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    Electronic device with exposed tie bar
    1.
    发明授权
    Electronic device with exposed tie bar 有权

    公开(公告)号：US11817374B2

    公开(公告)日：2023-11-14

    申请号：US17229955

    申请日：2021-04-14

    Applicant: Texas Instruments Incorporated

    Inventor： Chih-Chien Ho ,  Bo-Hsun Pan ,  Yuh-Harng Chien

    IPC: H01L23/495 ,  H01L21/50 ,  H01L21/56 ,  H01L23/00

    CPC classification number: H01L23/4951 ,  H01L21/50 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/49 ,  H01L24/85 ,  H01L2924/181

    Abstract: A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.

    Leads for semiconductor package
    3.
    发明授权
    Leads for semiconductor package 有权

    公开(公告)号：US11538740B2

    公开(公告)日：2022-12-27

    申请号：US16511313

    申请日：2019-07-15

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Jason Chien ,  Yuh-Harng Chien ,  J K Ho

    IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

    Abstract: A semiconductor package includes a first lead with first and second ends extending in the same direction as one another. At least one second lead has first and second ends and is partially surrounded by the first lead. A die pad is provided and a die is connected to the die pad. Wires electrically connect the die to the first lead and the at least one second lead. An insulating layer extends over the leads, the die pad, and the die such that the first end of the at least one second lead is exposed from the semiconductor package and the second end of the first lead is encapsulated entirely within the insulating layer.

    ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
    4.
    发明申请
    ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD 有权

    公开(公告)号：US20210043548A1

    公开(公告)日：2021-02-11

    申请号：US16537535

    申请日：2019-08-10

    Applicant: Texas Instruments Incorporated

    Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

    IPC: H01L23/495 ,  H01L23/492 ,  H01L23/00

    Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

    INTEGRATED CIRCUIT DIE PAD CAVITY
    8.
    发明申请
    INTEGRATED CIRCUIT DIE PAD CAVITY 有权

    公开(公告)号：US20230016577A1

    公开(公告)日：2023-01-19

    申请号：US17377719

    申请日：2021-07-16

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Bo-Hsun Pan ,  Hung-Yu Chou ,  Chung-Hao Lin ,  Yuh-Harng Chien

    IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/28

    Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive pad having a generally planar top surface that includes a cavity having a bottom surface and sidewalls extending from the bottom surface of the cavity to the top surface of the pad. An electronic device is attached to the top surface of the electrically conductive pad. A wire bond is attached from the electronic device to the bottom surface of the cavity. A molding compound encapsulates the electronic device.

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