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公开(公告)号：US09813532B2
公开(公告)日：2017-11-07
申请号：US15438362
申请日：2017-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyoung Mok Kim , Young Jun Kim , Yoon Jung Kim , Sang Bong Sung , Shin Ho Yoon , Jin Young Jeong
CPC classification number: H04M1/026 , H01Q1/243 , H01Q5/314 , H01Q5/328 , H01Q5/335 , H01Q5/371 , H01Q9/42 , H01Q21/28 , H04M1/0277
Abstract: An electronic device is provided. The electronic device includes a housing including a first metallic member, a second metallic member, and a nonconductive segmenting part located between an end of the first metallic member and an end of the second metallic member, a ground member, a wireless communication circuit connected to a first point of the first metallic member through a first electrical path and connected to a second point of the first metallic member through a second electrical path, a first conductive pattern electrically connected to the first electrical path, a second conductive pattern electrically connected to the second electrical path, a first electrical variable element electrically connected between the first electrical path and the ground member, and a second electrical variable element electrically connected between the second metallic member and the ground member.
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Patent Agency Ranking
公开(公告)号：US11830840B2
公开(公告)日：2023-11-28
申请号：US17175119
申请日：2021-02-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young Jun Kim , Woon-Ki Lee , Jong Sun Jung
CPC classification number: H01L24/14 , H01L23/585 , H01L24/16 , H01L2224/02381 , H01L2224/14133 , H01L2224/14135 , H01L2224/14177 , H01L2224/14515 , H01L2224/16227
Abstract: An integrated circuit chip includes a substrate on which a standard cell is disposed. The integrated circuit chip includes a plurality of power bumps including a plurality of first power bumps and a plurality of second power bumps, the plurality of power bumps. disposed to have a staggered arrangement in a central region of one surface of the integrated circuit chip, and connected to provide power to the standard cell; a first metal wiring disposed below the plurality of first power bumps and electrically connected to the plurality of first power bumps, at least a part of the first metal wiring overlapping the plurality of first power bumps from a plan view; and a second metal wiring horizontally separated from the first metal wiring, disposed below the plurality of second power bumps, and electrically connected to the plurality of second power bumps, at least a part of the second metal wiring overlapping the plurality of second power bumps from the plan view. The plurality of first power bumps are disposed along a first line extending in a first direction parallel to a first diagonal direction of the integrated circuit chip, and along a second line extending in a second direction parallel to a second diagonal direction of the integrated circuit chip different from the first diagonal direction, the first diagonal direction and second diagonal direction being diagonal with respect to edges of the integrated circuit chip, and the plurality of second power bumps are disposed along a third line spaced apart from the first line and extending in the first direction, and along a fourth line spaced apart from the second line and extending in the second direction.
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公开(公告)号：US10608324B2
公开(公告)日：2020-03-31
申请号：US15720872
申请日：2017-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang Ha Lee , Kyung Jae Lee , Jae Ho Lim , Dong Hwan Kim , Young Jun Kim , Un Kim , Jong Hoon Kim , Min Seok Park
Abstract: An electronic device includes a metal housing, a conductive member disposed adjacent to the metal housing, a plurality of ground parts including a first ground part electrically connected with a first point of the conductive member and a second ground part electrically connected with a second point of the conductive member, a ground plate electrically connected with the metal housing and electrically connected with the conductive member via the plurality of ground parts, and a feeding part electrically connected with the conductive member.
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公开(公告)号：US11049212B2
公开(公告)日：2021-06-29
申请号：US16571440
申请日：2019-09-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young Jun Kim , Jin Aeon Lee
Abstract: Provided is a data processing device and a method of operating the same. The data processing device includes: a plurality of preprocessors configured to perform correction processing on a plurality of sensor data; a first switching circuit configured to selectively map and input the plurality of sensor data from at least two sensors to at least two preprocessors among the plurality of preprocessors; and a hybrid data processing engine configured to perform at least one of image enhancement and depth information determination on the plurality of sensor data received, via an on-the-fly method, from the at least two preprocessors.
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公开(公告)号：US10417735B2
公开(公告)日：2019-09-17
申请号：US15843029
申请日：2017-12-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young Jun Kim , Jin Aeon Lee
Abstract: Provided is a data processing device and a method of operating the same. The data processing device includes: a plurality of preprocessors configured to perform correction processing on a plurality of sensor data; a first switching circuit configured to selectively map and input the plurality of sensor data from at least two sensors to at least two preprocessors among the plurality of preprocessors; and a hybrid data processing engine configured to perform at least one of image enhancement and depth information determination on the plurality of sensor data received, via an on-the-fly method, from the at least two preprocessors.
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公开(公告)号：US09846919B2
公开(公告)日：2017-12-19
申请号：US14977975
申请日：2015-12-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young Jun Kim , Jin Aeon Lee
CPC classification number: G06T1/20 , G06T1/0007 , G06T5/005 , G06T5/008 , G06T5/50 , G06T2207/10024
Abstract: Provided is a data processing device and a method of operating the same. The data processing device includes: a plurality of preprocessors configured to perform correction processing on a plurality of sensor data; a first switching circuit configured to selectively map and input the plurality of sensor data from at least two sensors to at least two preprocessors among the plurality of preprocessors; and a hybrid data processing engine configured to perform at least one of image enhancement and depth information determination on the plurality of sensor data received, via an on-the-fly method, from the at least two preprocessors.
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