Abstract:
A vibrating element includes: an element plate that has a vibrating portion that performs thickness-shear vibration, a peripheral portion that is integrally formed with the vibrating portion, and a protruding portion that is provided at the peripheral portion; and an excitation electrode that is provided at the vibrating portion. When a side length of the vibrating portion is Mx, when a side length of the excitation electrode is Ex, and when a wavelength of flexure vibrations of the element plate is λ, the relationship of (Mx−Ex)/2=λ/2, and Mx/2={(A/2)+(¼)}λ (where, A is a positive integer) is satisfied, and when a length of the protruding portion is Dx, and when a distance between the vibrating portion and the protruding portion is Sx, the relationship of Dx=λ/2)×m, and (λ/2)×n−0.1λ≦Sx≦(λ/2)×n+0.1λ (where m and n are positive integers) is satisfied.
Abstract:
A vibrator device includes a base, a relay substrate supported by the base, and a vibrating element supported by the relay substrate, the relay substrate includes a base mount that is directly or indirectly fixed to the base, a vibrating element mount on which the vibrating element is mounted, and a beam that couples the base mount and the vibrating element mount, and parts of the vibrating element mount that are coupled to the vibrating element are positioned on both sides of the base mount while interposing the base mount therebetween in a plan view.
Abstract:
A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view. The vibrator device being configured to reduce a mounting stress applied to a vibrator element and to reduce frequency variation of the vibrator element due to the mounting stress, in a case of mounting on a package after adjusting a frequency of the vibrator element.
Abstract:
A vibrator device includes abase, a circuit element that is attached to the base, and a vibrator element that is arranged at an active surface of the circuit element and is attached to the circuit element, and the circuit element includes a terminal for frequency adjustment that is used for frequency adjustment of the vibrator element and is disposed in a region that does not overlap the vibrator element when viewed in a plan view of the active surface.
Abstract:
A vibrator device includes a base, a relay substrate that is supported by the base, and a vibrator element that is supported by the relay substrate. In addition, the vibrator element includes a vibration substrate formed of a piezoelectric single-crystalline body and an excitation electrode disposed on the vibration substrate. In addition, the relay substrate includes a substrate formed of the piezoelectric single-crystalline body. A crystal axis of the substrate and a crystal axis of the vibration substrate are shifted from each other.
Abstract:
A vibrator device includes a base; and a vibrator element including a quartz crystal vibrator element attached to the base via a first metal bump, in which the first metal bump is disposed on a straight line inclined within a range of +55° to +65° or −65° to −55° with respect to an X axis of the quartz crystal constituting the quartz crystal vibrator element in plan view seen from a direction in which the base and the quartz crystal vibrator element are arranged.
Abstract:
A vibration device including a vibrator, a circuit component, a relay substrate disposed between the vibrator and the circuit component, a package that accommodates the vibrator, the circuit component, and the relay substrate, a first metal bump that joins the circuit component to the package, a second metal bump that joins the relay substrate to the circuit component, and a third metal bump that joins the vibrator to the relay substrate.
Abstract:
A vibration device includes a vibration element that has a plurality of terminals, a base that has a plurality of electrical connection terminals, and a board that has a wiring portion which electrically connects the plurality of electrical connection terminal and the plurality of terminals to each other, and that supports the vibration element with respect to the base. The board has a base fixing portion fixed to the base, a vibration element mounting portion on which the vibration element is mounted, and at least one beam portion which couples the base fixing portion and the vibration element mounting portion to each other. At least the one beam portion has a first portion which extends in a first direction and a second portion which extends in a second direction intersecting the first direction.
Abstract:
An oscillator includes a resonation element, a temperature sensitive element, a first package that houses the resonation element and the temperature sensitive element and is airtightly sealed, and a second package that houses the first package and is airtightly sealed. The first package includes a first base having a first recessed portion that is provided on one main surface side and a first lid that is joined to the first base so as to close an opening of the first recessed portion. The second package includes a second base having a second recessed portion that is provided on one main surface side and a second lid that is joined to the second base so as to close an opening of the second recessed portion.
Abstract:
An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.