公开(公告)号：US20240071737A1

公开(公告)日：2024-02-29

申请号：US18188540

申请日：2023-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungwon Cho ,  Dohoon Kwon ,  Kyunghyun Kim ,  Dougyong Sung ,  Jungmo Yang ,  Younseon Wang ,  Younsok Choi

IPC: H01J37/32 ,  G01N9/00

CPC classification number: H01J37/32917 ,  G01N9/00 ,  H01J2237/24585

Abstract: A plasma sensor module may include an upper substrate, a lower substrate, at least one probe and a printed circuit board (PCB). The upper substrate may be configured to be exposed to plasma. The lower substrate may contact a lower surface of the upper substrate. The lower substrate may have a thickness that is thicker than a thickness of the upper substrate. The probe may be in the lower substrate. The PCB may be in the lower substrate. The PCB may be configured to apply an alternating current to the probe to detect a density of the plasma. Thus, the structural strength of the plasma sensor module may have improved structural strength.

公开(公告)号：US20240274418A1

公开(公告)日：2024-08-15

申请号：US18455949

申请日：2023-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Protopopov Vladimir ,  Dohoon Kwon ,  Sangki Nam ,  Dougyong Sung ,  Sungwon Cho

IPC: H01J37/32

CPC classification number: H01J37/32972 ,  H01J2237/24564

Abstract: An apparatus for measuring real-time plasma density includes, at least one plasma density measurement sensor in a process chamber, the at least one plasma density measurement sensor being configured to sense a plasma current between a first electrode and a second electrode when plasma is generated, and to generate an optical signal in response to the plasma current, and an optical signal detector on a side surface of the process chamber, the optical signal detector being configured to detect the optical signal from the at least one plasma density measurement sensor.