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    Liquid crystal display and LED module thereof
    2.
    发明授权
    Liquid crystal display and LED module thereof 有权
    液晶显示器及其LED模块

    公开(公告)号：US08665398B2

    公开(公告)日：2014-03-04

    申请号：US13718581

    申请日：2012-12-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Suk Ju Choi ,  Kun Ho Cho ,  Yong Hun Kwon ,  Kye Hoon Lee ,  Gil Tae Hur ,  Young Min Lee

    IPC: G02F1/1335

    CPC classification number: G02B6/0083 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133308 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  G02F2201/46

    Abstract: An apparatus includes a chassis assembly; a liquid crystal display panel; a light guide plate configured to guide light to the liquid crystal display panel; a light emitting diode (LED) module including a printed circuit board (PCB), a plurality of LED packages which are mounted on the PCB and emit light to a lateral side of the light guide plate, and a connector connected to the PCB such that the connector is located behind the light guide plate; and a white strip member disposed between the PCB of the LED module and the light guide plate. An edge portion of a bottom surface of the light guide plate is supported by the PCB.

    Abstract translation: 一种装置包括底盘组件; 液晶显示面板; 配置为将光引导到液晶显示面板的导光板; 包括印刷电路板（PCB）的发光二极管（LED）模块，安装在PCB上并向导光板的侧面发光的多个LED封装以及连接到PCB的连接器，使得 连接器位于导光板的后面; 以及布置在LED模块的PCB和导光板之间的白色条状构件。 导光板底面的边缘部分由PCB支撑。

    Electronic device including wireless communication system, for processing transmission signal or reception signal
    6.
    发明授权
    Electronic device including wireless communication system, for processing transmission signal or reception signal 有权

    公开(公告)号：US11689242B2

    公开(公告)日：2023-06-27

    申请号：US17574999

    申请日：2022-01-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young Min Lee

    IPC: H04B1/40 ,  H04B1/48 ,  H03F3/20 ,  H03F3/68

    CPC classification number: H04B1/48 ,  H03F3/20 ,  H03F3/68 ,  H03F2200/294 ,  H03F2200/451

    Abstract: An electronic device is provided. The electronic device may include a plurality of antennas configured to transmit and receive a signal in a radio frequency (RF) frequency band; and an RF circuit configured to process the signal in the RF frequency band. The RF circuit includes a reception (Rx) path configured to transfer a first signal received through the plurality of antennas, a transmission (Tx) path configured to transfer a second signal to the plurality of antennas, and a coupler configured to transfer at least a part of the second signal obtained in the Tx path to the Rx path. The Tx path includes a power divider configured to distribute power to at least one antenna among the plurality of antennas, and the coupler is electrically connected to an input terminal of the power divider to be disposed before the power divider.

    System and method for management of electronic memory
    8.
    发明授权
    System and method for management of electronic memory 有权

    公开(公告)号：US12056048B2

    公开(公告)日：2024-08-06

    申请号：US17872167

    申请日：2022-07-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jin Myung Yoon ,  Young Min Lee ,  Jung Hwa Lee ,  Seon Woo Koo

    IPC: G06F12/02

    CPC classification number: G06F12/0292 ,  G06F12/0246 ,  G06F2212/1016

    Abstract: A storage device includes; a non-volatile memory, and a storage controller including a processor, an accelerator and a memory storing a flash translation layer including a mapping table including mapping information between logical page numbers and physical page numbers. The processor may provide a command to the non-volatile memory and provide first mapping update information in a first mapping update size to the accelerator. Upon updating mapping information of the mapping table, the accelerator may update mapping information for logical page numbers and check continuity for the first mapping update information.

    Semiconductor package
    9.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11776916B2

    公开(公告)日：2023-10-03

    申请号：US17199703

    申请日：2021-03-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sang Cheon Park ,  Young Min Lee ,  Dae-Woo Kim ,  Hyuek Jae Lee

    IPC: H01L23/544 ,  H01L23/538 ,  H01L25/065

    CPC classification number: H01L23/544 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/0657

    Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

    Liquid crystal display and LED module thereof
    10.
    再颁专利
    Liquid crystal display and LED module thereof 有权

    公开(公告)号：USRE48053E1

    公开(公告)日：2020-06-16

    申请号：US15205650

    申请日：2016-07-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ju Choi ,  Kun Ho Cho ,  Yong Hun Kwon ,  Kye Hoon Lee ,  Gil Tae Hur ,  Young Min Lee

    IPC: G02F1/1335 ,  G02F1/1333 ,  F21V8/00

    Abstract: A liquid crystal display (LCD) includes a cover assembly; a liquid crystal panel; a light guide plate configured to guide light to the liquid crystal panel; a printed circuit board (PCB) to which the light guide plate is mounted; and a light emitting diode (LED) package which is mounted on the PCB and emits light to a lateral side of the light guide plate. The PCB includes a base substrate; a connecting hole which is formed in the base substrate to couple the base substrate to the cover assembly with a connecting member; an insulating layer which is coated on the base substrate while avoiding a head part of the connecting member; and a spacer tape which is provided on an upper side of the insulating layer so that the light guide plate is evenly mounted on the PCB.

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