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公开(公告)号：US10105060B2
公开(公告)日：2018-10-23
申请号：US14338507
申请日：2014-07-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong-seok Kim , Sung-chan Kang , Hyung-joo Kim , Hyung-jae Shin , Yong-seop Yoon , Byung-gil Jeong , Seok-whan Chung , Chang-jung Kim
Abstract: A breast scanning apparatus which uses photoacoustic ultrasonic waves is provided. The breast scanning apparatus includes a body which includes a first hole and a second hole which are horizontally parallel to each other; a first compression plate and a second compression plate, at least one of which is movable in a vertical direction with respect to the body; a first sliding plate and a second sliding plate, which are respectively installed on surfaces of the first compression plate and the second compression plate and are facing each other and are movable in a first direction; a first ultrasonic transducer array in the first compression plate and facing the first sliding plate; and a first laser head in the first compression plate, which is movable in a second direction which is perpendicular to the first direction.
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公开(公告)号：US20150163599A1
公开(公告)日：2015-06-11
申请号：US14287556
申请日：2014-05-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-sik SHIM , Seog-woo Hong , Seok-whan Chung , Chang-jung Kim
CPC classification number: B06B1/0292 , B81C1/00182 , Y10T29/49005
Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.
Abstract translation: 电声换能器包括：导电基板，其中形成有第一沟槽，并且包括由第一沟槽包围的电极连接单元; 设置在所述导电基板上的膜; 设置在所述膜上以与所述电极连接单元的上表面接触的上电极; 设置在所述导电基板的下表面上以接触所述电极连接单元的下表面的第一电极; 以及与所述第一电极间隔开并设置成与所述导电基板的下表面接触的第二电极。
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公开(公告)号：US09603581B2
公开(公告)日：2017-03-28
申请号：US14023821
申请日：2013-09-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seok-whan Chung
CPC classification number: A61B8/4483 , B06B1/0292 , H01L29/84
Abstract: An ultrasonic transducer includes: a first electrode layer disposed on an upper substrate and a support; a second electrode layer which is disposed on a lower surface of the upper substrate and is separated from the first electrode layer; an upper electrode disposed on an upper surface of a membrane to contact an upper surface of the first electrode layer; a trench formed through the upper electrode, the membrane, the support, and the upper substrate; and a pad substrate disposed under the upper substrate and including bonding pads that electrically connect to the first and second electrode layers, respectively.
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公开(公告)号：US09319800B2
公开(公告)日：2016-04-19
申请号：US14317135
申请日：2014-06-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seog-woo Hong , Hyung-jae Shin , Dong-sik Shim , Byung-gil Jeong , Seok-whan Chung
CPC classification number: H04R23/00 , B06B1/0292 , B06B1/0685 , G10K11/002 , H04R2201/003
Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
Abstract translation: 一种电声换能器包括设置有至少一个电池和至少一个电极的导电衬底以及与该导电衬底相对设置并且设置有至少一个对应于该电极的焊盘的焊盘衬底，其中至少一个电极 电极和焊盘包括用于电连接的电图案和设置在电图案周围以分离电图案的至少一个虚设图案。
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Patent Agency Ranking
公开(公告)号：US09475092B2
公开(公告)日：2016-10-25
申请号：US14287556
申请日：2014-05-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-sik Shim , Seog-woo Hong , Seok-whan Chung , Chang-jung Kim
CPC classification number: B06B1/0292 , B81C1/00182 , Y10T29/49005
Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.
Abstract translation: 电声换能器包括：导电基板，其中形成有第一沟槽，并且包括由第一沟槽包围的电极连接单元; 设置在所述导电基板上的膜; 设置在所述膜上以与所述电极连接单元的上表面接触的上电极; 设置在所述导电基板的下表面上以接触所述电极连接单元的下表面的第一电极; 以及与所述第一电极间隔开并设置成与所述导电基板的下表面接触的第二电极。
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公开(公告)号：US09096418B2
公开(公告)日：2015-08-04
申请号：US14012350
申请日：2013-08-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seog-woo Hong , Dong-kyun Kim , Byung-gil Jeong , Seok-whan Chung
CPC classification number: B81B3/0027 , A61B8/4483 , B06B1/0292 , B06B2201/76 , B81C1/00158
Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer.
Abstract translation: 公开了一种超声换能器及其制造方法。 超声波换能器包括：第一电极层，其设置成覆盖导电基底;内壁和通孔的顶部穿透膜，并且具有与膜的顶表面相同高度的顶表面; 第二电极层，设置在与第一电极层间隔开的导电基板的底表面上; 以及顶部电极，其设置在所述膜的顶表面上并与所述第一电极层的顶表面接触。
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公开(公告)号：US10093534B2
公开(公告)日：2018-10-09
申请号：US15922972
申请日：2018-03-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-sik Shim , Seog-woo Hong , Seok-whan Chung , Chang-jung Kim
Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
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公开(公告)号：US09957155B2
公开(公告)日：2018-05-01
申请号：US14286460
申请日：2014-05-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-sik Shim , Seog-woo Hong , Seok-whan Chung , Chang-jung Kim
CPC classification number: B81B7/007 , B06B1/0292 , B81C1/00301
Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
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9.发明授权Capacitive micromachined ultrasonic transducer and method of fabricating the same 有权电容式微加工超声波换能器及其制造方法公开(公告)号：US09596528B2
公开(公告)日：2017-03-14
申请号：US14280725
申请日：2014-05-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-sik Shim , Seog-woo Hong , Seok-whan Chung , Chang-jung Kim
IPC: H04R1/00 , H01L21/768 , H01L21/304 , H01L23/48 , H01L21/02 , B06B1/02
CPC classification number: H04R1/00 , B06B1/0292 , H01L21/0237 , H01L21/3043 , H01L21/768 , H01L23/481 , H01L2924/0002 , H04R19/005 , H01L2924/00
Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.
Abstract translation: 一种电容微加工超声波换能器包括：器件基板，包括限定对应于多个元件的多个第一部分的第一沟槽和限制与多个第一部分分离的第二部分的第二沟槽;设置在器件基板上的支撑单元， 限制与所述多个元件中的每一个相对应的多个空腔;设置在所述支撑单元上以覆盖所述多个空腔的膜;设置在所述膜上并通过通孔电连接到所述第二沟槽中的所述第二部分的上电极 穿过膜和支撑单元，以及设置在器件衬底的下表面上的穿硅通孔（TSV）衬底，并且包括连接到多个第一部分的多个第一通孔金属和连接到多个第一通孔的第二通孔金属 到第二部分。
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