公开(公告)号：US20200161199A1

公开(公告)日：2020-05-21

申请号：US16550995

申请日：2019-08-26

Applicant: TDK CORPORATION

Inventor： Kazutoshi TSUYUTANI ,  Yoshihiro SUZUKI ,  Akira MOTOHASHI

IPC: H01L23/13 ,  H01L25/18 ,  H01L23/538 ,  G01L9/00 ,  G01H3/00 ,  G01K13/02 ,  G01N33/00

Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

公开(公告)号：US20220238474A1

公开(公告)日：2022-07-28

申请号：US17618666

申请日：2020-06-05

Applicant: TDK Corporation

Inventor： Toshiyuki ABE ,  Yoshihiro SUZUKI ,  Hironori CHIBA ,  Tetsuya YAZAKI ,  Hiroshige OHKAWA

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/16 ,  H01S5/0233 ,  H01S5/024

Abstract: An electronic component embedded substrate includes an electronic component and a heat transfer block which are embedded in insulating layers, a first wiring patterns facing a first surface of the heat transfer block, a second wiring pattern facing a second surface of the heat transfer block, a first via conductor connecting the first wiring pattern and the first surface of the heat transfer block, and a second via conductor connecting the second wiring pattern and the second surface of the heat transfer block. The first and second surfaces and are insulated from each other. Thus, even when an electronic component of a type having large heat generation and being prohibited from connecting to a ground pattern is mounted, the second wiring pattern functioning as a heat dissipation pattern can be connected to a ground pattern on a motherboard.

公开(公告)号：US20190164904A1

公开(公告)日：2019-05-30

申请号：US16185596

申请日：2018-11-09

Applicant: TDK Corporation

Inventor： Masashi KATSUMATA ,  Yoshihiro SUZUKI ,  Reo HANADA

IPC: H01L23/552 ,  H01L25/16 ,  H01L23/31 ,  H01L23/538 ,  H01L23/498 ,  H01L21/48

Abstract: Disclosed herein is a multilayer circuit board that includes a plurality of conductor layers laminated with insulating layers interposed therebetween. The plurality of conductor layers include a first conductor layer, a second conductor layer, and a first shield layer disposed between the first and second conductor layers. The first shield layer is smaller in conductor thickness than the first and second conductor layers and is connected to none of the plurality of conductor layers within its surface.

公开(公告)号：US20220406670A1

公开(公告)日：2022-12-22

申请号：US17894584

申请日：2022-08-24

Applicant: TDK CORPORATION

Inventor： Kazutoshi TSUYUTANI ,  Yoshihiro SUZUKI ,  Akira MOTOHASHI

IPC: H01L23/13 ,  H01L25/18 ,  H01L23/538 ,  G01H3/00 ,  G01K13/02 ,  G01N33/00 ,  G01L9/00

Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

公开(公告)号：US20220267142A1

公开(公告)日：2022-08-25

申请号：US17620485

申请日：2020-06-05

Applicant: TDK Corporation

Inventor： Kazutoshi TSUYUTANI ,  Yoshihiro SUZUKI

IPC: B81B7/00 ,  B81C1/00 ,  G01D11/24

Abstract: A sensor package substrate has through holes V1 and V2 at a position overlapping a sensor chip mounting area. The through hole V1 has a minimum inner diameter at a depth position D1, and the through hole V2 has a minimum inner diameter at a depth position D2 different from the depth position D1. Thus, since the plurality of through holes are formed at a position overlapping the sensor chip mounting area, the diameter of each of the through holes can be reduced. This makes foreign matters unlikely to enter through the through holes, and a reduction in the strength of the substrate is suppressed. In addition, since the depth position D1 and depth position D2 are located at different depth levels, it is possible to sufficiently maintain the strength of a part of the substrate that is positioned between the through holes V1 and V2.

公开(公告)号：US20170295643A1

公开(公告)日：2017-10-12

申请号：US15479033

申请日：2017-04-04

Applicant: TDK Corporation

Inventor： Yoshihiro SUZUKI ,  Tomohide Yokozawa ,  Michitaka Okazaki ,  Takuro Aoki ,  Masashi Katsumata

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H01L23/552 ,  H01L2224/97 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/182 ,  H05K1/185 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4038 ,  H05K2201/0715 ,  H05K2201/10371

Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.