公开(公告)号：US20220408170A1

公开(公告)日：2022-12-22

申请号：US17838970

申请日：2022-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonguk Park ,  Taeuk Kang ,  Juhwan Kim ,  Jiwoo Lee

IPC: H04R1/04 ,  H04R1/28 ,  H04R3/00 ,  H04N5/225 ,  H04R1/08

Abstract: Disclosed is an electronic device including a structure that stably supports a flexible printed circuit board on which a microphone module is disposed inside the electronic device, thereby improving the sealing between the microphone module and the camera housing.

公开(公告)号：US11017794B2

公开(公告)日：2021-05-25

申请号：US16325349

申请日：2017-07-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungmoon Kang ,  Seonguk Park ,  Soonsang Park ,  Hyunsuk Choi

IPC: G10L21/00 ,  G10L21/0232 ,  H04R3/00 ,  H04R1/10 ,  H04M9/08 ,  G10L25/84 ,  H04M1/60 ,  G10L21/0208 ,  H03F3/20

Abstract: Various examples in the present invention relate to an electronic device and a method for reducing noise by utilizing the same, the device and the method connecting a call using a headset, classifying a user voice signal received through the headset into a P voice signal and an N voice signal, applying the same voltage to the P voice signal and the N voice signal by using a noise reduction filter, and enabling the noise induced in the voltage to be removed by synthesizing the P voice signal and the N voice signal. In addition, other examples are possible.

公开(公告)号：US11109144B2

公开(公告)日：2021-08-31

申请号：US16662811

申请日：2019-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonguk Park ,  Kyungmoon Kang ,  Juhwan Kim ,  Hyunsuk Choi

IPC: H04R1/28 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate, and a lateral member surrounding a space between the front and rear plates and having at least one through-hole. The electronic device further includes a display disposed to be seen through the front plate, and a speaker structure disposed near the through-hole in the space between the display and the rear plate. The speaker structure includes a yoke disposed between the display and the rear plate and facing the display, a diaphragm disposed between the rear plate and the yoke and spaced apart from the rear plate, a magnet disposed between the yoke and the diaphragm, a speaker housing surrounding, at least in part, at least one of the diaphragm, the yoke, or the magnet and including a first opening formed toward the rear plate and a second opening formed toward the through-hole. The electronic device further includes a sealing member disposed between the speaker housing and the rear plate and surrounding the first opening when viewed from the rear plate. A sound conduit includes, between the diaphragm and the through-hole, a first space formed by the first opening, the rear plate, and the sealing member, and a second space connected to the first space through the second opening.

公开(公告)号：US10043873B2

公开(公告)日：2018-08-07

申请号：US15060174

申请日：2016-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Hwan Yeo ,  Seonguk Park ,  Seungjae Lee ,  Doyoung Choi ,  Sunhom Steve Paak ,  Tae Eung Yoon ,  Dongho Cha ,  Ruiyi Chen

IPC: H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119 ,  H01L29/40 ,  H01L29/66 ,  H01L27/11 ,  H01L29/417 ,  H01L29/78

Abstract: Provided is a semiconductor device with a field effect transistor. The semiconductor device includes a substrate, an active pattern on the substrate, a gate electrode crossing the active pattern and a capping structure on the gate electrode. The capping structure includes first and second capping patterns that are sequentially stacked on the gate electrode. The second capping pattern completely covers a top surface of the first capping pattern, and a dielectric constant of the second capping pattern is greater than that of the first capping pattern.

公开(公告)号：US11882393B2

公开(公告)日：2024-01-23

申请号：US17838970

申请日：2022-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonguk Park ,  Taeuk Kang ,  Juhwan Kim ,  Jiwoo Lee

IPC: H04R1/04 ,  H04R1/28 ,  H04R3/00 ,  H04R1/08 ,  H04N23/51 ,  H04M1/02

CPC classification number: H04R1/04 ,  H04N23/51 ,  H04R1/08 ,  H04R1/2876 ,  H04R3/00 ,  H04M1/0277 ,  H04R2499/11

Abstract: Disclosed is an electronic device including a structure that stably supports a flexible printed circuit board on which a microphone module is disposed inside the electronic device, thereby improving the sealing between the microphone module and the camera housing.

公开(公告)号：US11076221B2

公开(公告)日：2021-07-27

申请号：US16662811

申请日：2019-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonguk Park ,  Kyungmoon Kang ,  Juhwan Kim ,  Hyunsuk Choi

IPC: H04R1/28 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate, and a lateral member surrounding a space between the front and rear plates and having at least one through-hole. The electronic device further includes a display disposed to be seen through the front plate, and a speaker structure disposed near the through-hole in the space between the display and the rear plate. The speaker structure includes a yoke disposed between the display and the rear plate and facing the display, a diaphragm disposed between the rear plate and the yoke and spaced apart from the rear plate, a magnet disposed between the yoke and the diaphragm, a speaker housing surrounding, at least in part, at least one of the diaphragm, the yoke, or the magnet and including a first opening formed toward the rear plate and a second opening formed toward the through-hole. The electronic device further includes a sealing member disposed between the speaker housing and the rear plate and surrounding the first opening when viewed from the rear plate. A sound conduit includes, between the diaphragm and the through-hole, a first space formed by the first opening, the rear plate, and the sealing member, and a second space connected to the first space through the second opening.

公开(公告)号：US09723408B2

公开(公告)日：2017-08-01

申请号：US15165799

申请日：2016-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonguk Park ,  Choonho Kim ,  Soonsang Park

IPC: H04R1/10 ,  H04R5/04 ,  H01R24/58 ,  H01R105/00 ,  H01R13/66

CPC classification number: H04R5/04 ,  H01R13/665 ,  H01R24/58 ,  H01R2105/00 ,  H04R2420/05 ,  H04R2420/09

Abstract: An electronic device includes a circuit electrically connected to first and second contacts and a processor electrically connected to the circuit, wherein the circuit compares a first signal occurring by an electrical contact of the first contact and the external material with a first threshold value to generate a first comparison signal, compares a second signal occurring by an electrical contact of the second contact and the external material with a second threshold value to generate a second comparison signal, and generates a third signal based on a portion of the first and second comparison signals and provides the third signal to the processor, wherein the external material includes one of moisture and a foreign substance or the external connector, and the processor prevents recognizing a contact of the moisture or the foreign substance as a contact of the external connector based on a portion of the third signal.