公开(公告)号：US09257240B2

公开(公告)日：2016-02-09

申请号：US13927369

申请日：2013-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Seok Park ,  Joon-Seo Park ,  Kwang-Su Seo ,  Yong-Woo Jeon

IPC: H01H13/14 ,  H01H13/85 ,  H01H13/12 ,  H01H1/12

CPC classification number: H01H1/12 ,  H01H13/85 ,  H01H2221/044 ,  H01H2221/062 ,  H01H2221/074 ,  H01H2225/028 ,  H01H2235/016

Abstract: A key assembly which is configured to provide improved click feeling to a user and an electronic device having the same are provided. The key assembly includes a key body of elastic materials and contact projections, each of the contact projections which is protruded and formed from the key body and presses a switch device spaced apart from the key body by a gap providing a certain interval, wherein the key body is installed such that a contact surface of each of the contact projections is in contact with and pushed back by a certain distance by a pre-loading force of the switch device.

Abstract translation: 提供一种被配置为向用户提供改善的点击感的键组件和具有该组合件的电子设备。 钥匙组件包括弹性材料的钥匙体和接触突起，每个接触突起由钥匙体突出并形成，并且按照与键体间隔一定间隔的开关装置按压一定间隔，其中钥匙 主体被安装成使得每个接触突起的接触表面与开关装置的预加载力接触并被推回一定距离。

公开(公告)号：US10133311B2

公开(公告)日：2018-11-20

申请号：US15657691

申请日：2017-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo-Hyun Jung ,  Chong-Du Kim ,  Yong-Woo Jeon

IPC: G06F1/16

Abstract: An electronic device is provided. The electronic device includes a mounting surface configured to accept another electronic device, a holder recess provided in the mounting surface and configured to hold the other electronic device at certain angles, and a rotatable clip installed in the mounting surface, and configured to control at least one part of the other electronic device, wherein other electronic device is accommodated at one end by the holder recess, and is accommodated at another end by the rotatable clip, such that the other electronic device is combined with the electronic device.

公开(公告)号：US09941280B2

公开(公告)日：2018-04-10

申请号：US15228292

申请日：2016-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwan-Young Kim ,  Jae-Hyun Yoo ,  Jin-Hyun Noh ,  Woo-Yeol Maeng ,  Yong-Woo Jeon

IPC: H01L27/088 ,  H01L29/78 ,  H01L29/06 ,  H01L29/423 ,  H01L29/08 ,  H01L23/528

CPC classification number: H01L27/0886 ,  H01L23/528 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0865 ,  H01L29/0873 ,  H01L29/0882 ,  H01L29/4232 ,  H01L29/4236 ,  H01L29/7816 ,  H01L29/7835 ,  H01L29/785

Abstract: According to example embodiments, a semiconductor device includes a first fin, a second fin that is separated from the first fin, and a gate on the first fin and the second fin. The gate crosses the first fin and the second fin. The first fin includes a first doped area at both sides of the gate. The first doped area is configured to have a first voltage applied thereto. The second fin includes a second doped area at both sides of the gate. The second doped area is configured to have a second voltage applied thereto. The second voltage is different than the first voltage.

公开(公告)号：US20160372593A1

公开(公告)日：2016-12-22

申请号：US15052177

申请日：2016-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Hyun YOO ,  Kwan-Young Kim ,  Jin-Hyun Noh ,  Kee-Moon Chun ,  Yong-Woo Jeon

IPC: H01L29/78 ,  H01L21/324 ,  H01L21/265 ,  H01L29/10 ,  H01L29/66

CPC classification number: H01L29/7816 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/66659 ,  H01L29/66689 ,  H01L29/66795 ,  H01L29/7835 ,  H01L29/7851

Abstract: A semiconductor device includes a first well disposed in a substrate and including a first impurity of a first conductivity type, a second well disposed in the substrate, including a second impurity of a second conductivity type different from the first conductivity type, and having first to third portions, and a gate structure formed on the first well and the second well, wherein the second portion is disposed between the first portion and the third portion, the first portion and the third portion are formed deeper than the second portion, and concentration of the second impurity of the first portion and the third portion is greater than concentration of the second impurity of the second portion.

Abstract translation: 半导体器件包括：第一阱，其布置在衬底中并且包括第一导电类型的第一杂质;第二阱，设置在衬底中，包括不同于第一导电类型的第二导电类型的第二杂质，并且首先 第三部分和形成在第一阱和第二阱上的栅极结构，其中第二部分设置在第一部分和第三部分之间，第一部分和第三部分形成得比第二部分更深，并且浓度 第一部分和第三部分的第二杂质大于第二部分的第二杂质的浓度。

公开(公告)号：US10084079B2

公开(公告)日：2018-09-25

申请号：US15052177

申请日：2016-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Hyun Yoo ,  Kwan-Young Kim ,  Jin-Hyun Noh ,  Kee-Moon Chun ,  Yong-Woo Jeon

IPC: H01L29/66 ,  H01L29/78 ,  H01L29/08 ,  H01L29/10

CPC classification number: H01L29/7816 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/66659 ,  H01L29/66689 ,  H01L29/66795 ,  H01L29/7835 ,  H01L29/785 ,  H01L29/7851

Abstract: A semiconductor device includes a first well disposed in a substrate and including a first impurity of a first conductivity type, a second well disposed in the substrate, including a second impurity of a second conductivity type different from the first conductivity type, and having first to third portions, and a gate structure formed on the first well and the second well, wherein the second portion is disposed between the first portion and the third portion, the first portion and the third portion are formed deeper than the second portion, and concentration of the second impurity of the first portion and the third portion is greater than concentration of the second impurity of the second portion.

公开(公告)号：US09715253B2

公开(公告)日：2017-07-25

申请号：US14713169

申请日：2015-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo-Hyun Jung ,  Chong-Du Kim ,  Yong-Woo Jeon

IPC: G06F1/16

CPC classification number: G06F1/1654 ,  G06F1/1616 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/1656 ,  G06F1/1681

Abstract: An electronic device is provided. The electronic device includes a mounting surface configured to accept another electronic device, a holder recess provided in the mounting surface and configured to hold the other electronic device at certain angles, and a rotatable clip installed in the mounting surface, and configured to control at least one part of the other electronic device, wherein other electronic device is accommodated at one end by the holder recess, and is accommodated at another end by the rotatable clip, such that the other electronic device is combined with the electronic device.