公开(公告)号：US20220359268A1

公开(公告)日：2022-11-10

申请号：US17683201

申请日：2022-02-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK ,  Simon Joshua JACOBS ,  Baher S. HAROUN

IPC: H01L21/762

Abstract: Disclosed herein is an integrated circuit (IC) comprising a semiconductor wafer, a dielectric layer, and an isolation element. The semiconductor wafer has a first wafer portion and a second wafer portion each extending from a frontside surface to a backside surface. The dielectric layer interfaces with the first wafer portion and with the second wafer portion each on the frontside surface. The isolation element has an isolation dielectric material, and the isolation element extends between a first side surface of the first wafer portion and a second side surface of the second wafer portion and from an extension plane of the frontside surface to an extension plane of the backside surface. Also disclosed herein is a system comprising the IC and a package substrate coupled to the IC.

公开(公告)号：US20220179015A1

公开(公告)日：2022-06-09

申请号：US17114589

申请日：2020-12-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Arup POLLEY ,  Srinath M. RAMASWAMY ,  Jo BITO ,  Baher S. HAROUN

IPC: G01R33/00 ,  G01R33/07

Abstract: A Hall sensor circuit includes a first Hall sensor, a second Hall sensor, a first preamplifier circuit, a second preamplifier circuit, a subtractor circuit, and a duty cycling circuit. The first preamplifier circuit includes an input and an output. The input is coupled to the first Hall sensor. The second preamplifier circuit includes a first input, a second input, and an output. The first input is coupled to the second Hall sensor. The subtractor circuit includes a first input coupled to the output of the first preamplifier circuit, a second input coupled to the output of the second preamplifier circuit, and an output coupled to the second input of the second preamplifier circuit. The duty cycling circuit is coupled to the second preamplifier circuit and the second Hall sensor.

公开(公告)号：US20140368377A1

公开(公告)日：2014-12-18

申请号：US13916331

申请日：2013-06-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Phillip Michel NADEAU ,  Django TROMBLEY ,  Baher S. HAROUN ,  Srinath Mathur RAMASWAMY

IPC: G01N22/00

CPC classification number: H03L7/26

Abstract: A frequency reference device that includes a frequency reference generation unit to generate a frequency reference signal based on an absorption line of a gas.

Abstract translation: 一种频率参考装置，包括频率参考产生单元，用于基于气体的吸收线产生频率参考信号。

公开(公告)号：US20200212854A1

公开(公告)日：2020-07-02

申请号：US16232494

申请日：2018-12-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Miaad SEYED ALIROTEH ,  Nirmal C. WARKE ,  David P. MAGEE ,  Ali KIAEI ,  Baher S. HAROUN ,  Ajay SINGHVI

IPC: H03F3/195 ,  G01S17/10 ,  G01S7/481

Abstract: A sensor circuit includes a sensor array. The sensor array includes a sensor row that includes a first sensor cell, a second sensor cell, and an output stage of a distributed amplifier circuit. The first sensor cell includes a first photodetector, and a first preamplifier stage of the distributed amplifier circuit. The first preamplifier stage is coupled to the first photodetector, and is configured to amplify a signal received from the first photodetector. The second sensor cell includes a second photodetector, and a second preamplifier stage of the distributed amplifier circuit. The second preamplifier stage is coupled to the second photodetector, and is configured to amplify a signal received from the second photodetector. The output stage of the distributed amplifier circuit is coupled to the first and second sensor cells, and is configured to amplify a signal received from the first preamplifier stage and the second preamplifier stage.

公开(公告)号：US20190018107A1

公开(公告)日：2019-01-17

申请号：US15649413

申请日：2017-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nirmal C. WARKE ,  David P. MAGEE ,  Baher S. HAROUN

IPC: G01S7/484 ,  G01S17/10 ,  G01S7/486

Abstract: An optical transmitting system for distance measuring includes a signal generator, a laser diode coupled to the signal generator, and an optics device. The signal generator is configured to generate a first plurality of electrical signals. The laser diode is configured to generate a first plurality of optical waveforms that correspond with the first plurality of electrical signals. The optics device is configured to receive the first plurality of optical waveforms and direct the first plurality of optical waveforms toward a first plurality of scan points that form a scan region within a field of view (FOV). A first signal type, a first signal duration, a first signal amplitude, or a first signal repetition frequency of the first plurality of optical waveforms is based on a first desired range of the first plurality of scan points.

