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公开(公告)号：US20240235007A9
公开(公告)日：2024-07-11
申请号：US18400604
申请日：2023-12-29
Applicant: SAMSUNG ELECTRONICS CO.,LTD.
Inventor： Kyungkyun KANG , Yongsub Lee , Jaeho Lim , Sangmin Han
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q1/44 , H04M1/0277 , H04M2201/38
Abstract: An electronic device includes a display, a rear cover, a first frame including a first portion in which at least one speaker hole is formed in a region and a second portion extending from the first portion in a first direction, a second frame coupled to the second portion of the first frame, a speaker disposed in a space between the second frame and the second portion of the first frame, an acoustic duct formed in the first frame, a film including a conductive pattern, and a wireless communication circuit electrically coupled to the first conductive pattern. The acoustic duct includes a first acoustic duct portion and a second acoustic duct portion, at least one region of the first film covers an entirety of the opening, and the wireless communication circuit is configured to feed power to a point of the first conductive pattern to receive a signal of a first frequency band.
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公开(公告)号：US20240136701A1
公开(公告)日：2024-04-25
申请号：US18400604
申请日：2023-12-29
Applicant: SAMSUNG ELECTRONICS CO.,LTD.
Inventor： Kyungkyun KANG , Yongsub Lee , Jaeho Lim , Sangmin Han
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q1/44 , H04M1/0277 , H04M2201/38
Abstract: An electronic device includes a display, a rear cover, a first frame including a first portion in which at least one speaker hole is formed in a region and a second portion extending from the first portion in a first direction, a second frame coupled to the second portion of the first frame, a speaker disposed in a space between the second frame and the second portion of the first frame, an acoustic duct formed in the first frame, a film including a conductive pattern, and a wireless communication circuit electrically coupled to the first conductive pattern. The acoustic duct includes a first acoustic duct portion and a second acoustic duct portion, at least one region of the first film covers an entirety of the opening, and the wireless communication circuit is configured to feed power to a point of the first conductive pattern to receive a signal of a first frequency band.
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公开(公告)号：US11367944B2
公开(公告)日：2022-06-21
申请号：US16861800
申请日：2020-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taegyu Kim , Kyungbae Ko , Un Kim , Sanguk Kim , Donghwan Kim , Yongsub Lee
IPC: H01Q1/24 , H05K5/00 , H05K5/02 , H05K7/14 , H05K1/02 , H01Q1/50 , H01Q9/04 , H01Q1/48 , H01Q5/20
Abstract: An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.
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