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公开(公告)号：US10330871B2
公开(公告)日：2019-06-25
申请号：US14996001
申请日：2016-01-14
Applicant: Skorpios Technologies, Inc.
Inventor： Amit Mizrahi , Timothy Creazzo , Elton Marchena , Derek Van Orden , Stephen B. Krasulick
Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.
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公开(公告)号：US10200131B2
公开(公告)日：2019-02-05
申请号：US15947555
申请日：2018-04-06
Applicant: Skorpios Technologies, Inc.
Inventor： Stephen B. Krasulick , Timothy Creazzo , Kalpit Jha , Elton Marchena , Amit Mizrahi
IPC: H04B10/00 , H04B10/556 , H04B10/50 , H04L27/20 , H04J14/02 , H04B10/564 , H04B10/079 , H04J14/00
Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.
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公开(公告)号：US09960854B2
公开(公告)日：2018-05-01
申请号：US15274714
申请日：2016-09-23
Applicant: Skorpios Technologies, Inc.
Inventor： Stephen B. Krasulick , Timothy Creazzo , Kalpit Jha , Elton Marchena , Amit Mizrahi
IPC: H04B10/00 , H04B10/556 , H04L27/20 , H04B10/079 , H04B10/564 , H04J14/02 , H04B10/50 , H04J14/00
CPC classification number: H04B10/5561 , H04B10/07955 , H04B10/5053 , H04B10/564 , H04J14/0227 , H04L27/2096
Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.
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公开(公告)号：US09923105B2
公开(公告)日：2018-03-20
申请号：US14509975
申请日：2014-10-08
Applicant: Skorpios Technologies, Inc.
Inventor： Stephen B. Krasulick , John Dallesasse , Amit Mizrahi , Timothy Creazzo , Elton Marchena , John Y. Spann
IPC: H01L31/0232 , H01S5/022 , H01S5/026 , H01S5/30 , H01S5/02
CPC classification number: H01L31/02327 , G02B6/423 , H01S5/0207 , H01S5/021 , H01S5/0217 , H01S5/0218 , H01S5/0224 , H01S5/02248 , H01S5/02252 , H01S5/02268 , H01S5/02272 , H01S5/02469 , H01S5/026 , H01S5/3013 , H01S2301/176
Abstract: A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.
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公开(公告)号：US09324682B2
公开(公告)日：2016-04-26
申请号：US14262529
申请日：2014-04-25
Applicant: Skorpios Technologies, Inc.
Inventor： Elton Marchena , John Y. Spann , Timothy Creazzo , Stephen B. Krasulick , Amit Mizrahi
CPC classification number: H01L24/83 , G02B6/423 , G02B6/4238 , H01L23/13 , H01L24/29 , H01L24/32 , H01L2224/29036 , H01L2224/29109 , H01L2224/8114 , H01L2224/8314 , H01L2224/83193 , H01L2224/83345 , H01L2924/12042 , H01L2924/01046 , H01L2924/00
Abstract: A method of fabricating a composite semiconductor structure is provided. Pedestals are formed in a recess of a first substrate. A second substrate is then placed within the recess in contact with the pedestals. The pedestals have a predetermined height so that a device layer within the second substrate aligns with a waveguide of the first substrate, where the waveguide extends from an inner wall of the recess.
Abstract translation: 提供一种制造复合半导体结构的方法。 基座形成在第一基板的凹部中。 然后将第二基板放置在与基座接触的凹部内。 基座具有预定的高度，使得第二基板内的装置层与第一基板的波导对准，其中波导从凹部的内壁延伸。
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Patent Agency Ranking
公开(公告)号：US20150378097A1
公开(公告)日：2015-12-31
申请号：US14755545
申请日：2015-06-30
Applicant: Skorpios Technologies, Inc.
Inventor： Amit Mizrahi , Timothy Creazzo , Elton Marchena , Derek Van Orden , Stephen B. Krasulick
CPC classification number: G02B6/4206 , G02B6/122 , G02B6/14 , G02B6/26 , G02B6/2804 , G02B2006/12097 , G02B2006/12147 , H01S5/026 , H01S5/3013
Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.
