公开(公告)号：US20180053295A1

公开(公告)日：2018-02-22

申请号：US15417558

申请日：2017-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Yoon Ryu ,  Joon-Seo Song ,  Yu-Sin Yang ,  Chung-Sam Jun ,  Yun-Jung Jee

IPC: G06T7/00 ,  G06T7/11 ,  G06T7/174 ,  G02B21/00 ,  G01N23/225 ,  G01N21/956 ,  G01N21/95 ,  H01J37/22

Abstract: In a defect inspection method, first and second inspection conditions having a first sensitivity of detection signal and having a second sensitivity of a detection signal for a defect of interest (DOI), respectively, are determined. The first and second sensitivities are different. First and second images of the same detection region on a substrate surface under the first and second inspection conditions respectively, are obtained. The first and second images are matched to detect a defect in the detection region.

公开(公告)号：US10593032B2

公开(公告)日：2020-03-17

申请号：US15417558

申请日：2017-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Yoon Ryu ,  Joon-Seo Song ,  Yu-Sin Yang ,  Chung-Sam Jun ,  Yun-Jung Jee

IPC: G01N21/95 ,  G01N21/88 ,  G06K9/00 ,  G01B11/00 ,  G06T7/00 ,  G01N21/956 ,  H01L21/66 ,  G02B21/00 ,  G06T7/11 ,  G06T7/174 ,  G01N23/2251 ,  H01J37/22

Abstract: In a defect inspection method, first and second inspection conditions having a first sensitivity of detection signal and having a second sensitivity of a detection signal for a defect of interest (DOI), respectively, are determined. The first and second sensitivities are different. First and second images of the same detection region on a substrate surface under the first and second inspection conditions respectively, are obtained. The first and second images are matched to detect a defect in the detection region.

公开(公告)号：US10527556B2

公开(公告)日：2020-01-07

申请号：US15795592

申请日：2017-10-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min-Ho Rim ,  Jung-Soo Kim ,  Young-Hoon Sohn ,  Yu-Sin Yang ,  Chung-Sam Jun ,  Yun-Jung Jee

IPC: G01N21/88 ,  H01L21/28 ,  G01N21/95 ,  G06T7/00 ,  H01L27/11556 ,  H01L21/66 ,  G02B27/09 ,  H01L27/11582 ,  G02B5/00

Abstract: An optical measuring method includes generating a Bessel beam, filtering the Bessel beam to generate a focused Bessel beam, vertically irradiating the focused Bessel beam onto a substrate in which an opening is formed, and detecting light reflected from the substrate to obtain an image of a bottom surface of the opening.