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公开(公告)号：US20240323417A1
公开(公告)日：2024-09-26
申请号：US18676783
申请日：2024-05-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seokhyun Lee , Taesung Kim
IPC: H04N19/423 , H04N19/137 , H04N19/159 , H04N19/186 , H04N19/593 , H04N19/91
CPC classification number: H04N19/423 , H04N19/137 , H04N19/159 , H04N19/186 , H04N19/593 , H04N19/91
Abstract: A video decoding apparatus includes a first buffer storing input data received from an entropy decoder, a first motion compensation processor extracting motion compensation reference data based on the input data, and store the motion compensation reference data in a pixel cache, a second buffer, and a controller. The input data comprises one of first data including motion information and second data including intra prediction information. The controller controls the second buffer to store the motion compensation reference data stored in the pixel cache when the input data is the first data, and controls the second buffer to store the second data stored in the first buffer when the input data is the second data.
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公开(公告)号：US11310856B2
公开(公告)日：2022-04-19
申请号：US16552961
申请日：2019-08-27
Applicant: Samsung Electronics Co., Ltd
Inventor： Taesung Kim , Janghwan Kim , Seungbo Yoo
Abstract: The present disclosure relates to a communication method and system for converging a 4th-Generation (4G) communication system or a 5th-Generation (5G) communication system for supporting higher data rates beyond the 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A method of a central unit-control plane (CU-CP) included in a secondary node (SN) (or secondary gNB (SgNB)) in a wireless communication system supporting evolved universal terrestrial radio access and new radio dual connectivity (EN-DC) includes receiving, from a master node (MN) (or master eNB (MeNB)), a first message for requesting the SgNB to allocate a radio resource for a bearer, and transmitting a second message, including indication information indicating whether a packet data convergence protocol (PDCP) version of the bearer has been changed, to the CU-UP included in the SgNB. The indication information is generated based on the first message.
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公开(公告)号：US20210020227A1
公开(公告)日：2021-01-21
申请号：US16848418
申请日：2020-04-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Buyeon Lee , Taegyeong Kim , Taesung Kim , Byongmo Moon
IPC: G11C11/4093 , H03K19/00 , G06F3/06
Abstract: A memory device includes a pad region having a flag pad separated from an external host, and a signal pad connected to the external host. A bank region is provided having a plurality of memory cells therein. An on-die-termination (ODT) setting circuit is provided, which is configured to receive a control command including first data corresponding to termination resistance requested by the host, and a ODT enable signal. The setting circuit is configured to generate second data corresponding to the ODT resistance. An ODT enable circuit is provided, which is configured to output an ODT flag signal to the flag pad, in response to the control command and the ODT enable signal. A resistor circuit is provided, which is configured to connect the ODT resistance to the signal pad using the second data.
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4.发明授权公开(公告)号：US11813714B2
公开(公告)日：2023-11-14
申请号：US17026554
申请日：2020-09-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hojoong Kim , Taesung Kim , Seokjun Hong , Junyong Kim , Donghyuk Jang , Youngjin Hong
IPC: B24B37/26
CPC classification number: B24B37/26
Abstract: A chemical mechanical polishing (CMP) apparatus and a CMP pad, the apparatus including a rotating plate; a CMP pad on an upper surface of the rotating plate; a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and a slurry supply configured to supply slurry to the CMP pad, wherein the CMP pad includes a pad body having a circular plate shape; a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and a connection groove connecting the plurality of circular grooves, the connection groove having a linear shape.
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公开(公告)号：US11163336B2
公开(公告)日：2021-11-02
申请号：US16070384
申请日：2017-01-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Songhee Jung , Taesung Kim , Hyunchang Shin , Donghui Kim , Jongkon Bae , Dongkyoon Han
Abstract: An electronic device may comprise: a first housing including a first upper surface, a first lower surface, a first side, and a second side disposed opposite the first side; a second housing including a third side and a second upper surface; a connecting member for connecting the first housing and the second housing to be rotatable; a first window extending from the first upper surface to the first side and formed of a first material; a second window extending from the first lower surface of the first housing to the second upper surface and formed of a second material; and a flexible display mounted in the first housing and the second housing and mounted along the first window and the second window.
