公开(公告)号：US11813714B2

公开(公告)日：2023-11-14

申请号：US17026554

申请日：2020-09-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojoong Kim ,  Taesung Kim ,  Seokjun Hong ,  Junyong Kim ,  Donghyuk Jang ,  Youngjin Hong

IPC: B24B37/26

CPC classification number: B24B37/26

Abstract: A chemical mechanical polishing (CMP) apparatus and a CMP pad, the apparatus including a rotating plate; a CMP pad on an upper surface of the rotating plate; a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and a slurry supply configured to supply slurry to the CMP pad, wherein the CMP pad includes a pad body having a circular plate shape; a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and a connection groove connecting the plurality of circular grooves, the connection groove having a linear shape.