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    USER EQUIPMENT AND BASE STATION OPERATING BASED ON COMMUNICATION MODEL, AND OPERATING METHOD THEREOF
    1.
    发明公开
    USER EQUIPMENT AND BASE STATION OPERATING BASED ON COMMUNICATION MODEL, AND OPERATING METHOD THEREOF 审中-公开

    公开(公告)号：US20240121773A1

    公开(公告)日：2024-04-11

    申请号：US18481806

    申请日：2023-10-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngseok Jung

    IPC: H04W72/1263 ,  H04W72/23

    CPC classification number: H04W72/1263 ,  H04W72/23

    Abstract: The devices, systems, and techniques described herein provide for efficient integration of machine learning techniques into wireless communication system frameworks. User equipment may perform communication with base stations based on communication models generated through machine learning. Data may be collected from various communication environments to optimize communication models (e.g., to train communication models, provide inputs to communication models, etc.). According to embodiments of the present disclosure, user equipment may update parameters (e.g., parameters for controlling wireless communication systems) to provide the user equipment with various data (e.g., data subsequent to modifying parameters of the wireless communication system) for enabling effective training and implementation of communication models that are implemented based on machine learning. Accordingly, user equipment may efficiently manage communication models based on various data, and user equipment may thus perform communication operations within wireless communication systems with improved performance (e.g., based on the generated and updated optimal communication models).

    Transmission power control of sounding reference signals in wireless communication system and device
    8.
    发明授权
    Transmission power control of sounding reference signals in wireless communication system and device 有权

    公开(公告)号：US11627536B2

    公开(公告)日：2023-04-11

    申请号：US17104245

    申请日：2020-11-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngseok Jung ,  Inhyoung Kim

    IPC: H04W52/32 ,  H04W24/08 ,  H04W52/24

    Abstract: An operating method of a wireless communication device configured to perform wireless communication with a cell. The method involves identifying, from a downlink signal received from the cell, an electromagnetic field state associated with an antenna of the wireless communication device. A power compensation mode for compensating transmission power of a sounding reference signal is selected based on the identified electromagnetic field state. The transmission power of the sounding reference signal is compensated based on the selected power compensation mode. The sounding reference signal is transmitted with the compensated transmission power through the antenna to the cell.

    Wireless communication device and channel estimation method thereof
    9.
    发明授权
    Wireless communication device and channel estimation method thereof 有权

    公开(公告)号：US11533200B2

    公开(公告)日：2022-12-20

    申请号：US17039709

    申请日：2020-09-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hongsik Yoon ,  Jungmin Park ,  Jinho Kim ,  Youngseok Jung

    IPC: H04L25/02 ,  H04W72/04 ,  H04L5/00

    Abstract: The present disclosure relates to a channel estimation method of a wireless communication device. The channel estimation method includes descrambling a pilot signal having a unit symbol, dividing the descrambled pilot signal, and estimating a channel value of the wireless communication device. The descrambled pilot signal may be divided into a plurality of frequency resources with a first frequency resource and a second frequency resource and generating a first signal chunk with the first frequency resource and a second signal chunk with the second frequency resource. The channel value of the wireless communication device may be estimated based on the first signal chunk and the second signal chunk.

    Method of picking up die and method of manufacturing semiconductor package using the same
    10.
    发明授权
    Method of picking up die and method of manufacturing semiconductor package using the same 有权

    公开(公告)号：US12176336B2

    公开(公告)日：2024-12-24

    申请号：US17728462

    申请日：2022-04-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Mi-Jeong Yang ,  Youngseok Jung ,  Jinsung Jung

    IPC: H01L21/677 ,  H01L25/00

    Abstract: A method of picking up a die may include classifying a pickup region of a diced wafer, in which targeted pickup dies are placed, into first to n-th regions and performing a pickup step on dies in the first to n-th regions. The first region may include first dies, which are outermost dies of the targeted pickup dies. An (x+1)-th region may include regions, occupied by dies adjacent to at least one of x-th dies in an x-th region and proximate to a center of the pickup region in relation to the x-th region, n may be a natural number, and x may be an arbitrary natural number that is smaller than the n. The n-th region may have a rectangular shape, and a quantity of n-th dies in the n-th region in contact with a short side of the n-th region may be one or two.

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