公开(公告)号：US20180348345A1

公开(公告)日：2018-12-06

申请号：US15613835

申请日：2017-06-05

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Baher S. HAROUN ,  Nirmal C. WARKE ,  David P. MAGEE

IPC: G01S7/486 ,  G01S17/10

Abstract: An optical distance measurement system includes a transmission circuit and a receive circuit. The transmission circuit is configured to generate narrowband intensity modulated light transmission signals over a first band of frequencies and direct the narrowband light transmission signal toward a target object. The receive circuit is configured to receive reflected light off the target object, convert the reflected light into a current signal proportional to the intensity of the reflected light, filter frequencies outside a second band of frequencies from the current signal to create a filtered current signal, and convert the filtered current signal into a voltage signal. The second band of frequencies corresponds with the first band of frequencies.

公开(公告)号：US20240006466A1

公开(公告)日：2024-01-04

申请号：US17855346

申请日：2022-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Swaminathan SANKARAN ,  Benjamin COOK ,  Baher S. HAROUN

IPC: H01L49/02 ,  H01F27/36 ,  H03B5/32

CPC classification number: H01L28/10 ,  H01F27/36 ,  H03B5/326

Abstract: An integrated circuit includes a semiconductor substrate, a metal layer, an inductor in the metal layer, and a shield above the inductor. The metal layer is a first metal layer; and the shield may be is in a second metal layer above the first metal layer. The shield may include a plurality of metal strips substantially perpendicular to metal lines of the inductor.

公开(公告)号：US20220223486A1

公开(公告)日：2022-07-14

申请号：US17538850

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tobias Bernhard FRITZ ,  Baher S. HAROUN ,  Benjamin Stassen COOK ,  Michael SZELONG ,  Ernst MUELLNER ,  Jeronimo SEGOVIA-FERNANDEZ

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  G01L1/18

Abstract: An example semiconductor package includes a semiconductor die configured to detect a force. In addition, the semiconductor package includes a mold compound covering the semiconductor die. Further, the semiconductor package includes an engagement surface including a pattern of projections adapted to engage with a mounting surface on a member of interest.

公开(公告)号：US20180341020A1

公开(公告)日：2018-11-29

申请号：US15681468

申请日：2017-08-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： David P. MAGEE ,  Nirmal C. WARKE ,  Baher S. HAROUN

IPC: G01S17/10 ,  G01S7/486 ,  G01S7/484

Abstract: An optical distance measuring system includes a transmitter and a receiver. The transmitter is configured to generate a first optical waveform and direct the first optical waveform toward a first scan point within a field of view (FOV). The receiver is configured to receive the first optical waveform reflected off a first object within the FOV, direct the first optical waveform reflected off the first object to a first photodiode group of an array of photodiode elements, and determine a distance to the first object based on a time of flight of the first optical waveform from the transmitter to the first object and back to the receiver.

公开(公告)号：US20170295533A1

公开(公告)日：2017-10-12

申请号：US15632858

申请日：2017-06-26

Applicant: Texas Instruments Incorporated

Inventor： Nirmal Chindhu WARKE ,  Srinath HOSUR ,  Martin J. IZZARD ,  Siraj AKHTAR ,  Baher S. HAROUN ,  Marco CORSI

IPC: H04W40/06 ,  H01Q9/20 ,  H01Q21/00 ,  H04B7/06 ,  H04B17/336 ,  H04L12/741 ,  H01Q3/26

CPC classification number: H04W40/00 ,  H01Q3/26 ,  H01Q9/20 ,  H01Q21/0006 ,  H01Q21/0037 ,  H04B7/0617 ,  H04B17/336 ,  H04L45/74 ,  H04L49/3009 ,  H04L49/40 ,  H04W40/06 ,  H04W40/12 ,  Y02D70/00 ,  Y02D70/166 ,  Y02D70/322 ,  Y02D70/34

Abstract: Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. In one embodiment, a networking device includes an input port circuit having a transmitter circuit coupled one or more transmitter antennas, wherein the input port circuit transmits a data packet to a first output port circuit using millimeter wave signals. The networking device includes output port circuits including at least the first output port circuit, each of the output port circuits having a receiver circuit coupled to one or more receiver antennas. The networking device includes a beamforming circuit coupled to the one or more transmitter antennas of the input port circuit, wherein the beamforming circuit causes the one or more transmitter antennas to transmit an antenna beam directed at the one or more receiver antennas of the first output port circuit.