公开(公告)号：US11607768B2

公开(公告)日：2023-03-21

申请号：US16515257

申请日：2019-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilcheol Shin ,  Sung-Chang Park ,  Kyoungwoo Kim ,  Young-Kyun Woo ,  Hak-Jae Im

IPC: B24B37/005 ,  B24B57/02 ,  B24B37/34

Abstract: A chemical mechanical polishing apparatus includes a cleaning unit that cleans a substrate, a brushing unit that includes a plurality of roll brushes brushing the substrate and a driver driving the roll brushes, and a controlling unit that controls the driver. The controlling unit includes a time calculator that counts a usage time of the roll brushes, and a drive controller that reduces a distance between the roll brushes, based on the usage time of the roll brushes.

公开(公告)号：US20240149314A1

公开(公告)日：2024-05-09

申请号：US18213853

申请日：2023-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoo Noh ,  Kyoungwoo Kim ,  Youngseok Jung ,  Youngjin Hong ,  Soochan Oh ,  Sungwoo Shin ,  Namhoon Lee ,  Bongju Lee

IPC: B08B13/00 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02

CPC classification number: B08B13/00 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02

Abstract: Provided is a substrate processing apparatus configured to process a substrate having a notch including a plurality of rollers contacting a circumference of the substrate and configured to rotate the substrate, a first sensor configured to sense an impact between the plurality of rollers and the substrate, and a signal processing unit configured to detect revolutions per unit time of the substrate, based on a first sensing signal output by the first sensor.