公开(公告)号：US10163942B2

公开(公告)日：2018-12-25

申请号：US15375885

申请日：2016-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ye-chung Chung ,  Hee-seok Lee ,  Yun-seok Choi ,  Keung-beum Kim

IPC: G06F3/038 ,  H03K3/00 ,  H01L27/12 ,  G02F1/1345 ,  G09G3/20 ,  H01L23/00 ,  H01L25/10 ,  H05K1/14

Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels. The at least one source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and configured to provide the source driving signal to source lines of the plurality of pixels.

公开(公告)号：US20180049324A1

公开(公告)日：2018-02-15

申请号：US15446255

申请日：2017-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-eun Koo ,  Ye-chung Chung ,  Yong-hoon Kim

IPC: H05K1/18 ,  H01L23/00 ,  G09G5/18 ,  H01L25/065 ,  H01L21/48 ,  H01L23/538 ,  H01L25/18

CPC classification number: H05K1/185 ,  G09G3/20 ,  G09G5/18 ,  G09G2300/0426 ,  G09G2310/08 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2924/141 ,  H01L2924/1426 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/181 ,  H05K1/186 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10681

Abstract: Provided are a semiconductor package and a display device including the same. In some aspects, the semiconductor package may include a film substrate including a base film including cavities and a wiring layer on the base film, a semiconductor chip connected to the wiring layer and mounted on a surface of the base film, and passive devices accommodated in the cavities of the base film and electrically connected to the semiconductor chip through the wiring layer. According to other aspects a base film having at least one recess may be provided. A wiring layer may be on the base film, and a semiconductor chip may be connected to the wiring layer and mounted on a surface of the base film. At least one passive device may be in the at least one recess of the base film and electrically connected to the semiconductor chip via the wiring layer.