein the second redistribution structure faces the first redistribution structure. The interconnect is disposed between the first wafer and the second wafer and electrically connecting the first redistribution structure and the second redistribution structure, wherein the interconnect includes a substrate and a plurality of through vias extending through the substrate for connecting the first redistribution structure and the second redistribution structure.

公开(公告)号：US20210233835A1

公开(公告)日：2021-07-29

申请号：US17227608

申请日：2021-04-12

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chi-Hui Lai ,  Shu-Rong Chun ,  Kuo Lung Pan ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48

摘要： In an embodiment, a device includes: a package component including: a first integrated circuit die; an encapsulant at least partially surrounding the first integrated circuit die; a redistribution structure on the encapsulant, the redistribution structure physically and electrically coupling the first integrated circuit die; a first module socket attached to the redistribution structure; an interposer attached to the redistribution structure adjacent the first module socket, the outermost extent of the interposer extending beyond the outermost extent of the redistribution structure; and an external connector attached to the interposer.

公开(公告)号：US10790269B2

公开(公告)日：2020-09-29

申请号：US16260151

申请日：2019-01-29

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chi-Hui Lai ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Tin-Hao Kuo

IPC分类号： H01L25/16 ,  H01L23/40 ,  H01L23/31 ,  H01R12/70 ,  H01L23/50 ,  H01L23/498

摘要： Semiconductor devices and semiconductor structures are disclosed. One of the semiconductor device includes a semiconductor package and a connector. The semiconductor package includes at least one die in a die region, an encapsulant in a periphery region aside the die region and a redistribution structure in the die region and the periphery region. The encapsulant encapsulates the at least one die. The redistribution structure is electrically connected to the die. The connector is disposed on the redistribution structure in the periphery region. The connector includes a plurality of connecting elements, wherein the connector is electrically connected to the redistribution structure through the plurality of connecting elements.

公开(公告)号：US11527525B2

公开(公告)日：2022-12-13

申请号：US17113204

申请日：2020-12-07

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ying-Cheng Tseng ,  Yu-Chih Huang ,  Chih-Hsuan Tai ,  Ting-Ting Kuo ,  Chi-Hui Lai ,  Ban-Li Wu ,  Chiahung Liu ,  Hao-Yi Tsai

IPC分类号： H01L27/01 ,  H01L23/528 ,  H01L23/00 ,  H01L49/02 ,  H01L21/768 ,  H01L21/70 ,  H01L23/522 ,  H01L25/10

摘要： A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

公开(公告)号：US20220367420A1

公开(公告)日：2022-11-17

申请号：US17874598

申请日：2022-07-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Chi-Hui Lai ,  Ting Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L23/40 ,  H01L23/367

摘要： An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.

公开(公告)号：US11488897B2

公开(公告)日：2022-11-01

申请号：US17227608

申请日：2021-04-12

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chi-Hui Lai ,  Shu-Rong Chun ,  Kuo Lung Pan ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48

摘要： In an embodiment, a device includes: a package component including: a first integrated circuit die; an encapsulant at least partially surrounding the first integrated circuit die; a redistribution structure on the encapsulant, the redistribution structure physically and electrically coupling the first integrated circuit die; a first module socket attached to the redistribution structure; an interposer attached to the redistribution structure adjacent the first module socket, the outermost extent of the interposer extending beyond the outermost extent of the redistribution structure; and an external connector attached to the interposer.