公开(公告)号：US20210072327A1

公开(公告)日：2021-03-11

申请号：US16565130

申请日：2019-09-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jo BITO ,  Benjamin Stassen COOK ,  Dok Won LEE ,  Keith Ryan GREEN ,  Kenji OTAKE

IPC: G01R33/00 ,  G01R33/07

Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a protective overcoat layer positioned above the surface of the substrate, and a sphere-shaped magnetic concentrator positioned above the protective overcoat layer. Instead of or in addition to the sphere-shaped magnetic concentrator, the structure may include an embedded magnetic concentrator positioned within the substrate and below the horizontal-type Hall sensor.

公开(公告)号：US20210025948A1

公开(公告)日：2021-01-28

申请号：US16521053

申请日：2019-07-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jo BITO ,  Benjamin Stassen COOK ,  Dok Won LEE ,  Keith Ryan GREEN ,  Ricky Alan JACKSON ,  William David FRENCH

IPC: G01R33/00 ,  G01R33/07

Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.

公开(公告)号：US20220018879A1

公开(公告)日：2022-01-20

申请号：US16932299

申请日：2020-07-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dok Won LEE ,  Jo BITO ,  Keith Ryan GREEN

IPC: G01R15/20 ,  H01L43/04 ,  H01L43/06 ,  H01L23/495

Abstract: A packaged current sensor includes a lead frame, an integrated circuit, an isolation spacer, a first magnetic concentrator, and a second magnetic concentrator. The lead frame includes a conductor. The isolation spacer is between the lead frame and the integrated circuit. The first magnetic concentrator is aligned with the conductor. The second magnetic concentrator is aligned with the conductor.

公开(公告)号：US20220357369A1

公开(公告)日：2022-11-10

申请号：US17871873

申请日：2022-07-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dok Won LEE ,  Jo BITO ,  Keith Ryan GREEN

IPC: G01R15/20 ,  H01L43/06 ,  H01L23/495 ,  H01L43/04

Abstract: In one example, circuitry is formed in a semiconductor die. A magnetic concentrator is formed on a surface of the semiconductor die and over the circuitry. An isolation spacer is placed on a lead frame. The semiconductor die is placed on the isolation spacer, and the magnetic concentrator is aligned to overlap the lead frame. Electrical interconnects are formed between the semiconductor die and the lead frame.

公开(公告)号：US20190267539A1

公开(公告)日：2019-08-29

申请号：US15907000

申请日：2018-02-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Keith Ryan GREEN ,  Dok Won LEE

IPC: H01L43/06 ,  G01R15/20 ,  H01L23/48 ,  H01L27/22 ,  G01R33/07

Abstract: A Hall effect sensor comprises a semiconductor substrate, a first well formed in the semiconductor substrate, a first ohmic contact formed in the first well, a second ohmic contact formed in the first well, a first terminal electrically coupled to the first ohmic contact, a second terminal electrically coupled to the second ohmic contact, and a first metal layer formed over the semiconductor substrate. The first metal layer comprises a first interconnect and a first trace, where the first trace is formed over the first well, and where the first interconnect electrically couples a first part of the first well to a second part of the first well. The first and second ohmic contacts are each positioned between the first part and the second part of the first well, where the first interconnect is electrically isolated from the first trace.