公开(公告)号：US10225923B2

公开(公告)日：2019-03-05

申请号：US15479033

申请日：2017-04-04

Applicant: TDK Corporation

Inventor： Yoshihiro Suzuki ,  Tomohide Yokozawa ,  Michitaka Okazaki ,  Takuro Aoki ,  Masashi Katsumata

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.

公开(公告)号：US20170295643A1

公开(公告)日：2017-10-12

申请号：US15479033

申请日：2017-04-04

Applicant: TDK Corporation

Inventor： Yoshihiro SUZUKI ,  Tomohide Yokozawa ,  Michitaka Okazaki ,  Takuro Aoki ,  Masashi Katsumata

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H01L23/552 ,  H01L2224/97 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/182 ,  H05K1/185 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4038 ,  H05K2201/0715 ,  H05K2201/10371

Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.