RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20220151070A1

    公开(公告)日:2022-05-12

    申请号:US17587580

    申请日:2022-01-28

    Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.

    Rigid flexible printed circuit board and electronic device comprising same

    公开(公告)号:US12185464B2

    公开(公告)日:2024-12-31

    申请号:US17587580

    申请日:2022-01-28

    Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.

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