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    PHOTOSENSITIVE POLYIMIDE COMPOSITION, BASE AGENT THEREOF, METHOD OF MAKING THE BASE AGENT, AND SOLDER-RESISTANT POLYIMIDE THIN FILM MADE FROM THE COMPOSITION
    2.
    发明申请
    PHOTOSENSITIVE POLYIMIDE COMPOSITION, BASE AGENT THEREOF, METHOD OF MAKING THE BASE AGENT, AND SOLDER-RESISTANT POLYIMIDE THIN FILM MADE FROM THE COMPOSITION 有权
    感光性聚酰亚胺组合物，其基础代理，制备基剂的方法和由组合物制成的耐电极聚酰亚胺薄膜

    公开(公告)号：US20160018733A1

    公开(公告)日：2016-01-21

    申请号：US14332904

    申请日：2014-07-16

    Applicant: TAIFLEX SCIENTIFIC CO., LTD.

    Inventor： Shih-Chang Lin ,  Hsiu-Ming Chang ,  Tzu-Ching Hung

    IPC: G03F7/038 ,  C08F283/04

    CPC classification number: G03F7/0387 ,  C08F283/04 ,  C08F299/024 ,  C08G73/1014 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1082 ,  C08G73/14 ,  C08L77/06 ,  C08L79/08 ,  C09D179/08 ,  C09J179/08 ,  C09J2479/08 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0388 ,  C08L63/00 ,  C08K5/353

    Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.

    Abstract translation: 光敏聚酰亚胺组合物; 组合物包含基剂和包含光引发剂的固化剂。 通过将具有长碳链的脂族二胺单体和分别具有两端的主链碳原子和双环氧基的接枝单体分别与制备该基剂的方法相同， 可以将基础剂和固化剂丝网印刷以在铜箔上形成感光性聚酰亚胺膜。 此外，感光性聚酰亚胺膜可以以低曝光能量曝光，并且可以在暴露后通过弱碱性显影剂显影成耐焊料聚酰亚胺薄膜。 此外，耐焊料聚酰亚胺薄膜具有低介电常数，低介电损耗，良好的阻燃性，良好的阻焊性和良好的铅笔硬度。 因此，光敏聚酰亚胺组合物可应用于高密度柔性印刷电路板。

    THERMALLY CURABLE SOLDER-RESISTANT INK AND METHOD OF MAKING THE SAME
    3.
    发明申请
    THERMALLY CURABLE SOLDER-RESISTANT INK AND METHOD OF MAKING THE SAME 有权
    耐热耐焊锡塞及其制造方法

    公开(公告)号：US20150322274A1

    公开(公告)日：2015-11-12

    申请号：US14270413

    申请日：2014-05-06

    Applicant: TAIFLEX SCIENTIFIC CO., LTD.

    Inventor： Hsiu-Ming Chang ,  Shih-Chang Lin ,  Tzu-Ching Hung

    IPC: C09D11/102

    CPC classification number: C09D11/102 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/05

    Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

    Abstract translation: 一种制备耐热可焊性耐油墨的方法，包括以下步骤：聚合具有长碳链的脂族二胺单体，芳族二酐单体，具有羧基的芳族二胺单体和具有羧酸的酸酐单体 将其置于非质子溶剂中以获得多胺酸; 环化多胺酸得到改性聚酰亚胺; 并将改性聚酰亚胺和固化剂混合，得到可热固化的耐焊料油墨。 通过上述步骤，由该方法制成的可热固化的耐焊锡墨水具有小于3.00的介电常数和小于0.01的介电损耗，因此可应用于高频电子设备。 另外，可热固化的耐焊锡墨水具有良好的电气性能，耐折叠性，耐焊接性，耐翘曲性，阻燃性，耐酸性，耐碱性，耐溶剂性和低吸水性。

    METHOD OF TRANSFERRING MICRO DEVICE
    4.
    发明申请
    METHOD OF TRANSFERRING MICRO DEVICE 审中-公开

    公开(公告)号：US20190103274A1

    公开(公告)日：2019-04-04

    申请号：US15826728

    申请日：2017-11-30

    Applicant: TAIFLEX Scientific Co., Ltd.

    Inventor： Hsiu-Ming Chang ,  Po-Wen Lin ,  Tsung-Tai Hung

    IPC: H01L21/263 ,  H01L27/15 ,  H01L21/67 ,  H01L33/00

    Abstract: A method of transferring micro devices is provided. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closer to the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.

    Thermally curable solder-resistant ink and method of making the same
    7.
    发明授权
    Thermally curable solder-resistant ink and method of making the same 有权
    耐热可焊性耐油墨及其制造方法

    公开(公告)号：US09279057B2

    公开(公告)日：2016-03-08

    申请号：US14270413

    申请日：2014-05-06

    Applicant: TAIFLEX SCIENTIFIC CO., LTD.

    Inventor： Hsiu-Ming Chang ,  Shih-Chang Lin ,  Tzu-Ching Hung

    IPC: C08L63/00 ,  C08L79/08 ,  C09D11/102

    CPC classification number: C09D11/102 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/05

    Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic acid group, and an anhydride monomer having a carboxylic acid group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a polyimide; and mixing the polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

    Abstract translation: 一种制造耐热可焊性耐油墨的方法，包括以下步骤：聚合具有长碳链的脂族二胺单体，芳族二酐单体，具有羧酸基团的芳族二胺单体和具有 羧酸基团，得到多胺酸; 环化多胺酸得到聚酰亚胺; 并将聚酰亚胺和固化剂混合以得到可热固化的耐焊油墨。 通过上述步骤，由该方法制成的可热固化的耐焊锡墨水具有小于3.00的介电常数和小于0.01的介电损耗，因此可应用于高频电子设备。 另外，可热固化的耐焊锡墨水具有良好的电气性能，耐折叠性，耐焊接性，耐翘曲性，阻燃性，耐酸性，耐碱性，耐溶剂性和低吸水性。

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