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公开(公告)号：US11510312B2
公开(公告)日：2022-11-22
申请号：US17265888
申请日：2019-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon
Abstract: Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.
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公开(公告)号：US11617257B2
公开(公告)日：2023-03-28
申请号：US17298810
申请日：2021-05-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon
Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.
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公开(公告)号：US12144115B2
公开(公告)日：2024-11-12
申请号：US18084994
申请日：2022-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Dohyeon Kim , Byeongkeol Kim , Jinsu Kim , Seokjoon Park , Jungje Bang , Hoyeon Seo , Jongbum Lee , Jongmin Jeon
Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder.
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公开(公告)号：US11564311B2
公开(公告)日：2023-01-24
申请号：US17171461
申请日：2021-02-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Byeongkeol Kim , Yeongjin Lee , Jongmin Jeon , Jaeyoub Jung , Eunseok Hong
Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.
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公开(公告)号：US12144109B2
公开(公告)日：2024-11-12
申请号：US17967532
申请日：2022-10-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Sungwon Park , Eunseok Hong
Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.
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Patent Agency Ranking
公开(公告)号：US11523507B2
公开(公告)日：2022-12-06
申请号：US17267651
申请日：2019-08-09
Applicant: Samsung Electronics Co., Ltd. , SI FLEX CO., LTD.
Inventor： Sungwon Park , Junghyub Kim , Hwanyoul Jeong , Seungyup Lee , Youngsun Lee , Hesuk Jung , Eunseok Hong
Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.
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公开(公告)号：US20220151070A1
公开(公告)日：2022-05-12
申请号：US17587580
申请日：2022-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon , Donggon Jang , Kisoo Jung , Seounghyun Hong , Hyunsung Hwang
Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.
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公开(公告)号：US12273992B2
公开(公告)日：2025-04-08
申请号：US17861630
申请日：2022-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun Lee , Jongmin Jeon , Hyunsuk Kim , Kyuwon Choi
Abstract: A flexible printed circuit board (FPCB) of an electronic device including a flexible display having a shape deformed by a hinge structure is provided. The FPCB of an electronic device includes a plurality of bending portions and a plurality of non-bending portions. The plurality of bending portions is bent according to a deformation of a shape of the electronic device. The plurality of non-bending portions are positioned on a periphery of the plurality of bending portions. The plurality of bending portions and the plurality of non-bending portions are formed to have different thicknesses.
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公开(公告)号：US12192392B2
公开(公告)日：2025-01-07
申请号：US17671899
申请日：2022-02-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun Lee , Eunseok Hong
Abstract: According to certain embodiments, an electronic device comprises: a housing having an innerspace; a slide body slidably connected to the housing, the slide-body including an opening and at least one magnetic force generating member disposed in the opening; and a camera module assembly connected rotatably to the opening in the slide body, the camera module assembly including a module housing and at least one camera module disposed in the module housing, wherein the camera module assembly includes at least one magnetic force reactive member disposed to react to a magnetic force of the at least one magnetic force generating member, and wherein the at least one magnetic force reactive member is disposed at a position affected by the magnetic force of the at least one magnetic force generating member when the slide body slides out from the housing or slides in into the housing.
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公开(公告)号：US12185464B2
公开(公告)日：2024-12-31
申请号：US17587580
申请日：2022-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon , Donggon Jang , Kisoo Jung , Seounghyun Hong , Hyunsung Hwang
Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.
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