公开(公告)号：US20200211928A1

公开(公告)日：2020-07-02

申请号：US16235419

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dishit Paresh PAREKH ,  Benjamin Stassen COOK ,  Daniel Lee REVIER ,  Jo BITO

IPC: H01L23/473 ,  H01L23/42 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.

公开(公告)号：US20210025948A1

公开(公告)日：2021-01-28

申请号：US16521053

申请日：2019-07-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jo BITO ,  Benjamin Stassen COOK ,  Dok Won LEE ,  Keith Ryan GREEN ,  Ricky Alan JACKSON ,  William David FRENCH

IPC: G01R33/00 ,  G01R33/07

Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.

公开(公告)号：US20220018879A1

公开(公告)日：2022-01-20

申请号：US16932299

申请日：2020-07-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dok Won LEE ,  Jo BITO ,  Keith Ryan GREEN

IPC: G01R15/20 ,  H01L43/04 ,  H01L43/06 ,  H01L23/495

Abstract: A packaged current sensor includes a lead frame, an integrated circuit, an isolation spacer, a first magnetic concentrator, and a second magnetic concentrator. The lead frame includes a conductor. The isolation spacer is between the lead frame and the integrated circuit. The first magnetic concentrator is aligned with the conductor. The second magnetic concentrator is aligned with the conductor.

公开(公告)号：US20220357369A1

公开(公告)日：2022-11-10

申请号：US17871873

申请日：2022-07-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dok Won LEE ,  Jo BITO ,  Keith Ryan GREEN

IPC: G01R15/20 ,  H01L43/06 ,  H01L23/495 ,  H01L43/04

Abstract: In one example, circuitry is formed in a semiconductor die. A magnetic concentrator is formed on a surface of the semiconductor die and over the circuitry. An isolation spacer is placed on a lead frame. The semiconductor die is placed on the isolation spacer, and the magnetic concentrator is aligned to overlap the lead frame. Electrical interconnects are formed between the semiconductor die and the lead frame.

公开(公告)号：US20220238733A1

公开(公告)日：2022-07-28

申请号：US17161581

申请日：2021-01-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jo BITO ,  Benjamin Stassen COOK

IPC: H01L31/0216 ,  H01L31/0203 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

Abstract: In examples, a sensor package comprises a die pad and a semiconductor die on the die pad. The semiconductor die has an active surface. The sensor package includes a light sensor on the active surface of the semiconductor die. The sensor package includes a mold compound covering the die pad, the semiconductor die, and a portion of the active surface. The sensor package includes a light filter covering the light sensor and abutting the mold compound. The light filter includes a combination of silicone, metal particles, and an organic dye. The combination is configured to reject light having a wavelength in a target wavelength range. The light filter has a thickness of at least 0.5 millimeters.

公开(公告)号：US20230133993A1

公开(公告)日：2023-05-04

申请号：US17515296

申请日：2021-10-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hassan Omar ALI ,  Benjamin Stassen COOK ,  Scott Robert SUMMERFELT ,  Jo BITO

IPC: G02B5/18 ,  G02B1/00 ,  G02B1/11 ,  G02B5/20 ,  G01N21/59 ,  G01N21/61

Abstract: An optical device includes a metamaterial layer configured to absorb a portion of an incident light having a frequency spectrum, the portion of the incident light having a frequency range that is narrower than and within the frequency spectrum of the incident light, a photodiode disposed in a layer coupled to the metamaterial layer and configured to detect an amplitude of the portion of the incident light, and shallow trench isolation (STI) structures disposed between the metamaterial layer and the photodiode, the STI structures configured to pass the portion of the incident light within the frequency range from the metamaterial layer to the photodiode.

公开(公告)号：US20220179015A1

公开(公告)日：2022-06-09

申请号：US17114589

申请日：2020-12-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Arup POLLEY ,  Srinath M. RAMASWAMY ,  Jo BITO ,  Baher S. HAROUN

IPC: G01R33/00 ,  G01R33/07

Abstract: A Hall sensor circuit includes a first Hall sensor, a second Hall sensor, a first preamplifier circuit, a second preamplifier circuit, a subtractor circuit, and a duty cycling circuit. The first preamplifier circuit includes an input and an output. The input is coupled to the first Hall sensor. The second preamplifier circuit includes a first input, a second input, and an output. The first input is coupled to the second Hall sensor. The subtractor circuit includes a first input coupled to the output of the first preamplifier circuit, a second input coupled to the output of the second preamplifier circuit, and an output coupled to the second input of the second preamplifier circuit. The duty cycling circuit is coupled to the second preamplifier circuit and the second Hall sensor.

公开(公告)号：US20210072327A1

公开(公告)日：2021-03-11

申请号：US16565130

申请日：2019-09-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jo BITO ,  Benjamin Stassen COOK ,  Dok Won LEE ,  Keith Ryan GREEN ,  Kenji OTAKE

IPC: G01R33/00 ,  G01R33/07

Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a protective overcoat layer positioned above the surface of the substrate, and a sphere-shaped magnetic concentrator positioned above the protective overcoat layer. Instead of or in addition to the sphere-shaped magnetic concentrator, the structure may include an embedded magnetic concentrator positioned within the substrate and below the horizontal-type Hall sensor.