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    Method for metallic finish coating
    3.
    发明授权
    Method for metallic finish coating 失效
    金属涂层方法

    公开(公告)号：US4226901A

    公开(公告)日：1980-10-07

    申请号：US962034

    申请日：1978-11-20

    申请人： Shinji Sugiura ,  Tadashi Watanabe ,  Satoru Ito

    发明人： Shinji Sugiura ,  Tadashi Watanabe ,  Satoru Ito

    IPC分类号： C09D5/38 ,  B05D5/06 ,  B05D7/00 ,  C08L61/20 ,  C09D133/04 ,  C09D133/10 ,  B05D3/02

    CPC分类号： B05D7/532 ,  B05D5/068 ,  C09D133/10 ,  C08L61/20

    摘要： In a method for applying a metallic finish coat to a substrate which comprises applying a base coat composed of a metallic paint containing a thermosetting resin as a film-forming ingredient to a substrate, applying a top coat composed of a clear paint containing a thermosetting resin as a film-forming ingredient to the surface of the base coat, and heating both the base coat and top coat to cure them, the improvement wherein the film-forming ingredient of the clear paint in the top coat comprises (A) an acrylic resin having a number average molecular weight of 5,000 to 15,000 and a glass transition temperature of from 5.degree. to 35.degree. C. obtained by copolymerizing (a) 42 to 90 parts by weight of at least one methacrylate selected from alkyl methacrylates with the alkyl moiety having 4 to 18 carbon atoms and (b) 10 to 58 parts by weight of a monomer having an ethylenically unsaturated bond and a hydroxyl group in the molecule, the total amount of components (a) and (b) being 100 parts by weight, and (B) an aminoaldehyde resin, the weight ratio of the acrylic resin (A) to the aminoaldehyde resin (B) being from 80:20 to 65:35.

    摘要翻译： 在将金属涂层涂布在基材上的方法中，其包括将由含有热固性树脂的金属涂料构成的底涂层作为成膜剂施用到基材上，涂布由含有热固性树脂的透明涂料 作为底涂层表面的成膜成分，并且加热底涂层和顶涂层以固化它们，其中顶涂层中的透明涂料的成膜成分包括（A）丙烯酸树脂 通过共聚合（a）42至90重量份的至少一种选自甲基丙烯酸烷基酯的甲基丙烯酸酯的甲基丙烯酸酯与烷基部分具有共聚合而获得的数均分子量为5,000至15,000，玻璃化转变温度为5至35℃ 4至18个碳原子，和（b）10至58重量份的分子中具有烯键式不饱和键和羟基的单体，组分（a）和（b）的总量为100份b （B）氨基甲醛树脂，丙烯酸树脂（A）与氨基甲醛树脂（B）的重量比为80:20〜65:35。

    FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME
    4.
    发明申请
    FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME 有权
    场效应晶体管及其制造方法

    公开(公告)号：US20110215383A1

    公开(公告)日：2011-09-08

    申请号：US13104537

    申请日：2011-05-10

    申请人： Tadashi Watanabe ,  Hajime Matsuda

    发明人： Tadashi Watanabe ,  Hajime Matsuda

    IPC分类号： H01L29/812

    CPC分类号： H01L29/7787 ,  H01L21/28581 ,  H01L21/28587 ,  H01L29/205 ,  H01L29/42316 ,  H01L29/475 ,  H01L29/8128

    摘要： A method for fabricating a field effect transistor includes: forming an insulating film provided on a semiconductor layer, the insulating film having an opening via which a surface of the semiconductor layer is exposed and including silicon oxide; forming a Schottky electrode on the insulating film and in the opening, the Schottky electrode having an overhang portion and having a first contact layer that is provided in a region contacting the insulating film and contains oxygen, and a second contact layer that is provided on the first contact layer and contains a smaller content of oxygen than that of the first contact layer; and removing the insulating film by a solution including hydrofluoric acid

    摘要翻译： 一种用于制造场效应晶体管的方法，包括：形成设置在半导体层上的绝缘膜，所述绝缘膜具有暴露所述半导体层的表面并且包括氧化硅的开口; 在所述绝缘膜上和所述开口中形成肖特基电极，所述肖特基电极具有突出部分，并且具有设置在与所述绝缘膜接触并包含氧的区域中的第一接触层，以及设置在所述绝缘膜上的第二接触层 第一接触层并且含有比第一接触层的氧更小的氧含量; 并通过包含氢氟酸的溶液除去绝缘膜

    Electrical wiring structure, electro-optical device, and electronic apparatus
    5.
    发明授权
    Electrical wiring structure, electro-optical device, and electronic apparatus 有权
    电气布线结构，电光装置和电子设备

    公开(公告)号：US07212272B2

    公开(公告)日：2007-05-01

    申请号：US10782402

    申请日：2004-02-19

    申请人： Kazuyoshi Sakai ,  Tadashi Watanabe

    发明人： Kazuyoshi Sakai ,  Tadashi Watanabe

    IPC分类号： G02F1/1345

    CPC分类号： G02F1/136286 ,  G02F1/1345 ,  G02F2001/13629

    摘要： An electro-optical device and an electronic apparatus are provided with reduced wiring resistance. A second wiring pattern for connecting an upper wiring connected to a mounting terminal to a first inter-substrate conducting terminal includes a base electrode. An inorganic insulating film is not attached to the sides of the base electrode. As a result, the upper wiring on each side of the base electrode and the first inter-substrate conducting terminal are electrically connected to the base electrode through the sides. The path from the mounting terminal to the first inter-substrate conducting terminal is formed in the order of upper wiring, one side of the base electrode, base electrode, the other side of the base electrode, and then the first inter-substrate conducting terminal. The second wiring pattern uses the base electrode formed of a metal film to sharply reduce wiring resistance.

    摘要翻译： 电光装置和电子设备具有降低的布线电阻。 用于将连接到安装端子的上部布线连接到第一基板间导电端子的第二布线图案包括基极。 无机绝缘膜不附着在基极侧。 结果，基极和第一基板间导电端子的每一侧的上部布线通过侧面电连接到基极。 从安装端子到第一基板间导电端子的路径按照上布线，基极的一侧，基底电极，基极的另一侧的顺序形成，然后形成第一基板间导电端子 。 第二布线图案使用由金属膜形成的基极电极，以显着降低布线电阻。