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公开(公告)号：US20220406670A1
公开(公告)日：2022-12-22
申请号：US17894584
申请日：2022-08-24
Applicant: TDK CORPORATION
Inventor： Kazutoshi TSUYUTANI , Yoshihiro SUZUKI , Akira MOTOHASHI
Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
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Patent Agency Ranking
公开(公告)号：US20250104898A1
公开(公告)日：2025-03-27
申请号：US18891123
申请日：2024-09-20
Applicant: TDK Corporation
Inventor： Akira MOTOHASHI , Naoaki FUJII , Tomonaga NISHIKAWA , Hiroki NAKAGOMI , Takuya TAKEUCHI
Abstract: Disclosed herein is a coil component that includes plural conductor layers embedded in the magnetic element body. Each of the conductor layers includes a coil pattern, and first and second connection patterns exposed from the magnetic element body. The conductor layers includes a first conductor layer positioned at one end portion in the stacking direction, a second conductor layer positioned at the other end portion in the stacking direction, and one or more third conductor layers positioned between the first and second conductor layers. In the second conductor layer, an outer peripheral end of the coil pattern is connected to the second connection pattern through a lead-out pattern. In at least one of the first to third conductor layers, the magnetic element body is disposed in a separation area overlapping the lead-out pattern in the stacking direction.
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3.发明申请公开(公告)号：US20200161199A1
公开(公告)日：2020-05-21
申请号：US16550995
申请日：2019-08-26
Applicant: TDK CORPORATION
Inventor： Kazutoshi TSUYUTANI , Yoshihiro SUZUKI , Akira MOTOHASHI
Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
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公开(公告)号：US20250125077A1
公开(公告)日：2025-04-17
申请号：US18911587
申请日：2024-10-10
Applicant: TDK Corporation
Inventor： Akira MOTOHASHI , Naoaki FUJII , Tomonaga NISHIKAWA , Masahiro FUKUYAMA
Abstract: Disclosed herein is a coil component that includes a plurality of conductor layers embedded in a magnetic element The plurality of conductor layers include a first body. conductor layer positioned at one end portion in a stacking direction, a second conductor layer positioned at another end portion in the stacking direction, and one or more third conductor layers positioned between the first and second conductor layers. The first conductor layer includes a first coil pattern and first and second connection patterns exposed from the mounting surface. The second and third conductor layers include second and third coil patterns, respectively, and third and fourth connection patterns, respectively, exposed from the mounting surface. The magnetic element body is disposed in an end area that overlaps the first connection pattern in a plan view as viewed in the stacking direction.
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公开(公告)号：US20240062949A1
公开(公告)日：2024-02-22
申请号：US18366316
申请日：2023-08-07
Applicant: TDK Corporation
Inventor： Masaki ENDO , Tomonaga NISHIKAWA , Mitsuru MIURA , Eisuke YONEKURA , Akira MOTOHASHI
IPC: H01F27/29
CPC classification number: H01F27/292
Abstract: Disclosed herein is a coil component that includes a coil conductor embedded in the element body; a first bump conductor exposed to the mounting surface and the first and side surfaces; a second bump conductor exposed to the mounting surface and the second and fourth side surfaces; a first dummy bump conductor exposed to the mounting surface and the first and fourth side surfaces; a second dummy bump conductor exposed to the mounting surface and the second and third side surfaces; a first conductive resin layer connecting the first bump conductor and first dummy bump conductor; and a second conductive resin layer connecting the second bump conductor and the second dummy bump conductor. The first and bump conductors and the first and second dummy bump conductors are not covered at least partly with the first conductive resin layer.
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公开(公告)号：US20230352233A1
公开(公告)日：2023-11-02
申请号：US18245413
申请日：2021-09-07
Applicant: TDK Corporation
Inventor： Masanori SUZUKI , Nobuya TAKAHASHI , Akira MOTOHASHI , Naoaki FUJII , Masaki YONEYAMA , Tomonaga NISHIKAWA
CPC classification number: H01F27/323 , H01F17/0013 , H01F41/041 , H01F41/122 , H01F2017/0073
Abstract: A coil component includes a coil part having a structure in which interlayer insulating films 51 to 55 and coil patterns CP1 to CP4 are alternately stacked in the coil axis direction and magnetic element bodies M1 to M4 embedding therein the coil part. A radial width of a part of the interlayer insulating film that is positioned between the magnetic element body M1 positioned in the inner diameter area of the coil part and the innermost turn of the coil pattern CP4 is larger than radial widths L11, L21, and L31 of parts of the interlayer insulating films 52 to 54 that are positioned between the magnetic element body M1 and the innermost turns of the coil patterns CP1 to CP3.
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