公开(公告)号：US11882393B2

公开(公告)日：2024-01-23

申请号：US17838970

申请日：2022-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonguk Park ,  Taeuk Kang ,  Juhwan Kim ,  Jiwoo Lee

IPC: H04R1/04 ,  H04R1/28 ,  H04R3/00 ,  H04R1/08 ,  H04N23/51 ,  H04M1/02

CPC classification number: H04R1/04 ,  H04N23/51 ,  H04R1/08 ,  H04R1/2876 ,  H04R3/00 ,  H04M1/0277 ,  H04R2499/11

Abstract: Disclosed is an electronic device including a structure that stably supports a flexible printed circuit board on which a microphone module is disposed inside the electronic device, thereby improving the sealing between the microphone module and the camera housing.

公开(公告)号：US12058428B2

公开(公告)日：2024-08-06

申请号：US17539360

申请日：2021-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeuk Kang ,  Jiwoo Lee

IPC: H04N23/55 ,  G02B19/00 ,  H04N23/45 ,  H04N23/56

CPC classification number: H04N23/55 ,  G02B19/0061 ,  H04N23/45 ,  H04N23/56

Abstract: An electronic device according to an embodiment may include a first camera module, and a flash module disposed adjacent to the first camera module, where the flash module may include an LED configured to emit light, and an optical lens disposed in the traveling direction of the light emitted from the LED. The optical lens may include a first surface in the direction facing the LED and a second surface in the direction opposite the first surface, and the second surface of the optical lens may include a first translucent area including a central area where the light emitted from the LED is incident and a second translucent area spaced apart from the first translucent area. Various other embodiments may be also provided.

公开(公告)号：US20220408170A1

公开(公告)日：2022-12-22

申请号：US17838970

申请日：2022-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonguk Park ,  Taeuk Kang ,  Juhwan Kim ,  Jiwoo Lee

IPC: H04R1/04 ,  H04R1/28 ,  H04R3/00 ,  H04N5/225 ,  H04R1/08

Abstract: Disclosed is an electronic device including a structure that stably supports a flexible printed circuit board on which a microphone module is disposed inside the electronic device, thereby improving the sealing between the microphone module and the camera housing.

公开(公告)号：US11533814B2

公开(公告)日：2022-12-20

申请号：US17042352

申请日：2019-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongho Kim ,  Taeuk Kang ,  Hyunsuk Choi

IPC: H01R12/50 ,  H05K5/00 ,  H01R12/52 ,  H05K1/18 ,  H05K7/14 ,  H05K1/11 ,  H01R12/62 ,  H01R12/77

Abstract: According to one embodiment, an electronic device includes: a housing; a first electronic component inside the housing; a second electronic component arranged inside the housing and spaced apart from the first electronic component; a female connector electrically connected to the second electronic component, the female connector comprising multiple conductive pins; a male connector electrically connected to the first electronic component and configured to contact at least some of the multiple conductive pins of the female connector, the male connector comprising a base film, a conductive layer formed on one surface of the base film, and an adhesive layer formed on the back surface of the base film, thereby forming a lamination structure; and multiple reinforcement members provided on at least one of one surface of the base film and the back surface thereof so as to form a peripheral portion of the lamination structure.