-
公开(公告)号:US20190266050A1
公开(公告)日:2019-08-29
申请号:US16411127
申请日:2019-05-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin NIU , Mu-Tien CHANG , Hongzhong ZHENG , Hyun-Joong KIM , Won-Hyung SONG , Jangseok CHOI
IPC: G06F11/10 , G11C29/52 , G11C11/4093
Abstract: A data chip that may pollute data is disclosed. The data chip may include a data array, read circuitry to read raw data from the data array, and a buffer to store the raw data. Using a pollution pattern stored in a mask register, a data pollution engine may pollute the raw data. Transmission circuitry may then transmit the polluted data.
-
2.
公开(公告)号:US20180083651A1
公开(公告)日:2018-03-22
申请号:US15683505
申请日:2017-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Won-Hyung SONG
CPC classification number: H03M13/095 , G06F11/1048 , G11C5/04 , G11C7/1045 , G11C11/4076 , G11C29/52 , G11C2029/0411 , H03M13/151 , H03M13/2906 , H03M13/2909
Abstract: A memory device that checks an error of a memory cell and a memory module including the same are disclosed. The memory module includes a first memory device and a second memory device. The first memory device includes a first area in which normal data are stored, and a second area in which error check data are stored. The second memory device stores reliability information about the normal data that is stored in the first area of the first memory device. The first memory device outputs a result of comparing the normal data read from the first area of the first memory device to the error check data read from the second area of the first memory device.
-
公开(公告)号:US20190266049A1
公开(公告)日:2019-08-29
申请号:US16411122
申请日:2019-05-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin NIU , Mu-Tien CHANG , Hongzhong ZHENG , Hyun-Joong KIM , Won-Hyung SONG , Jangseok CHOI
IPC: G06F11/10 , G11C29/52 , G11C11/4093
Abstract: A data chip that may pollute data is disclosed. The data chip may include a data array, read circuitry to read raw data from the data array, and a buffer to store the raw data. Using a pollution pattern stored in a mask register, a data pollution engine may pollute the raw data. Transmission circuitry may then transmit the polluted data.
-
公开(公告)号:US20140131895A1
公开(公告)日:2014-05-15
申请号:US13826612
申请日:2013-03-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Won-Hyung SONG , Kyoungsun KIM , Yong-jin KIM , Jaejun LEE , Sangseok KANG , Jungjoon LEE
IPC: H01L25/07
CPC classification number: G11C5/04 , G06F13/102 , G06F13/4068 , G06F13/42 , G11C5/02 , H01L24/73 , H01L25/0657 , H01L25/074 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/12044 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/00012 , H01L2924/00
Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.
Abstract translation: 提供了一种包括印刷电路板的存储器模块; 设置在印刷电路板的一个表面上的第一半导体封装; 以及设置在所述印刷电路板的另一个表面上的第二半导体封装,所述第一半导体封装和所述第二半导体封装具有形成等级的半导体管芯。 由第一半导体封装形成的多个等级由与第二半导体封装形成的等级数不同。 形成相同行列的半导体封装共同接收芯片选择信号,形成其他级别的半导体封装接收不同的芯片选择信号。
-
公开(公告)号:US20230042955A1
公开(公告)日:2023-02-09
申请号:US17689064
申请日:2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung Min YOU , Ho-Youn KIM , Won-Hyung SONG , Hi Jung KIM
IPC: G11C11/406 , G11C11/408
Abstract: A memory device includes memory cells connected to a first word-line, wherein the memory cells include a data region in which data is stored and a counting value backup region in which the number of times the first word-line is activated is backed up, a counting table for storing a first row address corresponding to the first word-line and a first counting value as a counting result of the number of times the first word-line is activated, and a comparator configured to compare the first counting value with a first backed-up counting value stored in the counting value backup region; and when the first counting value is greater than the first backed-up counting value, back up the first counting value in the counting value backup region, or when the first backed-up counting value is greater than the first counting value, overwrite the first backed-up counting value into the counting table.
-
公开(公告)号:US20180129561A1
公开(公告)日:2018-05-10
申请号:US15410752
申请日:2017-01-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin NIU , Mu-Tien CHANG , Hongzhong ZHENG , Hyun-Joong KIM , Won-Hyung SONG , Jangseok CHOI
IPC: G06F11/10 , G11C11/4093 , G11C29/52
CPC classification number: G06F11/1068 , G06F11/1048 , G11C11/4093 , G11C29/52
Abstract: A data chip that may pollute data is disclosed. The data chip may include a data array, read circuitry to read raw data from the data array, and a buffer to store the raw data. Using a pollution pattern stored in a mask register, a data pollution engine may pollute the raw data. Transmission circuitry may then transmit the polluted data.
-
公开(公告)号:US20160275995A1
公开(公告)日:2016-09-22
申请号:US15168961
申请日:2016-05-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Won-Hyung SONG , Kyoungsun KIM , Yong-Jin KIM , Jaejun LEE , Sangseok KANG , Jungjoon LEE
CPC classification number: G11C5/04 , G06F13/102 , G06F13/4068 , G06F13/42 , G11C5/02 , H01L24/73 , H01L25/0657 , H01L25/074 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/12044 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/00012 , H01L2924/00
Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.
-
公开(公告)号:US20150262620A1
公开(公告)日:2015-09-17
申请号:US14712530
申请日:2015-05-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Won-Hyung SONG , Kyoung-Sun KIM , Yong Jin KIM , Jae-Jun LEE , Sang-Seok KANG , Jung-Joon LEE
IPC: G11C5/02
CPC classification number: G11C5/04 , G06F13/102 , G06F13/4068 , G06F13/42 , G11C5/02 , H01L24/73 , H01L25/0657 , H01L25/074 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/12044 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/00012 , H01L2924/00
Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.
Abstract translation: 提供了一种包括印刷电路板的存储器模块; 设置在印刷电路板的一个表面上的第一半导体封装; 以及设置在所述印刷电路板的另一个表面上的第二半导体封装,所述第一半导体封装和所述第二半导体封装具有形成等级的半导体管芯。 由第一半导体封装形成的多个等级由与第二半导体封装形成的等级数不同。 形成相同行列的半导体封装共同接收芯片选择信号,形成其他级别的半导体封装接收不同的芯片选择信号。
-
-
-
-
-
-
-