Abstract translation: 波导耦合器包括第一波导和第二波导。 波导耦合器还包括布置在第一波导和第二波导之间的连接波导。 连接波导包括具有第一折射率的第一材料和具有高于第一折射率的第二折射率的第二材料。
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公开(公告)号：US20150261064A1
公开(公告)日：2015-09-17
申请号：US14604097
申请日：2015-01-23
Applicant: Skorpios Technologies, Inc.
Inventor： Lina He , Amit Mizrahi
CPC classification number: G02F1/2257 , G02B6/2746 , G02B27/4244 , G02F1/0955 , G02F1/3136 , G02F2001/212
Abstract: An optical circulator includes a first optical isolator including a first port and a second port and a plurality of optical isolators coupled to the second port of the first optical isolator. Each of the plurality of optical isolators comprise a first port and a second port.
Abstract translation: 光环行器包括第一光隔离器，其包括第一端口和第二端口以及耦合到第一光隔离器的第二端口的多个光隔离器。 多个光隔离器中的每一个包括第一端口和第二端口。
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8.发明申请公开(公告)号：US20150097210A1
公开(公告)日：2015-04-09
申请号：US14509971
申请日：2014-10-08
Applicant: Skorpios Technologies, Inc.
Inventor： Stephen B. Krasulick , John Dallesasse , Amit Mizrahi , Timothy Creazzo , Elton Marchena , John Y. Spann
IPC: H01L31/109 , H01L31/0203 , H01L31/0304
CPC classification number: H01L31/02327 , G02B6/423 , H01S5/0207 , H01S5/021 , H01S5/0217 , H01S5/0218 , H01S5/0224 , H01S5/02248 , H01S5/02252 , H01S5/02268 , H01S5/02272 , H01S5/02469 , H01S5/026 , H01S5/3013 , H01S2301/176
Abstract: A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.
Abstract translation: 一种制造复合器件的方法包括提供平台，提供芯片，以及将芯片粘合到平台上。 该平台具有基层和基层之上的器件层。 设备层中的开口露出基层的一部分。 芯片通过器件层中的开口暴露在基底层的部分上。 芯片的一部分在平台上方延伸并被移除。
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公开(公告)号：US20140319656A1
公开(公告)日：2014-10-30
申请号：US14262529
申请日：2014-04-25
Applicant: Skorpios Technologies, Inc.
Inventor： Elton Marchena , John Y. Spann , Timothy Creazzo , Stephen B. Krasulick , Amit Mizrahi
IPC: H01L23/00
CPC classification number: H01L24/83 , G02B6/423 , G02B6/4238 , H01L23/13 , H01L24/29 , H01L24/32 , H01L2224/29036 , H01L2224/29109 , H01L2224/8114 , H01L2224/8314 , H01L2224/83193 , H01L2224/83345 , H01L2924/12042 , H01L2924/01046 , H01L2924/00
Abstract: A method of fabricating a composite semiconductor structure is provided. Pedestals are formed in a recess of a first substrate. A second substrate is then placed within the recess in contact with the pedestals. The pedestals have a predetermined height so that a device layer within the second substrate aligns with a waveguide of the first substrate, where the waveguide extends from an inner wall of the recess.
Abstract translation: 提供一种制造复合半导体结构的方法。 基座形成在第一基板的凹部中。 然后将第二基板放置在与基座接触的凹部内。 基座具有预定的高度，使得第二基板内的装置层与第一基板的波导对准，其中波导从凹部的内壁延伸。
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公开(公告)号：US09882073B2
公开(公告)日：2018-01-30
申请号：US14509979
申请日：2014-10-08
Applicant: Skorpios Technologies, Inc.
Inventor： Stephen B. Krasulick , John Dallesasse , Amit Mizrahi , Timothy Creazzo , Elton Marchena , John Y. Spann
IPC: H01L31/102 , H01L31/0232 , H01S5/022 , H01S5/026 , H01S5/30 , H01S5/02
CPC classification number: H01L31/02327 , G02B6/423 , H01S5/0207 , H01S5/021 , H01S5/0217 , H01S5/0218 , H01S5/0224 , H01S5/02248 , H01S5/02252 , H01S5/02268 , H01S5/02272 , H01S5/02469 , H01S5/026 , H01S5/3013 , H01S2301/176
Abstract: A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.
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