公开(公告)号：US20220068867A1

公开(公告)日：2022-03-03

申请号：US17102841

申请日：2020-11-24

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

公开(公告)号：US20220068801A1

公开(公告)日：2022-03-03

申请号：US17101277

申请日：2020-11-23

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

公开(公告)号：US20240162180A1

公开(公告)日：2024-05-16

申请号：US18413887

申请日：2024-01-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/17 ,  H01L21/56 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/13005 ,  H01L2224/13083 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/24227 ,  H01L2224/73209 ,  H01L2224/92124

Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

公开(公告)号：US11984393B2

公开(公告)日：2024-05-14

申请号：US17101277

申请日：2020-11-23

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L21/768 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L25/065

CPC classification number: H01L23/5226 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L23/31 ,  H01L24/14

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

公开(公告)号：US20240379534A1

公开(公告)日：2024-11-14

申请号：US18623879

申请日：2024-04-01

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/522 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

公开(公告)号：US12009340B2

公开(公告)日：2024-06-11

申请号：US17481610

申请日：2021-09-22

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lung-Yuan Wang ,  Feng Kao ,  Mao-Hua Yeh

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L25/0652 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L25/16 ,  H01L25/50

Abstract: An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.

公开(公告)号：US11973047B2

公开(公告)日：2024-04-30

申请号：US17102841

申请日：2020-11-24

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/17 ,  H01L21/56 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/13005 ,  H01L2224/13083 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/24227 ,  H01L2224/73209 ,  H01L2224/92124

Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

公开(公告)号：US20230260886A1

公开(公告)日：2023-08-17

申请号：US17726163

申请日：2022-04-21

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/498 ,  H01L23/367 ,  H01L21/48 ,  H01L23/14

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/0655

Abstract: An electronic package is provided, in which a circuit structure is disposed on the uppermost side of a plurality of stacked organic material substrates for connecting an electronic element, so that a line width/line spacing of a redistribution layer of the circuit structure conforms with a line width/line spacing of the electronic element. Therefore, when the size specification of the electronic element is designed to be miniaturized, the redistribution layer configured in the circuit structure can effectively match the line spacing/line width of the electronic element, so as to meet the requirements of miniaturized packaging.

公开(公告)号：US20240162140A1

公开(公告)日：2024-05-16

申请号：US18389105

申请日：2023-11-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/522 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5226 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L23/31 ,  H01L24/14

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

公开(公告)号：US20230420391A1

公开(公告)日：2023-12-28

申请号：US17944453

申请日：2022-09-14

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  G02B6/12 ,  G02B6/13

CPC classification number: H01L23/564 ,  H01L23/49811 ,  H01L23/3185 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L21/563 ,  G02B6/12 ,  G02B6/13 ,  H01L23/49827 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  G02B2006/121

Abstract: An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, such that the external connection portion is exposed from the hollow area and the cladding layer for an optical fiber to insert into the hollow area and connect to the external connection portion, so as to achieve the purpose of optoelectronic integration.