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Patent Agency Ranking
公开(公告)号：US11017725B2
公开(公告)日：2021-05-25
申请号：US16852639
申请日：2020-04-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taesung Kim , Donghui Kim , Jong-Kon Bae , Dongkyoon Han
IPC: G09G3/3266 , G09G3/3225 , G09G3/3275
Abstract: Provided in various examples are a device and a method, the device comprising: a first pixel group and a second pixel group for converting an electrical signal into an optical signal; a first emission line for transmitting, to the first pixel group, power supplied from the outside; and a second emission line for transmitting the power to the second pixel group, wherein the first emission line and the second emission line are electrically separated from each other. In addition, other examples are also possible.
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公开(公告)号：US10885301B2
公开(公告)日：2021-01-05
申请号：US16158510
申请日：2018-10-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joung-Min Cho , Oh Hyuck Kwon , Taesung Kim , Hyungdal Kim , Hyunchang Shin , Song Hee Jung , Jeong-Min Park , Hyungsup Byeon , Heung-Sik Shin
Abstract: An apparatus and method for obtaining biometric information in an electronic device are provided. An electronic device comprising a display comprising a plurality of pixels, a biometric sensor disposed in at least a partial region of the display; and at least one processor, wherein the at least one processor is configured to receive an input for sensing biometric information of an external object, in response to the input, select at least one pixel among a first pixel and a second pixel in accordance with history information about use of the first pixel and second pixel, wherein the first pixel and the second pixel are disposed in the at least the partial region of the display proximate to the biometric sensor, and obtain the biometric information of an external object through the biometric sensor by using light irradiated by the selected at least one pixel.
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公开(公告)号：US10552696B2
公开(公告)日：2020-02-04
申请号：US15839035
申请日：2017-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joungmin Cho , Soohyung Kim , Taesung Kim , Hyunchang Shin , Songhee Jung , Jiwoong Oh
Abstract: An electronic device having a biometric sensor is provided. The electronic device includes a first region including a plurality of first pixels arranged in a first manner and a second region including a plurality of second pixels arranged in a second manner, a biometric sensor disposed in at least a part of the first region, and a processor electrically coupled with the display and the biometric sensor, and configured to receive a user input through the first region, and control the biometric sensor to detect biometric information corresponding to the user input.
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9.发明授权公开(公告)号：US10065402B2
公开(公告)日：2018-09-04
申请号：US15014054
申请日：2016-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mun Ja Kim , Byung-Gook Kim , Hwan Chul Jeon , Ji-Beom Yoo , Dong-Wook Shin , Taesung Kim , Sooyoung Kim
IPC: B32B37/14 , B32B38/18 , B32B37/00 , G03F1/62 , B32B37/10 , B32B38/10 , B32B37/12 , H01L21/00 , B32B38/16
Abstract: A method of manufacturing a pellicle assembly, the method including attaching a carbon-containing thin film onto a transfer membrane in a wet atmosphere; attaching the carbon-containing thin film to a pellicle frame in a dry atmosphere while the carbon-containing thin film is attached onto the transfer membrane; and separating the transfer membrane from the carbon-containing thin film while the carbon-containing thin film is attached to the pellicle frame.
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10.发明申请FLUX COMPOSITIONS FOR FORMING A SOLDER BUMP AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME 审中-公开用于形成焊盘的焊剂组合物和使用其制造半导体器件的方法公开(公告)号：US20130192722A1
公开(公告)日：2013-08-01
申请号：US13754008
申请日：2013-01-30
Applicant: Samsung Electronics Co., Ltd. , Dongwoo Fine-Chem Co., Ltd.
Inventor： Dong-Min Kang , Sunghoon Kim , Ingoo Kang , Taesung Kim , Jungjae Myung , Sang Tae Kim , Shijin Sung , In-Kak Song , Seunghyun Ahn , Kyoochul Cho
IPC: B23K35/362
Abstract: The inventive concept provides flux compositions for forming a solder bump and methods of fabricating a semiconductor device using the same. The flux composition may include a resin, an activator, and a solvent. The resin may include gum rosin and rosin ester, and a mass ratio of the gum rosin versus the rosin ester may have a range of about 60:40 to about 90:10.
Abstract translation: 本发明的概念提供了用于形成焊料凸块的焊剂组合物以及使用其制造半导体器件的方法。 焊剂组合物可以包括树脂，活化剂和溶剂。 树脂可以包括松香和松香酯，并且松香与松香酯的质量比可以为约60:40至约90:10的范围。
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