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公开(公告)号:US10608324B2
公开(公告)日:2020-03-31
申请号:US15720872
申请日:2017-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang Ha Lee , Kyung Jae Lee , Jae Ho Lim , Dong Hwan Kim , Young Jun Kim , Un Kim , Jong Hoon Kim , Min Seok Park
Abstract: An electronic device includes a metal housing, a conductive member disposed adjacent to the metal housing, a plurality of ground parts including a first ground part electrically connected with a first point of the conductive member and a second ground part electrically connected with a second point of the conductive member, a ground plate electrically connected with the metal housing and electrically connected with the conductive member via the plurality of ground parts, and a feeding part electrically connected with the conductive member.
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公开(公告)号:US11367944B2
公开(公告)日:2022-06-21
申请号:US16861800
申请日:2020-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taegyu Kim , Kyungbae Ko , Un Kim , Sanguk Kim , Donghwan Kim , Yongsub Lee
IPC: H01Q1/24 , H05K5/00 , H05K5/02 , H05K7/14 , H05K1/02 , H01Q1/50 , H01Q9/04 , H01Q1/48 , H01Q5/20
Abstract: An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.
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