公开(公告)号：US20240235007A9

公开(公告)日：2024-07-11

申请号：US18400604

申请日：2023-12-29

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Kyungkyun KANG ,  Yongsub Lee ,  Jaeho Lim ,  Sangmin Han

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/44 ,  H04M1/02

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/44 ,  H04M1/0277 ,  H04M2201/38

Abstract: An electronic device includes a display, a rear cover, a first frame including a first portion in which at least one speaker hole is formed in a region and a second portion extending from the first portion in a first direction, a second frame coupled to the second portion of the first frame, a speaker disposed in a space between the second frame and the second portion of the first frame, an acoustic duct formed in the first frame, a film including a conductive pattern, and a wireless communication circuit electrically coupled to the first conductive pattern. The acoustic duct includes a first acoustic duct portion and a second acoustic duct portion, at least one region of the first film covers an entirety of the opening, and the wireless communication circuit is configured to feed power to a point of the first conductive pattern to receive a signal of a first frequency band.

公开(公告)号：US20240136701A1

公开(公告)日：2024-04-25

申请号：US18400604

申请日：2023-12-29

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Kyungkyun KANG ,  Yongsub Lee ,  Jaeho Lim ,  Sangmin Han

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/44 ,  H04M1/02

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/44 ,  H04M1/0277 ,  H04M2201/38

Abstract: An electronic device includes a display, a rear cover, a first frame including a first portion in which at least one speaker hole is formed in a region and a second portion extending from the first portion in a first direction, a second frame coupled to the second portion of the first frame, a speaker disposed in a space between the second frame and the second portion of the first frame, an acoustic duct formed in the first frame, a film including a conductive pattern, and a wireless communication circuit electrically coupled to the first conductive pattern. The acoustic duct includes a first acoustic duct portion and a second acoustic duct portion, at least one region of the first film covers an entirety of the opening, and the wireless communication circuit is configured to feed power to a point of the first conductive pattern to receive a signal of a first frequency band.