公开(公告)号：US11607768B2

公开(公告)日：2023-03-21

申请号：US16515257

申请日：2019-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilcheol Shin ,  Sung-Chang Park ,  Kyoungwoo Kim ,  Young-Kyun Woo ,  Hak-Jae Im

IPC: B24B37/005 ,  B24B57/02 ,  B24B37/34

Abstract: A chemical mechanical polishing apparatus includes a cleaning unit that cleans a substrate, a brushing unit that includes a plurality of roll brushes brushing the substrate and a driver driving the roll brushes, and a controlling unit that controls the driver. The controlling unit includes a time calculator that counts a usage time of the roll brushes, and a drive controller that reduces a distance between the roll brushes, based on the usage time of the roll brushes.