公开(公告)号：US12176336B2

公开(公告)日：2024-12-24

申请号：US17728462

申请日：2022-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Jeong Yang ,  Youngseok Jung ,  Jinsung Jung

IPC: H01L21/677 ,  H01L25/00

Abstract: A method of picking up a die may include classifying a pickup region of a diced wafer, in which targeted pickup dies are placed, into first to n-th regions and performing a pickup step on dies in the first to n-th regions. The first region may include first dies, which are outermost dies of the targeted pickup dies. An (x+1)-th region may include regions, occupied by dies adjacent to at least one of x-th dies in an x-th region and proximate to a center of the pickup region in relation to the x-th region, n may be a natural number, and x may be an arbitrary natural number that is smaller than the n. The n-th region may have a rectangular shape, and a quantity of n-th dies in the n-th region in contact with a short side of the n-th region may be one or two.