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公开(公告)号:US20220151070A1
公开(公告)日:2022-05-12
申请号:US17587580
申请日:2022-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon , Donggon Jang , Kisoo Jung , Seounghyun Hong , Hyunsung Hwang
Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.
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公开(公告)号:US12185464B2
公开(公告)日:2024-12-31
申请号:US17587580
申请日:2022-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon , Donggon Jang , Kisoo Jung , Seounghyun Hong , Hyunsung Hwang
Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.
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