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1.发明公开公开(公告)号：US20230174429A1
公开(公告)日：2023-06-08
申请号：US18076062
申请日：2022-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changhwan KIM , Takafumi Noguchi , Toshihiro IIzuka , Younseon Wang , Kenichi Nagayama
IPC: C04B35/553 , C04B35/645
CPC classification number: C04B35/553 , C04B35/645 , C04B2235/76 , C04B2235/77 , C04B2235/445 , C04B2235/656 , C04B2235/666 , C04B2235/786 , C04B2235/5436 , C04B2235/5445 , H01L21/68757
Abstract: Provided are a sintered material having high corrosion resistance, a method of manufacturing the sintered material, a member for a semiconductor manufacturing apparatus, a method of manufacturing a member for a semiconductor manufacturing apparatus, a semiconductor manufacturing apparatus, and a method of manufacturing a semiconductor manufacturing apparatus. The sintered material according to an embodiment includes 50 mass% or more of yttrium oxyfluoride, has a relative density of 97.0% or more, and has a Vickers hardness of 5.0 GPa or more. The method of manufacturing a sintered material according to an embodiment includes forming a molded body including yttrium oxyfluoride powder having a particle size of 0.3 µm or less, and sintering the molded body under an atmospheric pressure at a temperature of 800° C. or less.
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公开(公告)号：US20240213071A1
公开(公告)日：2024-06-27
申请号：US18396553
申请日：2023-12-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junho IM , Younseon Wang , Yongwoo Kim , Taehwa Kim , Inseok Seo , Kiseok Lee
IPC: H01L21/683 , H01J37/32
CPC classification number: H01L21/6833 , H01J37/32715
Abstract: An electrostatic chuck includes an electrostatic chuck body having a step portion protruding from a lower end, an adhesive layer disposed on an upper surface of the electrostatic chuck body, a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body, and a sealant disposed between the step portion and the edge of the ceramic puck and configured to block reaction gas from permeating into the adhesive layer. The sealant includes a coating layer disposed on an external surface thereof, and the coating layer includes a metal oxide including a single rare earth oxide and/or a multilayer heterogeneous metal oxide.
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公开(公告)号：US20250132133A1
公开(公告)日：2025-04-24
申请号：US18640999
申请日：2024-04-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jisoo Im , Dongwan Kim , Minsung Kim , Siyoung Koh , Younseon Wang , Junho Im
Abstract: A substrate processing apparatus comprises a process chamber, a stage in the process chamber, the stage supporting a substrate, and a grid in the process chamber and upwardly spaced apart from the stage. The grid includes a dielectric plate having a central axis that extends in a first direction, a first electrode plate embedded in the dielectric plate, a second electrode plate downwardly spaced apart from the first electrode plate and embedded in the dielectric plate, and a third electrode plate downwardly spaced apart from the second electrode plate and embedded in the dielectric plate.
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公开(公告)号：US20240071737A1
公开(公告)日：2024-02-29
申请号：US18188540
申请日：2023-03-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon Cho , Dohoon Kwon , Kyunghyun Kim , Dougyong Sung , Jungmo Yang , Younseon Wang , Younsok Choi
CPC classification number: H01J37/32917 , G01N9/00 , H01J2237/24585
Abstract: A plasma sensor module may include an upper substrate, a lower substrate, at least one probe and a printed circuit board (PCB). The upper substrate may be configured to be exposed to plasma. The lower substrate may contact a lower surface of the upper substrate. The lower substrate may have a thickness that is thicker than a thickness of the upper substrate. The probe may be in the lower substrate. The PCB may be in the lower substrate. The PCB may be configured to apply an alternating current to the probe to detect a density of the plasma. Thus, the structural strength of the plasma sensor module may have improved structural strength.
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